Chien-Wei Wang

Person

Hsinchu County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Bevel edge removal methods, tools, and systems
- Patent number 12,362,201
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Chi Huang
- B08 - CLEANING
Information Patent Grant
Method of controlling state of electric assist bicycle, control sys...
- Patent number 12,337,916
- Issue date Jun 24, 2025
- FOXCONN INTERCONNECT TECHNOLOGY LIMITED
- Chien-Wen Wang
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Grant
Level shifter
- Patent number 12,334,920
- Issue date Jun 17, 2025
- Vanguard International Semiconductor Corporation
- Jung-Tsun Chuang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Two-stage design for new radio (NR) sidelink control information (SCI)
- Patent number 12,273,295
- Issue date Apr 8, 2025
- Mediatek Inc.
- Chien-Yi Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for configuring channel state information computation period...
- Patent number 12,267,710
- Issue date Apr 1, 2025
- Mediatek Inc.
- Chien-Yi Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Embedded component package structure and manufacturing method thereof
- Patent number 12,267,961
- Issue date Apr 1, 2025
- Advanced Semiconductor Engineering, Inc.
- Chien-Fan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic module having protruded and recessed structure for r...
- Patent number 12,262,566
- Issue date Mar 25, 2025
- Life-On Technology Corporation
- Jui Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Machine learning on overlay management
- Patent number 12,237,188
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tzu-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package with polymer layer delamination prevention desi...
- Patent number 12,230,593
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Heng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Machine learning on overlay management
- Patent number 12,197,138
- Issue date Jan 14, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tzu-Cheng Lin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Light-emitting module and front-lit liquid-crystal-on-silicon module
- Patent number 12,197,081
- Issue date Jan 14, 2025
- Himax Display, Inc.
- Yuet-Wing Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithography process and material for negative tone development
- Patent number 12,189,296
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for applying dynamic compensation to feedback...
- Patent number 12,191,767
- Issue date Jan 7, 2025
- MediaTek Singapore Pte Ltd.
- Man Pun Chan
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Pulsed-DC power generator and method of automatically adjusting arc...
- Patent number 12,184,173
- Issue date Dec 31, 2024
- Delta Electronics, Inc.
- Wei-Hsun Lai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Power conversion system with ripple injection and power conversion...
- Patent number 12,184,166
- Issue date Dec 31, 2024
- Delta Electronics, Inc.
- Yu-Jen Lin
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Sensor lens assembly having non-soldering configuration
- Patent number 12,174,446
- Issue date Dec 24, 2024
- Tong Hsing Electronic Industries, Ltd.
- Chia-Shuai Chang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Power semiconductor package unit of surface mount technology includ...
- Patent number 12,148,675
- Issue date Nov 19, 2024
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for channel state information measurement and computation fo...
- Patent number 12,149,475
- Issue date Nov 19, 2024
- Mediatek Inc.
- Chien-Yi Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Apparatus for synchronous ethernet
- Patent number 12,130,770
- Issue date Oct 29, 2024
- Alpha Networks Inc.
- Pao-Kang Mo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing capacitor structure
- Patent number 12,125,642
- Issue date Oct 22, 2024
- NANYA TECHNOLOGY CORPORATION
- Chien-Chung Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preparing semiconductor device with wire bond
- Patent number 12,113,046
- Issue date Oct 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Wei-Zhong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inflatable product
- Patent number 12,102,237
- Issue date Oct 1, 2024
- Team Worldwide Corporation
- Cheng-Chung Wang
- A47 - FURNITURE DOMESTIC ARTICLES OR APPLIANCES COFFEE MILLS SPICE MILLS SUCT...
Information Patent Grant
Semiconductor die with stepped side surface
- Patent number 12,062,596
- Issue date Aug 13, 2024
- Texas Instruments Incorporated
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of operating drippage prevention system
- Patent number 12,048,944
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hung Wang
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Two-stage sidelink control information for sidelink communications
- Patent number 12,047,953
- Issue date Jul 23, 2024
- MediaTek Singapore Pte Ltd.
- Tao Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Two-stage physical sidelink control channel (PSCCH) for sidelink co...
- Patent number 12,047,312
- Issue date Jul 23, 2024
- MediaTek Singapore Pte Ltd.
- Tao Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Photosensitive material and method of lithography
- Patent number 12,019,375
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- An-Ren Zi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of data synchronization and redundant server system
- Patent number 12,013,798
- Issue date Jun 18, 2024
- MITAC COMPUTING TECHNOLOGY CORPORATION
- Chin-Hung Tan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Detection using semiconductor detector
- Patent number 12,009,177
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ya-Chin King
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display stand holder with slide rail structure and display apparatu...
- Patent number 12,000,525
- Issue date Jun 4, 2024
- Giga-Byte Technology Co., Ltd.
- Po-Jen Shih
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...

Patents Applicationslast 30 patents

Information Patent Application
ULTRA-THIN PACKAGED COMPONENT
- Publication number 20250239499
- Publication date Jul 24, 2025
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMANTIC PROMPT LEARNING FOR WEAKLY-SUPERVISED SEMANTIC SEGMENTATION
- Publication number 20250239093
- Publication date Jul 24, 2025
- NVIDIA Corporation
- Min-Hung Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
EMBEDDED COMPONENT PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250227849
- Publication date Jul 10, 2025
- Advanced Semiconductor Engineering, Inc.
- Chien-Fan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR DETERMINING CSI MEASUREMENT WINDOW AND CSI...
- Publication number 20250220478
- Publication date Jul 3, 2025
- MEDIATEK INC.
- Chien-Yi WANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ADAPTIVE LIQUID COOLING SYSTEM FOR CHIP PACKAGE
- Publication number 20250221310
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Chang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package Structure with Thermelectric Self-Coolin...
- Publication number 20250218895
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Chang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
- Publication number 20250210420
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bang Li Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SUPPLY UNIT WITH IMPROVED SPACE UTILIZATION AND HEAT DISSIPATION
- Publication number 20250212372
- Publication date Jun 26, 2025
- PANJIT INTERNATIONAL INC.
- CHIEN-CHUN WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL STRUCTURE FOR SEMICONDUCTOR PACKAGE
- Publication number 20250210458
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Chang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20250201658
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Min Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONFIGURING CHANNEL STATE INFORMATION COMPUTATION PERIOD...
- Publication number 20250203419
- Publication date Jun 19, 2025
- MEDIATEK INC.
- Chien-Yi Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CHIP PACKAGE STRUCTURE WITH LID AND METHOD FOR FORMING THE SAME
- Publication number 20250201652
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Min Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOTEBOOK COMPUTER AND OPERATION METHOD
- Publication number 20250199817
- Publication date Jun 19, 2025
- ACER INCORPORATED
- Chien-Shan WANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PULSE WIDTH MODULATION CONTROL CIRCUIT HAVING DUAL LOOPS
- Publication number 20250183802
- Publication date Jun 5, 2025
- RICHTEK TECHNOLOGY CORPORATION
- Kai-Yu HU
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
LEVEL SHIFTER
- Publication number 20250167785
- Publication date May 22, 2025
- Vanguard International Semiconductor Corporation
- Jung-Tsun CHUANG
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
WAFER LEVEL PACKAGE WITH POLYMER LAYER DELAMINATION PREVENTION DESI...
- Publication number 20250157955
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Heng CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Handling Calls with Sessions Initiation Protocol
- Publication number 20250150495
- Publication date May 8, 2025
- MEDIATEK INC.
- Ying-Cen Lai
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Lithography Process and Material for Negative Tone Development
- Publication number 20250138428
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Co., LTD
- Chien-Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MACHINE LEARNING ON OVERLAY MANAGEMENT
- Publication number 20250123572
- Publication date Apr 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzu-Cheng LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
VOICE CALL MANAGEMENT METHOD AND APPARATUS THEREOF
- Publication number 20250126210
- Publication date Apr 17, 2025
- MEDIATEK INC.
- Hao-Cheng WANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SIDE-WETTABLE PACKAGE WITH EDGE-RECESSED BOND PADS
- Publication number 20250125292
- Publication date Apr 17, 2025
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Display with Vertically Stacked Components
- Publication number 20250081730
- Publication date Mar 6, 2025
- Apple Inc.
- Andrew Lin
Information Patent Application
SIZING AGENT COMPOSITION, SIZING AGENT, CARBON FIBER COVERED WITH S...
- Publication number 20250034363
- Publication date Jan 30, 2025
- Formosa Plastics Corporation
- Hsuan-Yin CHEN
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR CHANNEL STATE INFORMATION MEASUREMENT AND COMPUTATION FO...
- Publication number 20250038921
- Publication date Jan 30, 2025
- MEDIATEK INC.
- Chien-Yi Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CAPACITOR STRUCTURE
- Publication number 20250014824
- Publication date Jan 9, 2025
- NANYA TECHNOLOGY CORPORATION
- Chien-Chung WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE FOR MONITORING INTER-INTEGRATED CIRCUIT BUS
- Publication number 20250004978
- Publication date Jan 2, 2025
- Alpha Networks Inc.
- Chien-Hua Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
RADIO FREQUENCY (RF) PHASED-ARRAY DETECTOR
- Publication number 20240413545
- Publication date Dec 12, 2024
- TRON FUTURE TECH INC.
- YU-JIU WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOISE REDUCTION SYSTEM USING FINITE IMPULSE RESPONSE FILTER THAT IS...
- Publication number 20240406626
- Publication date Dec 5, 2024
- Airoha Technology Corp.
- Tsung-Han Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CANTILEVER WITH ETCH CHAMBER FLOW DESIGN
- Publication number 20240387147
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COUPON DESIGN FOR SURFACE COATING QUALITY
- Publication number 20240377759
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wei HSU
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Chien-Wei Wang

Person

Patents Grantslast 30 patents

Bevel edge removal methods, tools, and systems

Method of controlling state of electric assist bicycle, control sys...

Level shifter

Two-stage design for new radio (NR) sidelink control information (SCI)

Method for configuring channel state information computation period...

Embedded component package structure and manufacturing method thereof

Optoelectronic module having protruded and recessed structure for r...

Machine learning on overlay management

Wafer level package with polymer layer delamination prevention desi...

Machine learning on overlay management

Light-emitting module and front-lit liquid-crystal-on-silicon module

Lithography process and material for negative tone development

Apparatus and method for applying dynamic compensation to feedback...

Pulsed-DC power generator and method of automatically adjusting arc...

Power conversion system with ripple injection and power conversion...

Sensor lens assembly having non-soldering configuration

Power semiconductor package unit of surface mount technology includ...

Method for channel state information measurement and computation fo...

Apparatus for synchronous ethernet

Method of manufacturing capacitor structure

Method for preparing semiconductor device with wire bond

Inflatable product

Semiconductor die with stepped side surface

Method of operating drippage prevention system

Two-stage sidelink control information for sidelink communications

Two-stage physical sidelink control channel (PSCCH) for sidelink co...

Photosensitive material and method of lithography

Method of data synchronization and redundant server system

Detection using semiconductor detector

Display stand holder with slide rail structure and display apparatu...

Patents Applicationslast 30 patents

ULTRA-THIN PACKAGED COMPONENT

SEMANTIC PROMPT LEARNING FOR WEAKLY-SUPERVISED SEMANTIC SEGMENTATION

EMBEDDED COMPONENT PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

METHOD AND APPARATUS FOR DETERMINING CSI MEASUREMENT WINDOW AND CSI...

ADAPTIVE LIQUID COOLING SYSTEM FOR CHIP PACKAGE

Integrated Circuit Package Structure with Thermelectric Self-Coolin...

INTEGRATED CIRCUIT PACKAGES AND METHODS

POWER SUPPLY UNIT WITH IMPROVED SPACE UTILIZATION AND HEAT DISSIPATION

THERMAL STRUCTURE FOR SEMICONDUCTOR PACKAGE

PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

METHOD FOR CONFIGURING CHANNEL STATE INFORMATION COMPUTATION PERIOD...

CHIP PACKAGE STRUCTURE WITH LID AND METHOD FOR FORMING THE SAME

NOTEBOOK COMPUTER AND OPERATION METHOD

PULSE WIDTH MODULATION CONTROL CIRCUIT HAVING DUAL LOOPS

LEVEL SHIFTER

WAFER LEVEL PACKAGE WITH POLYMER LAYER DELAMINATION PREVENTION DESI...

Method for Handling Calls with Sessions Initiation Protocol

Lithography Process and Material for Negative Tone Development

MACHINE LEARNING ON OVERLAY MANAGEMENT

VOICE CALL MANAGEMENT METHOD AND APPARATUS THEREOF

SIDE-WETTABLE PACKAGE WITH EDGE-RECESSED BOND PADS

Display with Vertically Stacked Components

SIZING AGENT COMPOSITION, SIZING AGENT, CARBON FIBER COVERED WITH S...

METHOD FOR CHANNEL STATE INFORMATION MEASUREMENT AND COMPUTATION FO...

CAPACITOR STRUCTURE

DEVICE FOR MONITORING INTER-INTEGRATED CIRCUIT BUS

RADIO FREQUENCY (RF) PHASED-ARRAY DETECTOR

NOISE REDUCTION SYSTEM USING FINITE IMPULSE RESPONSE FILTER THAT IS...

CANTILEVER WITH ETCH CHAMBER FLOW DESIGN

INTEGRATED COUPON DESIGN FOR SURFACE COATING QUALITY