TREA

Chih-Lung Tai

Follow

Person

  • Taipei City, TW
People

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    ANTENNA STRUCTURE
    • Publication number 20240145918
    • Publication date May 2, 2024
    • WISTRON NEWEB CORP.
    • De-Shao YAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND FORMING METHOD THEREOF
    • Publication number 20240088307
    • Publication date Mar 14, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chih-Hsuan Tai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE
    • Publication number 20240071981
    • Publication date Feb 29, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Mao-Yen Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ANTENNA STRUCTURE
    • Publication number 20240072445
    • Publication date Feb 29, 2024
    • WISTRON NEWEB CORP.
    • Chih-Feng TAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
    • Publication number 20230395490
    • Publication date Dec 7, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chih-Hsuan Tai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SENSOR PACKAGES
    • Publication number 20230352357
    • Publication date Nov 2, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Tsung-Hsien Chiang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
    • Publication number 20230298970
    • Publication date Sep 21, 2023
    • Taiwan Semiconductor Manufacturing company Ltd.
    • KUO WEN CHEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE AND METHOD OF FORMING SAME
    • Publication number 20230266528
    • Publication date Aug 24, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Chih-Hsuan Tai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    UNDER-BUMP-METALLIZATION STRUCTURE AND REDISTRIBUTION LAYER DESIGN...
    • Publication number 20230253384
    • Publication date Aug 10, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Yu-Chih Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DELAMINATION SENSOR
    • Publication number 20230238340
    • Publication date Jul 27, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chih-Hsuan Tai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Devices and Methods of Manufacture
    • Publication number 20230236372
    • Publication date Jul 27, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Chung-Ming Weng
    • G02 - OPTICS
  • Information Patent Application

    MANUFACTURING METHOD OF FINGERPRINT SENSOR
    • Publication number 20230126259
    • Publication date Apr 27, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chih-Hsuan Tai
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    SEMICONDUCTOR DEVICE WITH MULTIPLE POLARITY GROUPS
    • Publication number 20230110420
    • Publication date Apr 13, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Ying-Cheng Tseng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20230106688
    • Publication date Apr 6, 2023
    • WISTRON NEWEB CORPORATION
    • CHIH-FENG TAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DELAMINATION SENSOR
    • Publication number 20220375877
    • Publication date Nov 24, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chih-Hsuan Tai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE
    • Publication number 20220359343
    • Publication date Nov 10, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yu-Chia Lai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME
    • Publication number 20220336404
    • Publication date Oct 20, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Mao-Yen Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ANTENNA STRUCTURE
    • Publication number 20220336956
    • Publication date Oct 20, 2022
    • WISTRON NEWEB CORPORATION
    • Chih-Feng TAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND FORMING METHOD THEREOF
    • Publication number 20220285566
    • Publication date Sep 8, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chih-Hsuan Tai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ANTENNA STRUCTURE AND MOBILE DEVICE INCLUDING THE SAME
    • Publication number 20220255232
    • Publication date Aug 11, 2022
    • WISTRON NEWEB CORPORATION
    • CHIH-FENG TAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20220238406
    • Publication date Jul 28, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chih-Hsuan Tai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE
    • Publication number 20220165689
    • Publication date May 26, 2022
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Chih-Hsuan TAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    VOLTAGE DROOP REDUCTION WITH A SECONDARY POWER SUPPLY
    • Publication number 20220130432
    • Publication date Apr 28, 2022
    • MEDIATEK SINGAPORE PTE LTD
    • Senthilkumar Jayapal
    • G11 - INFORMATION STORAGE
  • Information Patent Application

    SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME
    • Publication number 20220077102
    • Publication date Mar 10, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Mao-Yen Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE
    • Publication number 20220037228
    • Publication date Feb 3, 2022
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Yu-Chia Lai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
    • Publication number 20220013422
    • Publication date Jan 13, 2022
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Mao-Yen Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ANTENNA STRUCTURE
    • Publication number 20210313692
    • Publication date Oct 7, 2021
    • WISTRON NEWEB CORPORATION
    • CHIH-FENG TAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
    • Publication number 20210280511
    • Publication date Sep 9, 2021
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chih-Hsuan Tai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE , PACKAGE-ON-PACKAGE STRUCTURE AND METHOD OF FABR...
    • Publication number 20210272941
    • Publication date Sep 2, 2021
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chih-Hsuan Tai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Devices and Methods of Manufacture
    • Publication number 20210223489
    • Publication date Jul 22, 2021
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Chung-Ming Weng
    • G02 - OPTICS