Chien-Chuan Shih

Person

Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Catalyst composition and method for preparing amide
- Patent number 8,962,861
- Issue date Feb 24, 2015
- China Petrochemical Development Corporation
- Chien-Chuan Shih
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Method for preparing pyruvate ester
- Patent number 8,877,959
- Issue date Nov 4, 2014
- China Petrochemical Development Corporation Taipei (Taiwan)
- Shun-I Fang
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Catalyst composition and method for preparing amide using the same
- Patent number 8,865,892
- Issue date Oct 21, 2014
- China Petroleum Development Corporation, Taipei (Taiwan)
- Tung-Han Tsai
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Method of managing power consumption of portable computer and porta...
- Patent number 8,798,571
- Issue date Aug 5, 2014
- Via Technologies Inc.
- Chien Yi Shih
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Low resistance and reliable copper interconnects by variable doping
- Patent number 8,785,321
- Issue date Jul 22, 2014
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Chu Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for improving copper line cap formation
- Patent number 8,623,760
- Issue date Jan 7, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsueh Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for separating amide from amino acid ionic liquid
- Patent number 8,552,180
- Issue date Oct 8, 2013
- China Petrochemical Development Corporation
- Cheng-Fa Hsieh
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Transitional interface between metal and dielectric in interconnect...
- Patent number 8,349,730
- Issue date Jan 8, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsueh Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for improving copper line cap formation
- Patent number 8,193,087
- Issue date Jun 5, 2012
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Hsueh Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistance and reliable copper interconnects by variable doping
- Patent number 8,053,892
- Issue date Nov 8, 2011
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Chu Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transitional interface between metal and dielectric in interconnect...
- Patent number 7,777,344
- Issue date Aug 17, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsueh Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro chemical plating additives for improving stress and levelin...
- Patent number 7,771,579
- Issue date Aug 10, 2010
- Taiwan Semiconductor Manufacturing Co.
- Ting-Chu Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for low resistance metal cap
- Patent number 7,582,557
- Issue date Sep 1, 2009
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Hsueh Shih
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper interconnection with conductive polymer layer and method of...
- Patent number 7,538,434
- Issue date May 26, 2009
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsueh Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for electroplating
- Patent number 7,476,306
- Issue date Jan 13, 2009
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Wen Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for making a metal seed layer
- Patent number 7,446,034
- Issue date Nov 4, 2008
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Hsueh Shih
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Uniform passivation method for conductive features
- Patent number 7,413,976
- Issue date Aug 19, 2008
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsueh Shih
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Silicide structure for ultra-shallow junction for MOS devices
- Patent number 7,332,435
- Issue date Feb 19, 2008
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsueh Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method thereof
- Patent number 7,312,531
- Issue date Dec 25, 2007
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hui-Lin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ECP polymer additives and method for reducing overburden and defects
- Patent number 7,182,849
- Issue date Feb 27, 2007
- Taiwan Semiconducotr Manufacturing Co., Ltd.
- Chien-Hsueh Shih
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Low resistance and reliable copper interconnects by variable doping
- Patent number 7,026,244
- Issue date Apr 11, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Chu Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DMA controller and method for checking address of data to be transf...
- Patent number 6,954,807
- Issue date Oct 11, 2005
- VIA Technologies, Inc.
- Chien-Yi Shih
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PREPARING PYRUVATE ESTER
- Publication number 20140031581
- Publication date Jan 30, 2014
- China Petrochemical Development Corporation, Taipei (Taiwan)
- Shun-I Fang
- C07 - ORGANIC CHEMISTRY
Information Patent Application
CATALYST COMPOSITION AND METHOD FOR PREPARING AMIDE
- Publication number 20130053575
- Publication date Feb 28, 2013
- China Petrochemical Development Corporation, Taipei (Taiwan)
- Chien-Chuan Shih
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
Process for Improving Copper Line Cap Formation
- Publication number 20120190191
- Publication date Jul 26, 2012
- Taiwan Semiconductor Manufaturing Company, Ltd.
- Chien-Hsueh Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CATALYST COMPOSITION AND METHOD FOR PREPARING AMIDE USING THE SAME
- Publication number 20120184733
- Publication date Jul 19, 2012
- China Petrochemical Development Corporation, Taipei (Taiwan)
- Tung-Han Tsai
- C07 - ORGANIC CHEMISTRY
Information Patent Application
LOW RESISTANCE AND RELIABLE COPPER INTERCONNECTS BY VARIABLE DOPING
- Publication number 20120021602
- Publication date Jan 26, 2012
- Taiwan Semiconductor Manufacturing Co., LTD
- Ting-Chu Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR SEPARATING AMIDE FROM AMINO ACID IONIC LIQUID
- Publication number 20110105793
- Publication date May 5, 2011
- China Petrochemical Development Corporation
- Cheng-Fa Hsieh
- C07 - ORGANIC CHEMISTRY
Information Patent Application
Transitional Interface Between Metal and Dielectric in Interconnect...
- Publication number 20100267232
- Publication date Oct 21, 2010
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsueh Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTERCONNECTION STRUCTURE AND METHOD FOR MAKING THE SAME
- Publication number 20090117731
- Publication date May 7, 2009
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SALICIDATION PROCESS USING ELECTROLESS PLATING TO DEPOSIT METAL AND...
- Publication number 20090004851
- Publication date Jan 1, 2009
- Taiwan Semiconductor Manufacturing Co., LTD
- Shau-Lin Shue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transitional Interface between metal and dielectric in interconnect...
- Publication number 20080251922
- Publication date Oct 16, 2008
- Chien-Hsueh Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultra-low resistance interconnect
- Publication number 20080251919
- Publication date Oct 16, 2008
- Chien-Hsueh Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for improving copper line cap formation
- Publication number 20070269978
- Publication date Nov 22, 2007
- Chien-Hsueh Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and fabrication method thereof
- Publication number 20070152306
- Publication date Jul 5, 2007
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Hsueh Shih
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Semiconductor device and fabrication method thereof
- Publication number 20070096326
- Publication date May 3, 2007
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hui-Lin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of managing power consumption of portable computer and porta...
- Publication number 20070081504
- Publication date Apr 12, 2007
- VIA TECHNOLOGIES INC.
- Chien Yi Shih
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PROCESS FOR MAKING A METAL SEED LAYER
- Publication number 20070082474
- Publication date Apr 12, 2007
- Taiwan Semiconductor Manufacturing Co., LTD
- Chien-Hsueh Shih
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Process for low resistance metal cap
- Publication number 20070082473
- Publication date Apr 12, 2007
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Hsueh Shih
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Low resistance and reliable copper interconnects by variable doping
- Publication number 20070054488
- Publication date Mar 8, 2007
- Ting-Chu Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper interconnect structures and fabrication method thereof
- Publication number 20070048991
- Publication date Mar 1, 2007
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Hsueh Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROPLATING ADDITIVE FOR IMPROVED RELIABILITY
- Publication number 20060243599
- Publication date Nov 2, 2006
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsueh Shih
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplating composition and method
- Publication number 20060213780
- Publication date Sep 28, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Hsueh Shih
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Copper interconnection with conductive polymer layer and method of...
- Publication number 20060202346
- Publication date Sep 14, 2006
- Chien-Hsueh Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel silicide structure for ultra-shallow junction for MOS devices
- Publication number 20060205214
- Publication date Sep 14, 2006
- Chien-Hsueh Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Uniform passivation method for conductive features
- Publication number 20060172529
- Publication date Aug 3, 2006
- Chien-Hsueh Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passivation structure for semiconductor devices
- Publication number 20060138668
- Publication date Jun 29, 2006
- Hung-Wen Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electro chemical plating addictives for improving stress and leveli...
- Publication number 20060118422
- Publication date Jun 8, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Chu Ko
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WIRELESS PERIPHERAL AND RELATED CONTROL METHOD FOR SUPPORTING LEGAC...
- Publication number 20060007126
- Publication date Jan 12, 2006
- Chien-Yi Shih
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method and apparatus for electroplating
- Publication number 20050224359
- Publication date Oct 13, 2005
- Hung-Wen Su
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method and composition to enhance wetting of ECP electrolyte to cop...
- Publication number 20050211564
- Publication date Sep 29, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Hsueh Shih
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Chemical structures and compositions of ECP additives to reduce pit...
- Publication number 20050199507
- Publication date Sep 15, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Hsueh Shih
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Chien-Chuan Shih

Person

Patents Grantslast 30 patents

Catalyst composition and method for preparing amide

Method for preparing pyruvate ester

Catalyst composition and method for preparing amide using the same

Method of managing power consumption of portable computer and porta...

Low resistance and reliable copper interconnects by variable doping

Process for improving copper line cap formation

Method for separating amide from amino acid ionic liquid

Transitional interface between metal and dielectric in interconnect...

Process for improving copper line cap formation

Low resistance and reliable copper interconnects by variable doping

Transitional interface between metal and dielectric in interconnect...

Electro chemical plating additives for improving stress and levelin...

Process for low resistance metal cap

Copper interconnection with conductive polymer layer and method of...

Method and apparatus for electroplating

Process for making a metal seed layer

Uniform passivation method for conductive features

Silicide structure for ultra-shallow junction for MOS devices

Semiconductor device and fabrication method thereof

ECP polymer additives and method for reducing overburden and defects

Low resistance and reliable copper interconnects by variable doping

DMA controller and method for checking address of data to be transf...

Patents Applicationslast 30 patents

METHOD FOR PREPARING PYRUVATE ESTER

CATALYST COMPOSITION AND METHOD FOR PREPARING AMIDE

Process for Improving Copper Line Cap Formation

CATALYST COMPOSITION AND METHOD FOR PREPARING AMIDE USING THE SAME

LOW RESISTANCE AND RELIABLE COPPER INTERCONNECTS BY VARIABLE DOPING

METHOD FOR SEPARATING AMIDE FROM AMINO ACID IONIC LIQUID

Transitional Interface Between Metal and Dielectric in Interconnect...

SEMICONDUCTOR INTERCONNECTION STRUCTURE AND METHOD FOR MAKING THE SAME

SALICIDATION PROCESS USING ELECTROLESS PLATING TO DEPOSIT METAL AND...

Transitional Interface between metal and dielectric in interconnect...

Ultra-low resistance interconnect

Process for improving copper line cap formation

Semiconductor device and fabrication method thereof

Semiconductor device and fabrication method thereof

Method of managing power consumption of portable computer and porta...

PROCESS FOR MAKING A METAL SEED LAYER

Process for low resistance metal cap

Low resistance and reliable copper interconnects by variable doping

Copper interconnect structures and fabrication method thereof

ELECTROPLATING ADDITIVE FOR IMPROVED RELIABILITY

Electroplating composition and method

Copper interconnection with conductive polymer layer and method of...

Novel silicide structure for ultra-shallow junction for MOS devices

Uniform passivation method for conductive features

Passivation structure for semiconductor devices

Electro chemical plating addictives for improving stress and leveli...

WIRELESS PERIPHERAL AND RELATED CONTROL METHOD FOR SUPPORTING LEGAC...

Method and apparatus for electroplating

Method and composition to enhance wetting of ECP electrolyte to cop...

Chemical structures and compositions of ECP additives to reduce pit...