Chi-Hsin Chiu

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating electronic package
- Patent number 12,176,327
- Issue date Dec 24, 2024
- Siliconware Precision Industries Co., Ltd.
- Kong-Toon Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating electronic package
- Patent number 11,676,948
- Issue date Jun 13, 2023
- Siliconware Precision Industries Co., Ltd.
- Kong-Toon Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for fabricating the same
- Patent number 11,056,470
- Issue date Jul 6, 2021
- Siliconware Precision Industries Co., Ltd.
- Kong-Toon Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical testing method of interposer
- Patent number 10,950,507
- Issue date Mar 16, 2021
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating package structure
- Patent number 10,615,055
- Issue date Apr 7, 2020
- Siliconware Precision Industries Co., Ltd.
- Chi-Hsin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and fabrication method thereof
- Patent number 10,199,239
- Issue date Feb 5, 2019
- Siliconware Precision Industries Co., Ltd.
- Chi-Hsin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and electrical testing method thereof
- Patent number 9,991,178
- Issue date Jun 5, 2018
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabrication method thereof
- Patent number 9,520,304
- Issue date Dec 13, 2016
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure having MEMS element
- Patent number 9,254,994
- Issue date Feb 9, 2016
- Siliconware Precision Industries Co., Ltd.
- Chi-Hsin Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package structure having MEMS element
- Patent number 8,866,236
- Issue date Oct 21, 2014
- Siliconware Precision Industries Co., Ltd.
- Chi-Hsin Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fabrication method of package structure having MEMS element
- Patent number 8,716,070
- Issue date May 6, 2014
- Siliconware Precision Industries Co. Ltd.
- Chi-Hsin Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Inner-layer heat-dissipating board, multi-chip stack package struct...
- Patent number 8,520,391
- Issue date Aug 27, 2013
- Siliconware Precision Industries Co., Ltd.
- Huei-Nuan Huang
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Fabrication method of package structure having MEMS element
- Patent number 8,420,430
- Issue date Apr 16, 2013
- Siliconware Precision Industries Co., Ltd.
- Chi-Hsin Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20250046771
- Publication date Feb 6, 2025
- Siliconware Precision Industries Co., Ltd.
- Kong-Toon Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20230268328
- Publication date Aug 24, 2023
- Siliconware Precision Industries Co., Ltd.
- Kong-Toon Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20210296295
- Publication date Sep 23, 2021
- Siliconware Precision Industries Co., Ltd.
- Kong-Toon Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20200402965
- Publication date Dec 24, 2020
- Siliconware Precision Industries Co., Ltd.
- Kong-Toon Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating package structure
- Publication number 20190122898
- Publication date Apr 25, 2019
- Siliconware Precision Industries Co., Ltd.
- Chi-Hsin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL TESTING METHOD OF INTERPOSER
- Publication number 20180254227
- Publication date Sep 6, 2018
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20170148761
- Publication date May 25, 2017
- Siliconware Precision Industries Co., Ltd.
- Guang-Hwa Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20160079136
- Publication date Mar 17, 2016
- Siliconware Precision Industries Co., Ltd.
- Chi-Hsin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE HAVING MEMS ELEMENT
- Publication number 20150102433
- Publication date Apr 16, 2015
- Siliconware Precision Industries Co., Ltd.
- Chi-Hsin Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20150041969
- Publication date Feb 12, 2015
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20150035164
- Publication date Feb 5, 2015
- Siliconware Precision Industries Co., Ltd.
- Guang-Hwa Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20150035163
- Publication date Feb 5, 2015
- Siliconware Precision Industries Co., Ltd.
- Guang-Hwa Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING MULTI-CHIP STACK PACKAGE STRUCTURE HAVING INN...
- Publication number 20130326873
- Publication date Dec 12, 2013
- Siliconware Precision Industries Co., Ltd.
- Huei-Nuan Huang
- B82 - NANO-TECHNOLOGY
Information Patent Application
PACKAGING SUBSTRATE, SEMICONDUCTOR PACKAGE AND FABRICATION METHOD T...
- Publication number 20130256915
- Publication date Oct 3, 2013
- Siliconware Precision Industries Co., Ltd.
- Huei-Nuan Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND ELECTRICAL TESTING METHOD THEREOF
- Publication number 20130249589
- Publication date Sep 26, 2013
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF PACKAGE STRUCTURE HAVING MEMS ELEMENT
- Publication number 20130203200
- Publication date Aug 8, 2013
- Siliconware Precision Industries Co., Ltd.
- Chi-Hsin Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20130020709
- Publication date Jan 24, 2013
- Siliconware Precision Industries Co., Ltd.
- Chun-An Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INNER-LAYER HEAT-DISSIPATING BOARD, MULTI-CHIP STACK PACKAGE STRUCT...
- Publication number 20120224328
- Publication date Sep 6, 2012
- Siliconware Precision Industries Co., Ltd.
- Huei-Nuan Huang
- B82 - NANO-TECHNOLOGY
Information Patent Application
MULTI-CHIP STACK PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20120168936
- Publication date Jul 5, 2012
- Siliconware Precision Industries Co., Ltd.
- Pin-Cheng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP STACK STRUCTURE HAVING THROUGH SILICON VIA
- Publication number 20110227226
- Publication date Sep 22, 2011
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF PACKAGE STRUCTURE HAVING MEMS ELEMENT
- Publication number 20110177643
- Publication date Jul 21, 2011
- Siliconware Precision Industries Co., Ltd.
- Chi-Hsin Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGE STRUCTURE HAVING MEMS ELEMENT
- Publication number 20110175179
- Publication date Jul 21, 2011
- Siliconware Precision Industries Co., Ltd.
- Chi-Hsin Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Multi-chip stack structure having through silicon via and method fo...
- Publication number 20090032928
- Publication date Feb 5, 2009
- Siliconware Precision Industries Co., Ltd.
- Chiang-Cheng Chiang
- H01 - BASIC ELECTRIC ELEMENTS

Chi-Hsin Chiu

Person

Patents Grantslast 30 patents

Method for fabricating electronic package

Method for fabricating electronic package

Electronic package and method for fabricating the same

Electrical testing method of interposer

Method for fabricating package structure

Package structure and fabrication method thereof

Interposer and electrical testing method thereof

Semiconductor package and fabrication method thereof

Package structure having MEMS element

Package structure having MEMS element

Fabrication method of package structure having MEMS element

Inner-layer heat-dissipating board, multi-chip stack package struct...

Fabrication method of package structure having MEMS element

Patents Applicationslast 30 patents

METHOD FOR FABRICATING ELECTRONIC PACKAGE

METHOD FOR FABRICATING ELECTRONIC PACKAGE

METHOD FOR FABRICATING ELECTRONIC PACKAGE

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

Method for fabricating package structure

ELECTRICAL TESTING METHOD OF INTERPOSER

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

PACKAGE STRUCTURE HAVING MEMS ELEMENT

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

METHOD OF FABRICATING MULTI-CHIP STACK PACKAGE STRUCTURE HAVING INN...

PACKAGING SUBSTRATE, SEMICONDUCTOR PACKAGE AND FABRICATION METHOD T...

INTERPOSER AND ELECTRICAL TESTING METHOD THEREOF

FABRICATION METHOD OF PACKAGE STRUCTURE HAVING MEMS ELEMENT

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

INNER-LAYER HEAT-DISSIPATING BOARD, MULTI-CHIP STACK PACKAGE STRUCT...

MULTI-CHIP STACK PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

MULTI-CHIP STACK STRUCTURE HAVING THROUGH SILICON VIA

FABRICATION METHOD OF PACKAGE STRUCTURE HAVING MEMS ELEMENT

PACKAGE STRUCTURE HAVING MEMS ELEMENT

Multi-chip stack structure having through silicon via and method fo...