Chien-An Chen

Person

Hsin-Chuang, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing gallium nitride light emitting diode devices
- Patent number 7,364,926
- Issue date Apr 29, 2008
- Uni Light Technology Inc.
- Li-Shei Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode structure for a light-emitting element
- Patent number 6,963,167
- Issue date Nov 8, 2005
- Uni Light Technology Inc.
- Bor-Jen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an LED device with a metallic substrate
- Patent number 6,884,646
- Issue date Apr 26, 2005
- Uni Light Technology Inc.
- Bor-Jen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device having a metal substrate
- Patent number 6,555,405
- Issue date Apr 29, 2003
- Uni Light Technology, Inc.
- Nai-Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device having a metallic substrate
- Patent number 6,468,824
- Issue date Oct 22, 2002
- Uni Light Technology Inc.
- Nai-Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diodes with spreading and improving light emitting area
- Patent number 6,445,007
- Issue date Sep 3, 2002
- Uni Light Technology Inc.
- Bor-Jen Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Led structure for flip-chip package and method thereof
- Publication number 20090140282
- Publication date Jun 4, 2009
- Unit Light Technology Inc.
- Bor-Jen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure of circuit board interface for fuel cell module
- Publication number 20080013296
- Publication date Jan 17, 2008
- ASIA VITAL COMPONENTS CO., LTD.
- Chien-An Chen
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method for manufacturing gallium nitride light emitting diode devices
- Publication number 20070292978
- Publication date Dec 20, 2007
- Li-Shei Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED structure for flip-chip package and method thereof
- Publication number 20060284321
- Publication date Dec 21, 2006
- Unit Light Technology Inc.
- Bor-Jen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating LED
- Publication number 20060286694
- Publication date Dec 21, 2006
- Unit Light Technology Inc.
- Bor-Jen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light-emitting device with improved optical efficiency
- Publication number 20050230699
- Publication date Oct 20, 2005
- Bor-Jen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR DEVICE HAVING A METALLIC SUBSTRATE
- Publication number 20020137243
- Publication date Sep 26, 2002
- Nai-Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a semiconductor device having a metal substrate
- Publication number 20020137244
- Publication date Sep 26, 2002
- Uni Light Technology Inc.
- Nai-Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODES WITH SPREADING AND IMPROVING LIGHT EMITTING AREA
- Publication number 20020130327
- Publication date Sep 19, 2002
- Bor-Jen Wu
- H01 - BASIC ELECTRIC ELEMENTS

Chien-An Chen

Person

Patents Grantslast 30 patents

Method for manufacturing gallium nitride light emitting diode devices

Electrode structure for a light-emitting element

Method for forming an LED device with a metallic substrate

Method for forming a semiconductor device having a metal substrate

Method for forming a semiconductor device having a metallic substrate

Light emitting diodes with spreading and improving light emitting area

Patents Applicationslast 30 patents

Led structure for flip-chip package and method thereof

Structure of circuit board interface for fuel cell module

Method for manufacturing gallium nitride light emitting diode devices

LED structure for flip-chip package and method thereof

Method for fabricating LED

Light-emitting device with improved optical efficiency

METHOD FOR FORMING A SEMICONDUCTOR DEVICE HAVING A METALLIC SUBSTRATE

Method for forming a semiconductor device having a metal substrate

LIGHT EMITTING DIODES WITH SPREADING AND IMPROVING LIGHT EMITTING AREA