Chia-Lin Ku

Person

Chu-Pei City, Hsin-Chu County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Powder-atomic-layer-deposition device with knocker
- Patent number 12,123,092
- Issue date Oct 22, 2024
- SKY TECH INC.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer deposition apparatus for powders
- Patent number 12,031,208
- Issue date Jul 9, 2024
- SKY TECH INC.
- Jing-Cheng Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Atomic layer deposition apparatus for coating on fine powders
- Patent number 12,006,571
- Issue date Jun 11, 2024
- SKY TECH INC.
- Jing-Cheng Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Powder atomic layer deposition apparatus for blowing powders
- Patent number 11,987,883
- Issue date May 21, 2024
- SKY TECH INC.
- Jing-Cheng Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Powder atomic layer deposition equipment with quick release function
- Patent number 11,952,662
- Issue date Apr 9, 2024
- SKY TECH INC.
- Jing-Cheng Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Detachable atomic layer deposition apparatus for powders
- Patent number 11,767,591
- Issue date Sep 26, 2023
- SKY TECH INC.
- Jing-Cheng Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Atomic layer deposition apparatus for coating on fine powders
- Patent number 11,739,423
- Issue date Aug 29, 2023
- SKY TECH INC.
- Jing-Cheng Lin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
System for real traffic replay over wireless networks
- Patent number 8,938,535
- Issue date Jan 20, 2015
- National Chiao Tung University
- Ying-Dar Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Frame-merging apparatus and method
- Patent number 8,605,749
- Issue date Dec 10, 2013
- Realtek Semiconductor Corp.
- Tsung-Hsien Yang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Channel utilizing method and system for wireless networks
- Patent number 8,243,748
- Issue date Aug 14, 2012
- Realtek Semiconductor Corp.
- Chia-Yu Ku
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for forming an oxynitride layer
- Patent number 6,764,962
- Issue date Jul 20, 2004
- ProMos Technologies, Inc.
- Yung-Hsien Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an arsenic doped dielectric layer
- Patent number 6,323,137
- Issue date Nov 27, 2001
- ProMOS Technologies
- Feng-Wei Ku
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for reducing intensity of reflected rays encountered during...
- Patent number 6,171,764
- Issue date Jan 9, 2001
- Chia-Lin Ku
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Additional buffer layer for eliminating ozone/tetraethylorthosilica...
- Patent number 6,156,597
- Issue date Dec 5, 2000
- ProMOS Technologies, Inc.
- Wen-Ping Yen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWDER ATOMIC LAYER DEPOSITION EQUIPMENT WITH QUICK RELEASE FUNCTION
- Publication number 20230120393
- Publication date Apr 20, 2023
- SKY TECH INC.
- JING-CHENG LIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
URSP ENHANCEMENT FOR EPS
- Publication number 20230112434
- Publication date Apr 13, 2023
- MEDIATEK INC.
- Chien-Chun Huang-Fu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ENHANCEMENT OF URSP ASSOCIATION
- Publication number 20230052670
- Publication date Feb 16, 2023
- Chien-Chun Huang-Fu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
POWDER-ATOMIC-LAYER-DEPOSITION DEVICE WITH KNOCKER
- Publication number 20220341036
- Publication date Oct 27, 2022
- SKY TECH INC.
- JING-CHENG LIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
POWDER ATOMIC LAYER DEPOSITION APPARATUS WITH SPECIAL COVER LID
- Publication number 20220162750
- Publication date May 26, 2022
- SKY TECH INC.
- JING-CHENG LIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
POWDER ATOMIC LAYER DEPOSITION APPARATUS FOR BLOWING POWDERS
- Publication number 20220136103
- Publication date May 5, 2022
- SKY TECH INC.
- JING-CHENG LIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ATOMIC LAYER DEPOSITION APPARATUS FOR POWDERS
- Publication number 20220106682
- Publication date Apr 7, 2022
- SKY TECH INC.
- JING-CHENG LIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ATOMIC LAYER DEPOSITION APPARATUS FOR COATING ON FINE POWDERS
- Publication number 20220106685
- Publication date Apr 7, 2022
- SKY TECH INC.
- JING-CHENG LIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DETACHABLE ATOMIC LAYER DEPOSITION APPARATUS FOR POWDERS
- Publication number 20220106686
- Publication date Apr 7, 2022
- SKY TECH INC.
- JING-CHENG LIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ATOMIC LAYER DEPOSITION APPARATUS FOR COATING ON FINE POWDERS
- Publication number 20220106684
- Publication date Apr 7, 2022
- SKY TECH INC.
- JING-CHENG LIN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEM FOR REAL TRAFFIC REPLAY OVER WIRELESS NETWORKS
- Publication number 20130326052
- Publication date Dec 5, 2013
- National Chiao Tung University
- Ying-Dar Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
FRAME-MERGING APPARATUS AND METHOD
- Publication number 20100142555
- Publication date Jun 10, 2010
- Tsung-Hsien YANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CHANNEL UTILIZING METHOD AND SYSTEM FOR WIRELESS NETWORKS
- Publication number 20090290551
- Publication date Nov 26, 2009
- Realtek Semiconductor Corp.
- Chia-Yu Ku
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD OF FABRICATING NON-VOLATILE MEMORY
- Publication number 20070249121
- Publication date Oct 25, 2007
- Chien-Kang Kao
- B82 - NANO-TECHNOLOGY
Information Patent Application
Method for forming an oxynitride layer
- Publication number 20030077915
- Publication date Apr 24, 2003
- Yung-Hsien Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of monitoring ultra-thin nitride quality by wet re-oxidation
- Publication number 20030001243
- Publication date Jan 2, 2003
- Yung-Hsien Wu
- G01 - MEASURING TESTING

Chia-Lin Ku

Person

Patents Grantslast 30 patents

Powder-atomic-layer-deposition device with knocker

Atomic layer deposition apparatus for powders

Atomic layer deposition apparatus for coating on fine powders

Powder atomic layer deposition apparatus for blowing powders

Powder atomic layer deposition equipment with quick release function

Detachable atomic layer deposition apparatus for powders

Atomic layer deposition apparatus for coating on fine powders

System for real traffic replay over wireless networks

Frame-merging apparatus and method

Channel utilizing method and system for wireless networks

Method for forming an oxynitride layer

Method for forming an arsenic doped dielectric layer

Method for reducing intensity of reflected rays encountered during...

Additional buffer layer for eliminating ozone/tetraethylorthosilica...

Patents Applicationslast 30 patents

POWDER ATOMIC LAYER DEPOSITION EQUIPMENT WITH QUICK RELEASE FUNCTION

URSP ENHANCEMENT FOR EPS

ENHANCEMENT OF URSP ASSOCIATION

POWDER-ATOMIC-LAYER-DEPOSITION DEVICE WITH KNOCKER

POWDER ATOMIC LAYER DEPOSITION APPARATUS WITH SPECIAL COVER LID

POWDER ATOMIC LAYER DEPOSITION APPARATUS FOR BLOWING POWDERS

ATOMIC LAYER DEPOSITION APPARATUS FOR POWDERS

ATOMIC LAYER DEPOSITION APPARATUS FOR COATING ON FINE POWDERS

DETACHABLE ATOMIC LAYER DEPOSITION APPARATUS FOR POWDERS

ATOMIC LAYER DEPOSITION APPARATUS FOR COATING ON FINE POWDERS

SYSTEM FOR REAL TRAFFIC REPLAY OVER WIRELESS NETWORKS

FRAME-MERGING APPARATUS AND METHOD

CHANNEL UTILIZING METHOD AND SYSTEM FOR WIRELESS NETWORKS

METHOD OF FABRICATING NON-VOLATILE MEMORY

Method for forming an oxynitride layer

Method of monitoring ultra-thin nitride quality by wet re-oxidation