Chi-Lin Teng

Person

Taichung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device structure having air gap and methods of formin...
- Patent number 12,230,537
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Ya Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric capping structure overlying a conductive structure to in...
- Patent number 12,176,246
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide composite as etch stop layer
- Patent number 12,176,247
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interconnect structure for thermal management of electrical...
- Patent number 12,165,945
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and methods of forming the same
- Patent number 12,094,764
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with interconnect structure having a...
- Patent number 12,068,193
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnection structure and methods of forming the...
- Patent number 12,068,248
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having metallization layer with low capacitanc...
- Patent number 12,062,572
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Chin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 12,033,889
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with air gate spacer and air gate cap
- Patent number 12,027,606
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Chi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier and air-gap scheme for high performance interconnects
- Patent number 12,002,749
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capping layer overlying dielectric structure to increase reliability
- Patent number 11,990,400
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Ya Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having air gaps and method for manufacturin...
- Patent number 11,923,243
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor interconnection structure and methods of forming the...
- Patent number 11,854,963
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method making the same
- Patent number 11,830,808
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric capping structure overlying a conductive structure to in...
- Patent number 11,810,815
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interconnect structure for thermal management of electrical...
- Patent number 11,658,092
- Issue date May 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 11,557,511
- Issue date Jan 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure
- Patent number 11,538,749
- Issue date Dec 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,450,566
- Issue date Sep 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capping layer overlying dielectric structure to increase reliability
- Patent number 11,355,430
- Issue date Jun 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Ya Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method making the same
- Patent number 11,328,991
- Issue date May 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric capping structure overlying a conductive structure to in...
- Patent number 11,322,395
- Issue date May 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide composite as etch stop layer
- Patent number 11,315,828
- Issue date Apr 26, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with air gate spacer and air gate cap
- Patent number 11,302,798
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cheng-Chi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming interlayer dielectric material by spin-on metal oxide depos...
- Patent number 11,049,811
- Issue date Jun 29, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Lin Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,867,847
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method making the same
- Patent number 10,700,000
- Issue date Jun 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 10,211,097
- Issue date Feb 19, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming interlayer dielectric material by spin-on metal oxide depos...
- Patent number 10,163,797
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Lin Teng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECT STRUCTURE WITH LOW RC DELAY AND METHOD FOR MANUFACTURI...
- Publication number 20250149436
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gary LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL OXIDE COMPOSITE AS ETCH STOP LAYER
- Publication number 20250132197
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Feng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE
- Publication number 20250132247
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Lin TENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118598
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERCONNECT STRUCTURE FOR THERMAL MANAGEMENT OF ELECTRICAL...
- Publication number 20250046673
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240413010
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen Ju Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240379413
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING SELF-ALIGNED CONDUCTIVE STRUCTURE AN...
- Publication number 20240379435
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING THERMALLY CONDUCTIVE AIR GAP STRUCTURE...
- Publication number 20240379416
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ya LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE...
- Publication number 20240371764
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING METALLIZATION LAYER WITH LOW CAPACITANC...
- Publication number 20240363400
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH AIR GATE SPACER AND AIR GATE CAP
- Publication number 20240347625
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Chi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH INTERCONNECT STRUCTURE HAVING A...
- Publication number 20240347381
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240312835
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER & AIR-GAP SCHEME FOR HIGH PERFORMANCE INTERCONNECTS
- Publication number 20240304541
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPPING LAYER OVERLYING DIELECTRIC STRUCTURE TO INCREASE RELIABILITY
- Publication number 20240274524
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ya Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING LOW DIELECTRIC CAPACITANCE AND GOOD ELE...
- Publication number 20240234203
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ya LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING AIR GAPS AND METHOD FOR MANUFACTURIN...
- Publication number 20240162084
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE...
- Publication number 20240088023
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD MAKING THE SAME
- Publication number 20240088025
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE HAVING AIR GAP AND METHODS OF FORMIN...
- Publication number 20230386901
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ya LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC CAPPING STRUCTURE OVERLYING A CONDUCTIVE STRUCTURE TO IN...
- Publication number 20230377954
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING METALLIZATION LAYER WITH LOW CAPACITANC...
- Publication number 20230260831
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERCONNECT STRUCTURE FOR THERMAL MANAGEMENT OF ELECTRICAL...
- Publication number 20230253286
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230154789
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE HAVING AIR GAP AND METHODS OF FORMIN...
- Publication number 20230061501
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ya LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING THERMALLY CONDUCTIVE AIR GAP STRUCTURE...
- Publication number 20230065583
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Ya LO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20230066861
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING AIR GAPS AND METHOD FOR MANUFACTURIN...
- Publication number 20230068760
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsin-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING SELF-ALIGNED CONDUCTIVE STRUCTURE AN...
- Publication number 20230063438
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shao-Kuan LEE
- H01 - BASIC ELECTRIC ELEMENTS

Chi-Lin Teng

Person

Patents Grantslast 30 patents

Semiconductor device structure having air gap and methods of formin...

Dielectric capping structure overlying a conductive structure to in...

Metal oxide composite as etch stop layer

Thermal interconnect structure for thermal management of electrical...

Interconnect structure and methods of forming the same

Semiconductor device structure with interconnect structure having a...

Semiconductor interconnection structure and methods of forming the...

Semiconductor device having metallization layer with low capacitanc...

Semiconductor device structure and methods of forming the same

Semiconductor devices with air gate spacer and air gate cap

Barrier and air-gap scheme for high performance interconnects

Capping layer overlying dielectric structure to increase reliability

Semiconductor structure having air gaps and method for manufacturin...

Semiconductor interconnection structure and methods of forming the...

Semiconductor structure and method making the same

Dielectric capping structure overlying a conductive structure to in...

Thermal interconnect structure for thermal management of electrical...

Semiconductor device structure and methods of forming the same

Interconnect structure

Semiconductor device and manufacturing method thereof

Capping layer overlying dielectric structure to increase reliability

Semiconductor structure and method making the same

Dielectric capping structure overlying a conductive structure to in...

Metal oxide composite as etch stop layer

Semiconductor devices with air gate spacer and air gate cap

Forming interlayer dielectric material by spin-on metal oxide depos...

Semiconductor device and manufacturing method thereof

Semiconductor structure and method making the same

Semiconductor device and manufacturing method thereof

Forming interlayer dielectric material by spin-on metal oxide depos...

Patents Applicationslast 30 patents

INTERCONNECT STRUCTURE WITH LOW RC DELAY AND METHOD FOR MANUFACTURI...

METAL OXIDE COMPOSITE AS ETCH STOP LAYER

INTERCONNECTION STRUCTURE

INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF

THERMAL INTERCONNECT STRUCTURE FOR THERMAL MANAGEMENT OF ELECTRICAL...

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE HAVING SELF-ALIGNED CONDUCTIVE STRUCTURE AN...

SEMICONDUCTOR DEVICE HAVING THERMALLY CONDUCTIVE AIR GAP STRUCTURE...

SEMICONDUCTOR INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE...

SEMICONDUCTOR DEVICE HAVING METALLIZATION LAYER WITH LOW CAPACITANC...

SEMICONDUCTOR DEVICES WITH AIR GATE SPACER AND AIR GATE CAP

SEMICONDUCTOR DEVICE STRUCTURE WITH INTERCONNECT STRUCTURE HAVING A...

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

BARRIER & AIR-GAP SCHEME FOR HIGH PERFORMANCE INTERCONNECTS

CAPPING LAYER OVERLYING DIELECTRIC STRUCTURE TO INCREASE RELIABILITY

SEMICONDUCTOR DEVICE HAVING LOW DIELECTRIC CAPACITANCE AND GOOD ELE...

SEMICONDUCTOR STRUCTURE HAVING AIR GAPS AND METHOD FOR MANUFACTURIN...

SEMICONDUCTOR INTERCONNECTION STRUCTURE AND METHODS OF FORMING THE...

SEMICONDUCTOR STRUCTURE AND METHOD MAKING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE HAVING AIR GAP AND METHODS OF FORMIN...

DIELECTRIC CAPPING STRUCTURE OVERLYING A CONDUCTIVE STRUCTURE TO IN...

SEMICONDUCTOR DEVICE HAVING METALLIZATION LAYER WITH LOW CAPACITANC...

THERMAL INTERCONNECT STRUCTURE FOR THERMAL MANAGEMENT OF ELECTRICAL...

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE STRUCTURE HAVING AIR GAP AND METHODS OF FORMIN...

SEMICONDUCTOR DEVICE HAVING THERMALLY CONDUCTIVE AIR GAP STRUCTURE...

INTERCONNECT STRUCTURE AND METHODS OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE HAVING AIR GAPS AND METHOD FOR MANUFACTURIN...

SEMICONDUCTOR STRUCTURE HAVING SELF-ALIGNED CONDUCTIVE STRUCTURE AN...