Chih-Kang PENG

Person

Toufen City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package structure having photonic integrated circuit
- Patent number 11,988,867
- Issue date May 21, 2024
- Molex, LLC
- Chih-Wei Peng
- G02 - OPTICS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,942,549
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET device and method of forming same
- Patent number 11,862,508
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Bo-Cyuan Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure with high aspect ratio
- Patent number 11,823,960
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Han-Pin Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cyclic spin-on coating process for forming dielectric material
- Patent number 11,791,154
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Je-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for mandrel and spacer patterning
- Patent number 11,748,540
- Issue date Sep 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus for chemical mechanical polishing process
- Patent number 11,682,552
- Issue date Jun 20, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-I Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,527,653
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fiber spreading apparatus
- Patent number 11,519,107
- Issue date Dec 6, 2022
- Industrial Technology Research Institute
- Chih-Kang Peng
- D01 - NATURAL OR ARTIFICIAL THREADS OR FIBRES SPINNING
Information Patent Grant
Cyclic spin-on coating process for forming dielectric material
- Patent number 11,450,526
- Issue date Sep 20, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Je-Ming Kuo
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Semiconductor device structure with salicide layer and method for f...
- Patent number 11,444,173
- Issue date Sep 13, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsiang-Ku Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit isolation feature and method of forming the same
- Patent number 11,387,138
- Issue date Jul 12, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Tang Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming isolation layer
- Patent number 11,227,788
- Issue date Jan 18, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Teng-Chun Tsai
- B82 - NANO-TECHNOLOGY
Information Patent Grant
FinFET structure and device
- Patent number 11,222,826
- Issue date Jan 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned insulated film for high-K metal gate device
- Patent number 11,094,545
- Issue date Aug 17, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jin-Aun Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for mandrel and spacer patterning
- Patent number 11,010,526
- Issue date May 18, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Gap-fill method having improved gap-fill capability
- Patent number 10,943,820
- Issue date Mar 9, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation and in-situ treatment processes for gap fill layers
- Patent number 10,937,686
- Issue date Mar 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jian-Shiou Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure with high aspect ratio
- Patent number 10,840,154
- Issue date Nov 17, 2020
- Taiwan Semiconductor Manufacturing Co. LTD
- Han-Pin Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional structure
- Patent number 10,751,970
- Issue date Aug 25, 2020
- Industrial Technology Research Institute
- Jih-Hsiang Yeh
- B32 - LAYERED PRODUCTS
Information Patent Grant
Post UV cure for gapfill improvement
- Patent number 10,727,064
- Issue date Jul 28, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- De-Wei Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming isolation layer
- Patent number 10,707,114
- Issue date Jul 7, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Teng-Chun Tsai
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Semiconductor device and method for atomic layer deposition of a di...
- Patent number 10,643,902
- Issue date May 5, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yen-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Projection system, light beam generating device thereof and method...
- Patent number 10,567,716
- Issue date Feb 18, 2020
- Coretronic Corporation
- Chih-Hsun Peng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Projector, projecting system and transmission delay detection metho...
- Patent number 10,531,056
- Issue date Jan 7, 2020
- Coretronic Corporation
- Jian-Jiun Wu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method and structure for mandrel and spacer patterning
- Patent number 10,521,541
- Issue date Dec 31, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
FinFET cut-last process using oxide trench fill
- Patent number 10,483,169
- Issue date Nov 19, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET device with oxidation-resist STI liner structure
- Patent number 10,468,409
- Issue date Nov 5, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Szu-Ping Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for chemical mechanical polishing process
- Patent number 10,460,926
- Issue date Oct 29, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-I Peng
- B24 - GRINDING POLISHING
Information Patent Grant
Method of forming isolation layer
- Patent number 10,418,271
- Issue date Sep 17, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Teng-Chun Tsai
- B82 - NANO-TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240204104
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Methods of Forming the Same
- Publication number 20240186190
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-I Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSHEET OF SOLAR CELL MODULE AND SOLAR CELL MODULE INCLUDING THEREOF
- Publication number 20240162359
- Publication date May 16, 2024
- Industrial Technology Research Institute
- Chih-Kang Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE WITH HIGH ASPECT RATIO
- Publication number 20240047276
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-Pin CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cyclic Spin-On Coating Process for Forming Dielectric Material
- Publication number 20230411150
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Je-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR CHEMICAL MECHANICAL POLISHING PROCESS
- Publication number 20230274929
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-I PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20230103640
- Publication date Apr 6, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230041640
- Publication date Feb 9, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIA-HO CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINFET DEVICE AND METHOD OF FORMING SAME
- Publication number 20220384249
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Cyuan Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20220376079
- Publication date Nov 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiang-Ku SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cyclic Spin-On Coating Process for Forming Dielectric Material
- Publication number 20220367180
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Je-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT ISOLATION FEATURE AND METHOD OF FORMING THE SAME
- Publication number 20220344199
- Publication date Oct 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Tang Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method And Structure For Mandrel And Spacer Patterning
- Publication number 20220237356
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FINFET DEVICE AND METHOD OF FORMING SAME
- Publication number 20220051932
- Publication date Feb 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Cyuan Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE HAVING PHOTONIC INTEGRATED CIRCUIT
- Publication number 20220050245
- Publication date Feb 17, 2022
- Molex, LLC
- Chih-Wei PENG
- G02 - OPTICS
Information Patent Application
Semiconductor Device and Method of Manufacture
- Publication number 20220029011
- Publication date Jan 27, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan-Yi Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Structure for Mandrel and Spacer Patterning
- Publication number 20210232747
- Publication date Jul 29, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FIBER SPREADING APPARATUS
- Publication number 20210156054
- Publication date May 27, 2021
- Industrial Technology Research Institute
- Chih-Kang Peng
- D02 - YARNS MECHANICAL FINISHING OF YARNS OR ROPES WARPING OR BEAMING
Information Patent Application
METHOD FOR FORMING SEMICONDUCTOR STRUCTURE WITH HIGH ASPECT RATIO
- Publication number 20210043523
- Publication date Feb 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Han-Pin CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE DISPLAY DEVICE, THREE-DIMENSIONAL IMAGE PROCESSING CIRCUIT AN...
- Publication number 20210006768
- Publication date Jan 7, 2021
- CORETRONIC CORPORATION
- Chih-Hsun Peng
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
GAP-FILL METHOD HAVING IMPROVED GAP-FILL CAPABILITY
- Publication number 20200365454
- Publication date Nov 19, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wan-Yi KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING ISOLATION LAYER
- Publication number 20200335388
- Publication date Oct 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Teng-Chun TSAI
- B82 - NANO-TECHNOLOGY
Information Patent Application
Method and Structure for Mandrel and Spacer Patterning
- Publication number 20200134250
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Ming Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Integrated Circuit Dielectric Material
- Publication number 20200098616
- Publication date Mar 26, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Tang Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINFET STRUCTURE AND DEVICE
- Publication number 20200083109
- Publication date Mar 12, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR CHEMICAL MECHANICAL POLISHING PROCESS
- Publication number 20200051809
- Publication date Feb 13, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-I PENG
- B24 - GRINDING POLISHING
Information Patent Application
PROJECTION SYSTEM, LIGHT BEAM GENERATING DEVICE THEREOF AND METHOD...
- Publication number 20200014894
- Publication date Jan 9, 2020
- CORETRONIC CORPORATION
- Chih-Hsun Peng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PROJECTOR, PROJECTING SYSTEM AND TRANSMISSION DELAY DETECTION METHO...
- Publication number 20190373231
- Publication date Dec 5, 2019
- CORETRONIC CORPORATION
- Jian-Jiun Wu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Cyclic Spin-On Coating Process for Forming Dielectric Material
- Publication number 20190371602
- Publication date Dec 5, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Je-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-Aligned Insulated Film for High-K Metal Gate Device
- Publication number 20190341263
- Publication date Nov 7, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jin-Aun Ng
- H01 - BASIC ELECTRIC ELEMENTS

Chih-Kang PENG

Person

Patents Grantslast 30 patents

Package structure having photonic integrated circuit

Semiconductor device and method of manufacture

FinFET device and method of forming same

Method for forming semiconductor structure with high aspect ratio

Cyclic spin-on coating process for forming dielectric material

Method and structure for mandrel and spacer patterning

Apparatus for chemical mechanical polishing process

Semiconductor device and method of manufacture

Fiber spreading apparatus

Cyclic spin-on coating process for forming dielectric material

Semiconductor device structure with salicide layer and method for f...

Integrated circuit isolation feature and method of forming the same

Method of forming isolation layer

FinFET structure and device

Self-aligned insulated film for high-K metal gate device

Method and structure for mandrel and spacer patterning

Gap-fill method having improved gap-fill capability

Formation and in-situ treatment processes for gap fill layers

Method for forming semiconductor structure with high aspect ratio

Three-dimensional structure

Post UV cure for gapfill improvement

Method of forming isolation layer

Semiconductor device and method for atomic layer deposition of a di...

Projection system, light beam generating device thereof and method...

Projector, projecting system and transmission delay detection metho...

Method and structure for mandrel and spacer patterning

FinFET cut-last process using oxide trench fill

FinFET device with oxidation-resist STI liner structure

Method and apparatus for chemical mechanical polishing process

Method of forming isolation layer

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

Semiconductor Device and Methods of Forming the Same

BACKSHEET OF SOLAR CELL MODULE AND SOLAR CELL MODULE INCLUDING THEREOF

METHOD FOR FORMING SEMICONDUCTOR STRUCTURE WITH HIGH ASPECT RATIO

Cyclic Spin-On Coating Process for Forming Dielectric Material

METHOD AND SYSTEM FOR CHEMICAL MECHANICAL POLISHING PROCESS

Semiconductor Device and Method of Manufacture

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

FINFET DEVICE AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICE STRUCTURE

Cyclic Spin-On Coating Process for Forming Dielectric Material

INTEGRATED CIRCUIT ISOLATION FEATURE AND METHOD OF FORMING THE SAME

Method And Structure For Mandrel And Spacer Patterning

FINFET DEVICE AND METHOD OF FORMING SAME

PACKAGE STRUCTURE HAVING PHOTONIC INTEGRATED CIRCUIT

Semiconductor Device and Method of Manufacture

Method and Structure for Mandrel and Spacer Patterning

FIBER SPREADING APPARATUS

METHOD FOR FORMING SEMICONDUCTOR STRUCTURE WITH HIGH ASPECT RATIO

IMAGE DISPLAY DEVICE, THREE-DIMENSIONAL IMAGE PROCESSING CIRCUIT AN...

GAP-FILL METHOD HAVING IMPROVED GAP-FILL CAPABILITY

METHOD OF FORMING ISOLATION LAYER

Method and Structure for Mandrel and Spacer Patterning

Integrated Circuit Dielectric Material

FINFET STRUCTURE AND DEVICE

APPARATUS FOR CHEMICAL MECHANICAL POLISHING PROCESS

PROJECTION SYSTEM, LIGHT BEAM GENERATING DEVICE THEREOF AND METHOD...

PROJECTOR, PROJECTING SYSTEM AND TRANSMISSION DELAY DETECTION METHO...

Cyclic Spin-On Coating Process for Forming Dielectric Material

Self-Aligned Insulated Film for High-K Metal Gate Device