Chi-Tsung CHIU

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package structure having a lead frame and a passive c...
- Patent number 12,033,923
- Issue date Jul 9, 2024
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 11,728,252
- Issue date Aug 15, 2023
- Advanced Semiconductor Engineering, Inc.
- Hui Hua Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,133,245
- Issue date Sep 28, 2021
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,127,707
- Issue date Sep 21, 2021
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,037,868
- Issue date Jun 15, 2021
- Advanced Semiconductor Engineering, Inc.
- Hui Hua Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 10,707,157
- Issue date Jul 7, 2020
- Advanced Semiconductor Engineering, Inc.
- Hui Hua Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 10,615,105
- Issue date Apr 7, 2020
- Advanced Semiconductor Engineering, Inc.
- Hui Hua Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,186,467
- Issue date Jan 22, 2019
- Advanced Semiconductor Engineering, Inc.
- Bernd Karl Appelt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 10,083,888
- Issue date Sep 25, 2018
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 9,991,193
- Issue date Jun 5, 2018
- Advanced Semiconductor Engineering, Inc.
- Kay Stefan Essig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of making the same
- Patent number 9,564,393
- Issue date Feb 7, 2017
- Advanced Semiconductor Engineering, Inc.
- Chih-Yi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having aperture antenna
- Patent number 9,172,131
- Issue date Oct 27, 2015
- Advanced Semiconductor Engineering, Inc.
- Chi-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages having a side-by-side device arrangem...
- Patent number 9,171,792
- Issue date Oct 27, 2015
- Advanced Semiconductor Engineering, Inc.
- Yu-Ching Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor transformer device and method for manufacturing the same
- Patent number 8,963,671
- Issue date Feb 24, 2015
- Advanced Semiconductor Engineering, Inc.
- Chi-Han Chen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
EMI-shielded semiconductor devices and methods of making
- Patent number 8,653,634
- Issue date Feb 18, 2014
- Advanced Semiconductor Engineering, Inc.
- Chi Tsung Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device packages with electromagnetic interference shi...
- Patent number 8,653,633
- Issue date Feb 18, 2014
- Advanced Semiconductor Engineering, Inc.
- Kuo-Hsien Liao
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Band pass filter
- Patent number 8,502,623
- Issue date Aug 6, 2013
- Advanced Semiconductor Engineering, Inc.
- Pao-Nan Lee
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor element having a conductive via and method for making...
- Patent number 8,486,829
- Issue date Jul 16, 2013
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level semiconductor device packages with electromagnetic inte...
- Patent number 8,378,466
- Issue date Feb 19, 2013
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package having the same
- Patent number 8,368,202
- Issue date Feb 5, 2013
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element having a conductive via and method for making...
- Patent number 8,350,361
- Issue date Jan 8, 2013
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages with electromagnetic interference shi...
- Patent number 8,350,367
- Issue date Jan 8, 2013
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages with electromagnetic interference shi...
- Patent number 8,212,339
- Issue date Jul 3, 2012
- Advanced Semiconductor Engineering, Inc.
- Kuo-Hsien Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate and method for fabricating inductive circuit
- Patent number 8,049,116
- Issue date Nov 1, 2011
- Advanced Semiconductor Engineering, Inc.
- Pao-Nan Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device packages with electromagnetic interference shi...
- Patent number 8,022,511
- Issue date Sep 20, 2011
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages with electromagnetic interference shi...
- Patent number 7,989,928
- Issue date Aug 2, 2011
- Advanced Semiconductor Engineering Inc.
- Kuo-Hsien Liao
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor package having an antenna on the molding compound the...
- Patent number 7,944,038
- Issue date May 17, 2011
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package having flexible circuit board therein
- Patent number 7,932,591
- Issue date Apr 26, 2011
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung Chiu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electronic package
- Patent number 7,586,184
- Issue date Sep 8, 2009
- Advanced Semiconductor Engineering, Inc.
- Chih Pin Hung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure of package on package and method for fabricating the same
- Patent number 7,550,836
- Issue date Jun 23, 2009
- Advanced Semiconductor Engineering, Inc.
- Che-Ya Chou
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20220084914
- Publication date Mar 17, 2022
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210125911
- Publication date Apr 29, 2021
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210020594
- Publication date Jan 21, 2021
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20200243427
- Publication date Jul 30, 2020
- Advanced Semiconductor Engineering, Inc.
- Hui Hua LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20200194356
- Publication date Jun 18, 2020
- Advanced Semiconductor Engineering, Inc.
- Hui Hua LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20200194327
- Publication date Jun 18, 2020
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20190122969
- Publication date Apr 25, 2019
- Advanced Semiconductor Engineering, Inc.
- Hui Hua LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20180358276
- Publication date Dec 13, 2018
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180019221
- Publication date Jan 18, 2018
- Advanced Semiconductor Engineering, Inc.
- Bernd Karl APPELT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20170365543
- Publication date Dec 21, 2017
- Advanced Semiconductor Engineering, Inc.
- Hui Hua LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20170365542
- Publication date Dec 21, 2017
- Advanced Semiconductor Engineering, Inc.
- Kay Stefan ESSIG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE
- Publication number 20170148746
- Publication date May 25, 2017
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING APERTURE ANTENNA
- Publication number 20140266947
- Publication date Sep 18, 2014
- Chi-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR TRANSFORMER DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140062641
- Publication date Mar 6, 2014
- Advanced Semiconductor Engineering, Inc.
- Chi-Han Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI-SHIELDED SEMICONDUCTOR DEVICES AND METHODS OF MAKING
- Publication number 20130328176
- Publication date Dec 12, 2013
- Chi Tsung Chiu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Element Having a Conductive Via and Method for Making...
- Publication number 20130109178
- Publication date May 2, 2013
- Chi-Tsung Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES HAVING A SIDE-BY-SIDE DEVICE ARRANGEM...
- Publication number 20120217642
- Publication date Aug 30, 2012
- Yu-Ching Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device And Semiconductor Package Having The Same
- Publication number 20120126417
- Publication date May 24, 2012
- Chi-Tsung Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES WITH ELECTROMAGNETIC INTERFERENCE SHI...
- Publication number 20110260301
- Publication date Oct 27, 2011
- Kuo-Hsien Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-Level Semiconductor Device Packages with Electromagnetic Inte...
- Publication number 20110115060
- Publication date May 19, 2011
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Element Having a Conductive Via and Method for Making...
- Publication number 20110068437
- Publication date Mar 24, 2011
- Chi-Tsung Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED LC RESONATOR AND BANDPASS FILTER OF USING THE SAME
- Publication number 20100265009
- Publication date Oct 21, 2010
- NATIONAL SUN YAT-SEN UNIVERSITY
- Tzyy-Sheng Horng
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES WITH ELECTROMAGNETIC INTERFERENCE SHI...
- Publication number 20100207259
- Publication date Aug 19, 2010
- Advanced Semiconductor Engineering, Inc.
- Kuo-Hsien Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate of window ball grid array package
- Publication number 20100071939
- Publication date Mar 25, 2010
- Hung-Hsiang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BAND PASS FILTER
- Publication number 20100007438
- Publication date Jan 14, 2010
- Advanced Semiconductor Engineering, Inc.
- Pao-Nan Lee
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Semiconductor package having an antenna
- Publication number 20090289343
- Publication date Nov 26, 2009
- Chi-Tsung Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES WITH ELECTROMAGNETIC INTERFERENCE SHI...
- Publication number 20090256244
- Publication date Oct 15, 2009
- Kuo-Hsien Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES WITH ELECTROMAGNETIC INTERFERENCE SHI...
- Publication number 20090194851
- Publication date Aug 6, 2009
- Chi-Tsung Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES WITH ELECTROMAGNETIC INTERFERENCE SHI...
- Publication number 20090194852
- Publication date Aug 6, 2009
- Chi-Tsung Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT SUBSTRATE AND METHOD FOR FABRICATING INDUCTIVE CIRCUIT
- Publication number 20090025964
- Publication date Jan 29, 2009
- Advanced Semiconductor Engineering, Inc.
- Pao-Nan Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Chi-Tsung CHIU

Person

Patents Grantslast 30 patents

Semiconductor package structure having a lead frame and a passive c...

Semiconductor device package

Semiconductor package structure and method for manufacturing the same

Semiconductor package structure and method for manufacturing the same

Semiconductor device package and method of manufacturing the same

Semiconductor device package

Semiconductor device package and method of manufacturing the same

Semiconductor package device and method of manufacturing the same

Semiconductor device package

Semiconductor device package

Semiconductor device package and method of making the same

Semiconductor structure having aperture antenna

Semiconductor device packages having a side-by-side device arrangem...

Semiconductor transformer device and method for manufacturing the same

EMI-shielded semiconductor devices and methods of making

Semiconductor device packages with electromagnetic interference shi...

Band pass filter

Semiconductor element having a conductive via and method for making...

Wafer-level semiconductor device packages with electromagnetic inte...

Semiconductor device and semiconductor package having the same

Semiconductor element having a conductive via and method for making...

Semiconductor device packages with electromagnetic interference shi...

Semiconductor device packages with electromagnetic interference shi...

Circuit substrate and method for fabricating inductive circuit

Semiconductor device packages with electromagnetic interference shi...

Semiconductor device packages with electromagnetic interference shi...

Semiconductor package having an antenna on the molding compound the...

Stacked semiconductor package having flexible circuit board therein

Electronic package

Structure of package on package and method for fabricating the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR STRUCTURE HAVING APERTURE ANTENNA

SEMICONDUCTOR TRANSFORMER DEVICE AND METHOD FOR MANUFACTURING THE SAME

EMI-SHIELDED SEMICONDUCTOR DEVICES AND METHODS OF MAKING

Semiconductor Element Having a Conductive Via and Method for Making...

SEMICONDUCTOR DEVICE PACKAGES HAVING A SIDE-BY-SIDE DEVICE ARRANGEM...

Semiconductor Device And Semiconductor Package Having The Same

SEMICONDUCTOR DEVICE PACKAGES WITH ELECTROMAGNETIC INTERFERENCE SHI...

Wafer-Level Semiconductor Device Packages with Electromagnetic Inte...

Semiconductor Element Having a Conductive Via and Method for Making...

STACKED LC RESONATOR AND BANDPASS FILTER OF USING THE SAME

SEMICONDUCTOR DEVICE PACKAGES WITH ELECTROMAGNETIC INTERFERENCE SHI...

Substrate of window ball grid array package

BAND PASS FILTER

Semiconductor package having an antenna

SEMICONDUCTOR DEVICE PACKAGES WITH ELECTROMAGNETIC INTERFERENCE SHI...

SEMICONDUCTOR DEVICE PACKAGES WITH ELECTROMAGNETIC INTERFERENCE SHI...

SEMICONDUCTOR DEVICE PACKAGES WITH ELECTROMAGNETIC INTERFERENCE SHI...

CIRCUIT SUBSTRATE AND METHOD FOR FABRICATING INDUCTIVE CIRCUIT