Chi-Wei Chung

Person

Douliou City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Video-audio playing system relating to 2-view application and metho...
- Patent number 8,537,207
- Issue date Sep 17, 2013
- Au Optronics Corporation
- Chih-Chang Shih
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for achieving uniform CU CMP polishing
- Patent number 7,153,197
- Issue date Dec 26, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsu Shih
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing process with reduced defects in a cop...
- Patent number 6,946,397
- Issue date Sep 20, 2005
- Taiwan Semiconductor Manufacturing Company, Ltd.
- William Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polisher equipped with chilled retaining ring a...
- Patent number 6,686,284
- Issue date Feb 3, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chi-Wei Chung
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
ZIG-ZAG SIGNAL SHIELDING FOR PIXEL ARRAY
- Publication number 20240339467
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsien Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL WITH DUAL-PD LAYOUT
- Publication number 20240290810
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsien Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR INTEGRATED CHIP STRUCTURE
- Publication number 20240290811
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsien Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240250098
- Publication date Jul 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsien Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CMOS IMAGE SENSOR
- Publication number 20240072090
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsien Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-SPEED READOUT IMAGE SENSOR
- Publication number 20240014245
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsien Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED CMOS IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230411431
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsien Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED IMAGE SENSORS AND METHODS OF MANUFACTURING THEREOF
- Publication number 20230299109
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Hsien Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERACTIVE COMMUNICATION SYSTEM, METHOD AND WEARABLE DEVICE THEREFOR
- Publication number 20170280412
- Publication date Sep 28, 2017
- Chiun Mai Communication Systems, Inc.
- YI-CHENG CHEN
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
VIDEO-AUDIO PLAYING SYSTEM RELATING TO 2-VIEW APPLICATION AND METHO...
- Publication number 20120281144
- Publication date Nov 8, 2012
- AU OPTRONICS CORPORATION
- Chih-Chang Shih
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Copper CMP defect reduction by extra slurry polish
- Publication number 20050106872
- Publication date May 19, 2005
- Taiwan Semiconductor Manufacturing Co.
- William Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to reduce dishing, erosion and low-k dielectric peeling for...
- Publication number 20040137740
- Publication date Jul 15, 2004
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Chi-Wei Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for achieving uniform CU CMP polishing
- Publication number 20030211814
- Publication date Nov 13, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsu Shih
- B24 - GRINDING POLISHING
Information Patent Application
Chemical mechanical polisher equipped with chilled retaining ring a...
- Publication number 20030148615
- Publication date Aug 7, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Wei Chung
- B24 - GRINDING POLISHING

Chi-Wei Chung

Person

Patents Grantslast 30 patents

Video-audio playing system relating to 2-view application and metho...

Method for achieving uniform CU CMP polishing

Chemical mechanical polishing process with reduced defects in a cop...

Chemical mechanical polisher equipped with chilled retaining ring a...

Patents Applicationslast 30 patents

ZIG-ZAG SIGNAL SHIELDING FOR PIXEL ARRAY

PIXEL WITH DUAL-PD LAYOUT

IMAGE SENSOR INTEGRATED CHIP STRUCTURE

IMAGE SENSOR DEVICE AND METHOD OF MANUFACTURING THE SAME

STACKED CMOS IMAGE SENSOR

HIGH-SPEED READOUT IMAGE SENSOR

STACKED CMOS IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME

STACKED IMAGE SENSORS AND METHODS OF MANUFACTURING THEREOF

INTERACTIVE COMMUNICATION SYSTEM, METHOD AND WEARABLE DEVICE THEREFOR

VIDEO-AUDIO PLAYING SYSTEM RELATING TO 2-VIEW APPLICATION AND METHO...

Copper CMP defect reduction by extra slurry polish

Method to reduce dishing, erosion and low-k dielectric peeling for...

Method for achieving uniform CU CMP polishing

Chemical mechanical polisher equipped with chilled retaining ring a...