TREA

Chia-Ken Leong

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  • Fremont, CA, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Chip package with channel stiffener frame
    • Patent number 8,405,187
    • Issue date Mar 26, 2013
    • GLOBALFOUNDRIES Inc.
    • Eric Tosaya
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor chip package with stiffener frame and configured lid
    • Patent number 8,216,887
    • Issue date Jul 10, 2012
    • Advanced Micro Devices, Inc.
    • Stephen F. Heng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Circuit package lid
    • Patent number D658607
    • Issue date May 1, 2012
    • Advanced Micro Devices, Inc.
    • Stephen Heng
    • D13 - Equipment for production, distribution, or transformation of energy
  • Information Patent Grant

    Chip package with channel stiffener frame
    • Patent number 8,008,133
    • Issue date Aug 30, 2011
    • GLOBALFOUNDRIES Inc.
    • Eric Tosaya
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Circuit package lid
    • Patent number D641720
    • Issue date Jul 19, 2011
    • Advanced Micro Devices, Inc.
    • Stephen Heng
    • D13 - Equipment for production, distribution, or transformation of energy

Patents Applicationslast 30 patents