Chieh Lung Lai

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing electronic package
- Patent number 11,081,415
- Issue date Aug 3, 2021
- Siliconware Precision Industries Co., Ltd.
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for manufacturing the same
- Patent number 10,679,914
- Issue date Jun 9, 2020
- Siliconware Precision Industries Co., Ltd.
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating electronic package
- Patent number 10,403,570
- Issue date Sep 3, 2019
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating packaging structure
- Patent number 10,403,596
- Issue date Sep 3, 2019
- Siliconware Precision Indsutries Co., Ltd.
- Hsien-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for fabricating the same
- Patent number 10,128,178
- Issue date Nov 13, 2018
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and semiconductor substrate
- Patent number 9,899,309
- Issue date Feb 20, 2018
- Siliconware Precision Industries Co., Ltd.
- Shih-Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package, semiconductor substrate of the electronic packa...
- Patent number 9,831,191
- Issue date Nov 28, 2017
- Siliconware Precision Industries Co., Ltd.
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure with first and second conductive bumps having d...
- Patent number 9,515,039
- Issue date Dec 6, 2016
- Siliconware Precision Industries Co., Ltd.
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for fabricating the same
- Patent number 9,502,335
- Issue date Nov 22, 2016
- Siliconware Precision Industries Co., Ltd.
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-bonded LED
- Patent number 8,716,737
- Issue date May 6, 2014
- Industrial Technology Research Institute
- Hsiu Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED package structure and fabrication method thereof
- Patent number 8,471,284
- Issue date Jun 25, 2013
- Siliconware Precision Industries Co., Ltd.
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED module and packaging method thereof
- Patent number 8,235,551
- Issue date Aug 7, 2012
- Industrial Technology Research Institute
- Jian-Shian Lin
- F21 - LIGHTING
Information Patent Grant
Die-bonding method of LED chip and LED manufactured by the same
- Patent number 8,236,687
- Issue date Aug 7, 2012
- Industrial Technology Research Institute
- Hsiu-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light source device
- Patent number 7,717,587
- Issue date May 18, 2010
- Industrial Technology Research Institute
- Jian-Shian Lin
- F21 - LIGHTING
Information Patent Grant
Lamp fixture
- Patent number 7,575,344
- Issue date Aug 18, 2009
- Industrial Technology Research Institute
- Jian-Shian Lin
- F21 - LIGHTING
Information Patent Grant
Reflective illumination device
- Patent number 7,530,712
- Issue date May 12, 2009
- Industrial Technology Research Institute
- Jian-Shian Lin
- F21 - LIGHTING
Information Patent Grant
Artificial cultivating room and method for cultivating plants
- Patent number 6,279,263
- Issue date Aug 28, 2001
- Chieh-Chou Lai
- A01 - AGRICULTURE FORESTRY ANIMAL HUSBANDRY HUNTING TRAPPING FISHING

Patents Applicationslast 30 patents

Information Patent Application
WET PROCESS AIR ABATEMENT SYSTEM AND METHOD
- Publication number 20250235815
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Chih-Ming Tsao
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING STRESS CONTROL LAYER AND METHODS OF...
- Publication number 20240413034
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDING BARRIER LAYER IN FINE-PITCH BOND STRUCTURES
- Publication number 20240387341
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE DIE STRUCTURE AND METHOD OF FABRICATING THEREOF
- Publication number 20240087902
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chieh-Lung LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20240079356
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redistribution Structure with Warpage Tuning Layer
- Publication number 20240063083
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC PACKAGE
- Publication number 20200258802
- Publication date Aug 13, 2020
- Siliconware Precision Industries Co., Ltd.
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20190043798
- Publication date Feb 7, 2019
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180254232
- Publication date Sep 6, 2018
- Siliconware Precision Industries Co., Ltd.
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING PACKAGING STRUCTURE
- Publication number 20180233478
- Publication date Aug 16, 2018
- Siliconware Precision Industries Co., Ltd.
- Hsien-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20170338173
- Publication date Nov 23, 2017
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND SEMICONDUCTOR SUBSTRATE
- Publication number 20170256481
- Publication date Sep 7, 2017
- Siliconware Precision Industries Co., Ltd.
- Shih-Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE, SEMICONDUCTOR SUBSTRATE OF THE ELECTRONIC PACKA...
- Publication number 20170243834
- Publication date Aug 24, 2017
- Siliconware Precision Industries Co., Ltd.
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE WITH FIRST AND SECOND CONDUCTIVE BUMPS HAVING D...
- Publication number 20160322323
- Publication date Nov 3, 2016
- Siliconware Precision Industries Co., Ltd.
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20160163632
- Publication date Jun 9, 2016
- Siliconware Precision Industries Co., Ltd.
- Hsien-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20150325556
- Publication date Nov 12, 2015
- Siliconware Precision Industries Co., Ltd.
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED MODULE AND PACKAGING METHOD THEREOF
- Publication number 20130005055
- Publication date Jan 3, 2013
- Industrial Technology Research Institute
- Jian-Shian Lin
- F21 - LIGHTING
Information Patent Application
LED PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20120286308
- Publication date Nov 15, 2012
- SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-BONDED LED
- Publication number 20120256228
- Publication date Oct 11, 2012
- Industrial Technology Research Institute
- Hsiu Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20120168777
- Publication date Jul 5, 2012
- Siliconware Precision Industries Co., Ltd.
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-PERMEATING COVER BOARD, METHOD OF FABRICATING THE SAME, AND P...
- Publication number 20120127693
- Publication date May 24, 2012
- Siliconware Precision Industries Co., Ltd.
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE-BONDING METHOD OF LED CHIP AND LED MANUFACTURED BY THE SAME
- Publication number 20110127563
- Publication date Jun 2, 2011
- Industrial Technology Research Institute
- Hsiu Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING LIGHT EMITTING DIODE PACKAGE
- Publication number 20110111539
- Publication date May 12, 2011
- Industrial Technology Research Institute
- Chieh-Lung Lai
- F21 - LIGHTING
Information Patent Application
LED MODULE AND PACKAGING METHOD THEREOF
- Publication number 20100157595
- Publication date Jun 24, 2010
- Industrial Technology Research Institute
- Jian-Shian Lin
- F21 - LIGHTING
Information Patent Application
LIGHT SOURCE DEVICE
- Publication number 20090135599
- Publication date May 28, 2009
- Industrial Technology Research Institute
- Jian-Shian Lin
- F21 - LIGHTING
Information Patent Application
LAMP FIXTURE
- Publication number 20080253129
- Publication date Oct 16, 2008
- Industrial Technology Research Institute
- Jian-Shian Lin
- F21 - LIGHTING
Information Patent Application
Illumination device of flexible lighting angle
- Publication number 20070263388
- Publication date Nov 15, 2007
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Chieh-Lung Lai
- F21 - LIGHTING
Information Patent Application
Reflective illumination device
- Publication number 20070217193
- Publication date Sep 20, 2007
- INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Jian-Shian Lin
- G02 - OPTICS

Chieh Lung Lai

Person

Patents Grantslast 30 patents

Method for manufacturing electronic package

Electronic package and method for manufacturing the same

Method for fabricating electronic package

Method of fabricating packaging structure

Electronic package and method for fabricating the same

Electronic package and semiconductor substrate

Electronic package, semiconductor substrate of the electronic packa...

Substrate structure with first and second conductive bumps having d...

Package structure and method for fabricating the same

Die-bonded LED

LED package structure and fabrication method thereof

LED module and packaging method thereof

Die-bonding method of LED chip and LED manufactured by the same

Light source device

Lamp fixture

Reflective illumination device

Artificial cultivating room and method for cultivating plants

Patents Applicationslast 30 patents

WET PROCESS AIR ABATEMENT SYSTEM AND METHOD

SEMICONDUCTOR DEVICE INCLUDING STRESS CONTROL LAYER AND METHODS OF...

EMBEDDING BARRIER LAYER IN FINE-PITCH BOND STRUCTURES

MULTIPLE DIE STRUCTURE AND METHOD OF FABRICATING THEREOF

Integrated Circuit Packages and Methods of Forming the Same

Redistribution Structure with Warpage Tuning Layer

METHOD FOR MANUFACTURING ELECTRONIC PACKAGE

METHOD FOR FABRICATING ELECTRONIC PACKAGE

ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF FABRICATING PACKAGING STRUCTURE

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

ELECTRONIC PACKAGE AND SEMICONDUCTOR SUBSTRATE

ELECTRONIC PACKAGE, SEMICONDUCTOR SUBSTRATE OF THE ELECTRONIC PACKA...

SUBSTRATE STRUCTURE WITH FIRST AND SECOND CONDUCTIVE BUMPS HAVING D...

PACKAGING STRUCTURE AND METHOD OF FABRICATING THE SAME

PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

LED MODULE AND PACKAGING METHOD THEREOF

LED PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

DIE-BONDED LED

LED PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

LIGHT-PERMEATING COVER BOARD, METHOD OF FABRICATING THE SAME, AND P...

DIE-BONDING METHOD OF LED CHIP AND LED MANUFACTURED BY THE SAME

METHOD OF MANUFACTURING LIGHT EMITTING DIODE PACKAGE

LED MODULE AND PACKAGING METHOD THEREOF

LIGHT SOURCE DEVICE

LAMP FIXTURE

Illumination device of flexible lighting angle

Reflective illumination device