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Chi S. Chang
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Wappingers Falls, NY, US
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Patents Grants
last 30 patents
Information
Patent Grant
Wafer-to-wafer stacking
Patent number
7,948,072
Issue date
May 24, 2011
Industrial Technology Research Institute
Ra-Min Tain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package with solder-filled via holes in molding layers
Patent number
7,667,338
Issue date
Feb 23, 2010
Paul T. Lin
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Probe pad structure in a ceramic space transformer
Patent number
7,374,811
Issue date
May 20, 2008
SV Probe Pte. Ltd.
Chi Shih Chang
G01 - MEASURING TESTING
Information
Patent Grant
Placement of sacrificial solder balls underneath the PBGA substrate
Patent number
7,227,268
Issue date
Jun 5, 2007
International Business Machines Corporation
Chi Shih Chang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Placement of sacrificial solder balls underneath the PBGA substrate
Patent number
6,829,149
Issue date
Dec 7, 2004
International Business Machines Corporation
Chi Shih Chang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Proper choice of the encapsulant volumetric CTE for different PGBA...
Patent number
6,353,182
Issue date
Mar 5, 2002
International Business Machines Corporation
Chi Shih Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Relocating the neutral plane in a PBGA substrate to eliminate chip...
Patent number
6,255,599
Issue date
Jul 3, 2001
IBM
Chi Shih Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Transformer formed in conjunction with printed circuit board
Patent number
6,188,305
Issue date
Feb 13, 2001
International Business Machines Corporation
Chi Shih Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for making planar redistribution structure
Patent number
6,000,130
Issue date
Dec 14, 1999
International Business Machines Corporation
Chi Shih Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Construction of PBGA substrate for flip chip packing
Patent number
5,959,348
Issue date
Sep 28, 1999
International Business Machines Corporation
Chi Shih Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Planar redistribution structure and printed wiring device
Patent number
5,774,340
Issue date
Jun 30, 1998
International Business Machines Corporation
Chi Shih Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System for extending operating time of a battery-operated electroni...
Patent number
5,684,392
Issue date
Nov 4, 1997
International Business Machines Corporation
Chi Shih Chang
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Method and apparatus for the cross-sectional design of multi-layer...
Patent number
5,546,321
Issue date
Aug 13, 1996
International Business Machines Corporation
Chi S. Chang
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Method and apparatus for the cross-sectional design of multi-layer...
Patent number
5,519,633
Issue date
May 21, 1996
International Business Machines Corporation
Chi S. Chang
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
High density connector
Patent number
5,248,262
Issue date
Sep 28, 1993
International Business Machines Corporation
Raymond A. Busacco
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density circuit board and method of making same
Patent number
5,191,174
Issue date
Mar 2, 1993
International Business Machines Corporation
Chi S. Chang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Master image chip organization technique or method
Patent number
T106201
Issue date
Mar 4, 1986
John Balyoz
029 - Metal working
Information
Patent Grant
Master image chip organization technique or method
Patent number
4,295,149
Issue date
Oct 13, 1981
International Business Machines Corporation
John Balyoz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
LSI Semiconductor device and fabrication thereof
Patent number
4,249,193
Issue date
Feb 3, 1981
International Business Machines Corporation
John Balyoz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having electrically insulating barriers for su...
Patent number
3,961,355
Issue date
Jun 1, 1976
International Business Machines Corporation
Shakir A. Abbas
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Wafer-To-Wafer Stacking
Publication number
20100020502
Publication date
Jan 28, 2010
Industrial Technology Research Institute
Ra-Min Tain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package with solder-filled via holes in molding layers
Publication number
20080036050
Publication date
Feb 14, 2008
Paul T. Lin
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Application
Probe pad structure in a ceramic space transformer
Publication number
20060257631
Publication date
Nov 16, 2006
Chi Shih Chang
G01 - MEASURING TESTING
Information
Patent Application
Placement of sacrificial solder balls underneath the PBGA substrate
Publication number
20050063165
Publication date
Mar 24, 2005
Chi Shih Chang
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...