Chien-Cheng Tu

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 12,308,306
- Issue date May 20, 2025
- Advanced Semiconductor Engineering, Inc.
- Yuanhao Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED package structure
- Patent number 12,284,853
- Issue date Apr 22, 2025
- Lextar Electronics Corporation
- Chien-Hsin Tu
Information Patent Grant
Gate-all-around transistor with strained channels
- Patent number 12,211,897
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-En Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device with nanostructure channels
- Patent number 12,170,227
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Te Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS image sensor structure with microstructures on backside surfac...
- Patent number 11,996,429
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Nan Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device with reflective structure
- Patent number 11,990,493
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Chieh Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor device with nanostructure channels and manufa...
- Patent number 11,955,384
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Te Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and formation method
- Patent number 11,908,892
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Yu Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
LED package structure
- Patent number 11,888,099
- Issue date Jan 30, 2024
- Lextar Electronics Corporation
- Chien-Hsin Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with a high absorption layer
- Patent number 11,830,892
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate-all-around device
- Patent number 11,776,998
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-En Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 11,658,102
- Issue date May 23, 2023
- Advanced Semiconductor Engineering, Inc.
- Yuanhao Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
QE approach by double-side, multi absorption structure
- Patent number 11,393,937
- Issue date Jul 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device with reflective layer
- Patent number 11,342,372
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Chieh Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench isolation structures resistant to cracking
- Patent number 11,302,734
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Chi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,233,120
- Issue date Jan 25, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-En Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS image sensor structure with microstructures formed on semicond...
- Patent number 11,177,302
- Issue date Nov 16, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Nan Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
QE approach by double-side, multi absorption structure
- Patent number 10,879,406
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Han Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with a high absorption layer
- Patent number 10,868,053
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with an absorption enhancement semiconductor layer
- Patent number 10,861,988
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Chi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with an absorption enhancement semiconductor layer
- Patent number 10,861,989
- Issue date Dec 8, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Chi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming image sensor device
- Patent number 10,734,427
- Issue date Aug 4, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Chieh Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
QE approach by double-side, multi absorption structure
- Patent number 10,707,361
- Issue date Jul 7, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Han Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
QE approach by double-side, multi absorption structure
- Patent number 10,553,733
- Issue date Feb 4, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Han Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with a high absorption layer
- Patent number 10,553,628
- Issue date Feb 4, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with an absorption enhancement semiconductor layer
- Patent number 10,510,910
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Chi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor with a high absorption layer
- Patent number 10,438,980
- Issue date Oct 8, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device with reflective structure and method for formin...
- Patent number 10,211,244
- Issue date Feb 19, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chun-Chieh Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor image sensing device and manufacturing method thereof
- Patent number 10,204,959
- Issue date Feb 12, 2019
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chien-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device with damage reduction
- Patent number 10,164,141
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Nan Tu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
- Publication number 20250176254
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Bo-Wei HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL INTEGRATED CIRCUIT AND FABRICATION THEREOF
- Publication number 20250081604
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chun LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250072100
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Te TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250056841
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jih-Chao CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEAR INFRARED LIGHT SENSOR WITH IMPROVED LIGHT COUPLING AND CMOS IM...
- Publication number 20240429261
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- ChunHao Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE WITH ALTERNATE COMPLEMENTARY CHANNELS AND FABRICATION METHOD...
- Publication number 20240387545
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Ya LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL SHIELDING USING AIR GAPS
- Publication number 20240387584
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- ChunHao LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS IMAGE SENSOR AND METHOD FOR MAKING THE SAME
- Publication number 20240355847
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsien YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS IMAGE SENSOR STRUCTURE
- Publication number 20240274632
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Nan TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIXEL SENSOR ARRAYS AND METHODS OF FORMATION
- Publication number 20240274636
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hsien YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FORMATION METHOD
- Publication number 20240153992
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Yu YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED PACKAGE STRUCTURE
- Publication number 20240136483
- Publication date Apr 25, 2024
- Lextar Electronics Corporation
- Chien-Hsin TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY STACKED TRANSISTORS AND FABRICATION THEREOF
- Publication number 20240072054
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Te TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240063284
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Te TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240021479
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Te TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230395693
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Te TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR WITH A HIGH ABSORPTION LAYER
- Publication number 20230387150
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Chang Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE-ALL-AROUND DEVICE
- Publication number 20230378266
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-En TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230298985
- Publication date Sep 21, 2023
- Advanced Semiconductor Engineering, Inc.
- Yuanhao YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230260842
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Te TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE WITH ALTERNATE COMPLEMENTARY CHANNELS AND FABRICATION METHOD...
- Publication number 20230154923
- Publication date May 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Ya LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FORMATION METHOD
- Publication number 20220310787
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Yu YE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE WITH REFLECTIVE STRUCTURE
- Publication number 20220278159
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Chieh FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Deep Trench Isolation Structures Resistant to Cracking
- Publication number 20220238572
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Chi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE-ALL-AROUND DEVICE
- Publication number 20220149172
- Publication date May 12, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-En TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED PACKAGE STRUCTURE
- Publication number 20220140208
- Publication date May 5, 2022
- Lextar Electronics Corporation
- Chien-Hsin TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS IMAGE SENSOR STRUCTURE
- Publication number 20220077214
- Publication date Mar 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Nan TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210328012
- Publication date Oct 21, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-En TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210225747
- Publication date Jul 22, 2021
- Advanced Semiconductor Engineering, Inc.
- Yuanhao YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QE APPROACH BY DOUBLE-SIDE, MULTI ABSORPTION STRUCTURE
- Publication number 20210119064
- Publication date Apr 22, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Po-Han Huang
- H01 - BASIC ELECTRIC ELEMENTS

Chien-Cheng Tu

Person

Patents Grantslast 30 patents

Semiconductor device package and method of manufacturing the same

LED package structure

Gate-all-around transistor with strained channels

Stacked semiconductor device with nanostructure channels

CMOS image sensor structure with microstructures on backside surfac...

Image sensor device with reflective structure

Stacked semiconductor device with nanostructure channels and manufa...

Semiconductor device and formation method

LED package structure

Image sensor with a high absorption layer

Gate-all-around device

Semiconductor device package and method of manufacturing the same

QE approach by double-side, multi absorption structure

Image sensor device with reflective layer

Deep trench isolation structures resistant to cracking

Semiconductor device and manufacturing method thereof

CMOS image sensor structure with microstructures formed on semicond...

QE approach by double-side, multi absorption structure

Image sensor with a high absorption layer

Image sensor with an absorption enhancement semiconductor layer

Image sensor with an absorption enhancement semiconductor layer

Method for forming image sensor device

QE approach by double-side, multi absorption structure

QE approach by double-side, multi absorption structure

Image sensor with a high absorption layer

Image sensor with an absorption enhancement semiconductor layer

Image sensor with a high absorption layer

Image sensor device with reflective structure and method for formin...

Semiconductor image sensing device and manufacturing method thereof

Image sensor device with damage reduction

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

THREE DIMENSIONAL INTEGRATED CIRCUIT AND FABRICATION THEREOF

SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF

NEAR INFRARED LIGHT SENSOR WITH IMPROVED LIGHT COUPLING AND CMOS IM...

DEVICE WITH ALTERNATE COMPLEMENTARY CHANNELS AND FABRICATION METHOD...

PIXEL SHIELDING USING AIR GAPS

CMOS IMAGE SENSOR AND METHOD FOR MAKING THE SAME

CMOS IMAGE SENSOR STRUCTURE

PIXEL SENSOR ARRAYS AND METHODS OF FORMATION

SEMICONDUCTOR DEVICE AND FORMATION METHOD

LED PACKAGE STRUCTURE

VERTICALLY STACKED TRANSISTORS AND FABRICATION THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

IMAGE SENSOR WITH A HIGH ABSORPTION LAYER

GATE-ALL-AROUND DEVICE

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

DEVICE WITH ALTERNATE COMPLEMENTARY CHANNELS AND FABRICATION METHOD...

SEMICONDUCTOR DEVICE AND FORMATION METHOD

IMAGE SENSOR DEVICE WITH REFLECTIVE STRUCTURE

Deep Trench Isolation Structures Resistant to Cracking

GATE-ALL-AROUND DEVICE

LED PACKAGE STRUCTURE

CMOS IMAGE SENSOR STRUCTURE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

QE APPROACH BY DOUBLE-SIDE, MULTI ABSORPTION STRUCTURE