Chien-Ming Sung

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Tainan, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with buffer layer and method of forming
- Patent number 12,191,334
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Ya Chun Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with buffer layer and method of forming
- Patent number 11,189,653
- Issue date Nov 30, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Ya Chun Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring for bonded dies
- Patent number 10,515,908
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ya-Chun Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preventing contamination in integrated circuit manufacturing lines
- Patent number 9,177,843
- Issue date Nov 3, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Ming Sung
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH BUFFER LAYER AND METHOD OF FORMING
- Publication number 20220085090
- Publication date Mar 17, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Ya Chun TENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH BUFFER LAYER AND METHOD OF FORMING
- Publication number 20210082985
- Publication date Mar 18, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Ya Chun TENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAL RING FOR BONDED DIES
- Publication number 20190131255
- Publication date May 2, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ya-Chun TENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Preventing Contamination in Integrated Circuit Manufacturing Lines
- Publication number 20080304944
- Publication date Dec 11, 2008
- Chien-Ming Sung
- H01 - BASIC ELECTRIC ELEMENTS