TREA

Chieh Lung Lai

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  • Hsinchu City, TW
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Patents Grantslast 30 patents

  • Information Patent Grant

    Die-bonded LED
    • Patent number 8,716,737
    • Issue date May 6, 2014
    • Industrial Technology Research Institute
    • Hsiu Jen Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    LED module and packaging method thereof
    • Patent number 8,235,551
    • Issue date Aug 7, 2012
    • Industrial Technology Research Institute
    • Jian-Shian Lin
    • F21 - LIGHTING
  • Information Patent Grant

    Die-bonding method of LED chip and LED manufactured by the same
    • Patent number 8,236,687
    • Issue date Aug 7, 2012
    • Industrial Technology Research Institute
    • Hsiu-Jen Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Light source device
    • Patent number 7,717,587
    • Issue date May 18, 2010
    • Industrial Technology Research Institute
    • Jian-Shian Lin
    • F21 - LIGHTING
  • Information Patent Grant

    Lamp fixture
    • Patent number 7,575,344
    • Issue date Aug 18, 2009
    • Industrial Technology Research Institute
    • Jian-Shian Lin
    • F21 - LIGHTING
  • Information Patent Grant

    Reflective illumination device
    • Patent number 7,530,712
    • Issue date May 12, 2009
    • Industrial Technology Research Institute
    • Jian-Shian Lin
    • F21 - LIGHTING

Patents Applicationslast 30 patents

  • Information Patent Application

    LED MODULE AND PACKAGING METHOD THEREOF
    • Publication number 20130005055
    • Publication date Jan 3, 2013
    • Industrial Technology Research Institute
    • Jian-Shian Lin
    • F21 - LIGHTING
  • Information Patent Application

    DIE-BONDED LED
    • Publication number 20120256228
    • Publication date Oct 11, 2012
    • Industrial Technology Research Institute
    • Hsiu Jen Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIE-BONDING METHOD OF LED CHIP AND LED MANUFACTURED BY THE SAME
    • Publication number 20110127563
    • Publication date Jun 2, 2011
    • Industrial Technology Research Institute
    • Hsiu Jen Lin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF MANUFACTURING LIGHT EMITTING DIODE PACKAGE
    • Publication number 20110111539
    • Publication date May 12, 2011
    • Industrial Technology Research Institute
    • Chieh-Lung Lai
    • F21 - LIGHTING
  • Information Patent Application

    LED MODULE AND PACKAGING METHOD THEREOF
    • Publication number 20100157595
    • Publication date Jun 24, 2010
    • Industrial Technology Research Institute
    • Jian-Shian Lin
    • F21 - LIGHTING
  • Information Patent Application

    LIGHT SOURCE DEVICE
    • Publication number 20090135599
    • Publication date May 28, 2009
    • Industrial Technology Research Institute
    • Jian-Shian Lin
    • F21 - LIGHTING
  • Information Patent Application

    LAMP FIXTURE
    • Publication number 20080253129
    • Publication date Oct 16, 2008
    • Industrial Technology Research Institute
    • Jian-Shian Lin
    • F21 - LIGHTING
  • Information Patent Application

    Illumination device of flexible lighting angle
    • Publication number 20070263388
    • Publication date Nov 15, 2007
    • INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    • Chieh-Lung Lai
    • F21 - LIGHTING
  • Information Patent Application

    Reflective illumination device
    • Publication number 20070217193
    • Publication date Sep 20, 2007
    • INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    • Jian-Shian Lin
    • G02 - OPTICS