Chien-Hung HO

Person

Hsinchu County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Carrier package and carrier with plural heat conductors
- Patent number 9,768,092
- Issue date Sep 19, 2017
- Viking Tech Corporation
- Chien-Hung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing ceramic substrate
- Patent number 9,437,549
- Issue date Sep 6, 2016
- Viking Tech Corporation
- Chien-Hung Ho
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resistor component
- Patent number 9,373,430
- Issue date Jun 21, 2016
- Viking Tech Corporation
- Shih-Long Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of electroplating and depositing metal
- Patent number 9,204,555
- Issue date Dec 1, 2015
- Viking Tech Corporation
- Shih-Long Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming package substrate
- Patent number 8,841,172
- Issue date Sep 23, 2014
- Viking Tech Corporation
- Shih-Long Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a metallized ceramic substrate
- Patent number 8,591,756
- Issue date Nov 26, 2013
- Viking Tech Corporation
- Shih-Long Wei
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for manufacturing alloy resistor
- Patent number 8,590,140
- Issue date Nov 26, 2013
- Viking Tech Corporation
- Shih-Long Wei
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
Ceramic substrate, package substrate, semiconductor chip package co...
- Publication number 20160049372
- Publication date Feb 18, 2016
- VIKING TECH CORPORATION
- Chien-Hung HO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ceramic Substrate and Semiconductor Package Having the Same
- Publication number 20150303362
- Publication date Oct 22, 2015
- VIKING TECH CORPORATION
- Chien-Hung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier and Package Having the Carrier
- Publication number 20150305201
- Publication date Oct 22, 2015
- VIKING TECH CORPORATION
- Chien-Hung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resistor Component
- Publication number 20140167911
- Publication date Jun 19, 2014
- VIKING TECH CORPORATION
- Shih-Long WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Substrate
- Publication number 20140170848
- Publication date Jun 19, 2014
- VIKING TECH CORPORATION
- Shih-Long WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Fabricating a Light Emitting Diode Packaging Structure
- Publication number 20140027051
- Publication date Jan 30, 2014
- VIKING TECH CORPORATION
- Shih-Long Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Electroplating and Depositing Metal
- Publication number 20140001051
- Publication date Jan 2, 2014
- VIKING TECH CORPORATION
- Shih-Long WEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method For Fabricating Conductive Structures of Substrate
- Publication number 20130313122
- Publication date Nov 28, 2013
- Viking Tech Corporation
- Shih-Long Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Selective Metallization on a Ceramic Substrate
- Publication number 20130098867
- Publication date Apr 25, 2013
- VIKING TECH CORPORATION
- Shih-Long Wei
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
Method of Fabricating a Substrate Having Conductive Through Holes
- Publication number 20130089982
- Publication date Apr 11, 2013
- VIKING TECH CORPORATION
- Shih-Long WEI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Light Emitting Diode Packaging Structure and Method of Fabricating...
- Publication number 20130082292
- Publication date Apr 4, 2013
- VIKING TECH CORPORATION
- Shih-Long Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Metallized Ceramic Substrate
- Publication number 20130048602
- Publication date Feb 28, 2013
- VIKING TECH CORPORATION
- Shih-Long Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming Package Substrate
- Publication number 20120317806
- Publication date Dec 20, 2012
- VIKING TECH CORPORATION
- Shih-Long Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Substrate and Method for Forming the Same
- Publication number 20120211792
- Publication date Aug 23, 2012
- VIKING TECH CORPORATION
- Shih-Long Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING CONDUCTIVE VIA IN A SUBSTRATE
- Publication number 20120064230
- Publication date Mar 15, 2012
- Shih-Long Wei
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Light-Emitting Diode Packaging Structure and Substrate Therefor
- Publication number 20120001212
- Publication date Jan 5, 2012
- VIKING TECH CORPORATION
- Shih-Long Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing Alloy Resistor
- Publication number 20120000066
- Publication date Jan 5, 2012
- VIKING TECH CORPORATION
- Shih-Long Wei
- H01 - BASIC ELECTRIC ELEMENTS

Chien-Hung HO

Person

Patents Grantslast 30 patents

Carrier package and carrier with plural heat conductors

Method for manufacturing ceramic substrate

Resistor component

Method of electroplating and depositing metal

Method for forming package substrate

Method of manufacturing a metallized ceramic substrate

Method for manufacturing alloy resistor

Patents Applicationslast 30 patents

Ceramic substrate, package substrate, semiconductor chip package co...

Ceramic Substrate and Semiconductor Package Having the Same

Carrier and Package Having the Carrier

Resistor Component

Method of Forming Substrate

Method of Fabricating a Light Emitting Diode Packaging Structure

Method of Electroplating and Depositing Metal

Method For Fabricating Conductive Structures of Substrate

Method for Selective Metallization on a Ceramic Substrate

Method of Fabricating a Substrate Having Conductive Through Holes

Light Emitting Diode Packaging Structure and Method of Fabricating...

Method of Manufacturing a Metallized Ceramic Substrate

Method for Forming Package Substrate

Package Substrate and Method for Forming the Same

METHOD FOR FORMING CONDUCTIVE VIA IN A SUBSTRATE

Light-Emitting Diode Packaging Structure and Substrate Therefor

Method for Manufacturing Alloy Resistor