Chih-I Wu

Person

Hillsboro, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Sealing porous dielectrics with silane coupling reagents
- Patent number 7,456,490
- Issue date Nov 25, 2008
- Intel Corporation
- Grant Kloster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to reduce the copper line roughness for increased electrical...
- Patent number 7,268,075
- Issue date Sep 11, 2007
- Intel Corporation
- David H. Gracias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealing porous dielectrics with silane coupling reagents
- Patent number 7,122,481
- Issue date Oct 17, 2006
- Intel Corporation
- Grant Kloster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a semiconductor device by forming a masking layer...
- Patent number 6,743,712
- Issue date Jun 1, 2004
- Intel Corporation
- Hyun-Mog Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improving nucleation and adhesion of CVD and ALD films d...
- Patent number 6,605,549
- Issue date Aug 12, 2003
- Intel Corporation
- Jihperng Leu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
Sealing porous dielectrics with silane coupling reagents
- Publication number 20070066079
- Publication date Mar 22, 2007
- Grant Kloster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect adapted for reduced electron scattering
- Publication number 20050224980
- Publication date Oct 13, 2005
- Jihperng Leu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and structure for selective surface passivation
- Publication number 20050087873
- Publication date Apr 28, 2005
- Chih-I Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Sealing porous dielectrics with silane coupling reagents
- Publication number 20050020074
- Publication date Jan 27, 2005
- Grant Kloster
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to reduce the copper line roughness for increased electrical...
- Publication number 20040229462
- Publication date Nov 18, 2004
- David H. Gracias
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and structure for selective surface passivation
- Publication number 20040126482
- Publication date Jul 1, 2004
- Chih-I Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MAKING A SEMICONDUCTOR DEVICE BY FORMING A MASKING LAYER...
- Publication number 20040009662
- Publication date Jan 15, 2004
- Hyun-Mog Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for improving nucleation and adhesion of CVD and ALD films d...
- Publication number 20030205823
- Publication date Nov 6, 2003
- Jihperng Leu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for improving nucleation and adhesion of CVD and ALD films d...
- Publication number 20030064607
- Publication date Apr 3, 2003
- Jihperng Leu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Person

Patents Grantslast 30 patents

Sealing porous dielectrics with silane coupling reagents

Method to reduce the copper line roughness for increased electrical...

Sealing porous dielectrics with silane coupling reagents

Method of making a semiconductor device by forming a masking layer...

Method for improving nucleation and adhesion of CVD and ALD films d...

Patents Applicationslast 30 patents

Sealing porous dielectrics with silane coupling reagents

Interconnect adapted for reduced electron scattering

Method and structure for selective surface passivation

Sealing porous dielectrics with silane coupling reagents

Method to reduce the copper line roughness for increased electrical...

Method and structure for selective surface passivation

METHOD OF MAKING A SEMICONDUCTOR DEVICE BY FORMING A MASKING LAYER...

Method for improving nucleation and adhesion of CVD and ALD films d...

Method for improving nucleation and adhesion of CVD and ALD films d...