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Chih-Lung Tai

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  • Taipei City, TW
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    PACKAGE AND METHOD OF FORMING SAME
    • Publication number 20240385370
    • Publication date Nov 21, 2024
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Chih-Hsuan Tai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DELAMINATION SENSOR
    • Publication number 20240387411
    • Publication date Nov 21, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chih-Hsuan Tai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE
    • Publication number 20240371814
    • Publication date Nov 7, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yu-Chia Lai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE
    • Publication number 20240363464
    • Publication date Oct 31, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chih-Hsuan Tai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF FABRICATING PACKAGE STRUCTURE
    • Publication number 20240297163
    • Publication date Sep 5, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chih-Hsuan Tai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE
    • Publication number 20240290734
    • Publication date Aug 29, 2024
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Chih-Hsuan TAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
    • Publication number 20240274541
    • Publication date Aug 15, 2024
    • Taiwan Semiconductor Manufacturing company Ltd.
    • CHIH-HSUAN TAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
    • Publication number 20240194591
    • Publication date Jun 13, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chih-Hsuan Tai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR STRUCTURE HAVING DEEP TRENCH CAPACITOR AND METHOD OF...
    • Publication number 20240170584
    • Publication date May 23, 2024
    • Taiwan Semiconductor Manufacturing company Ltd.
    • CHIH-HSUAN TAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR STRUCTURE WITH TESTING PADS AND METHOD OF MANUFACTURI...
    • Publication number 20240170349
    • Publication date May 23, 2024
    • Taiwan Semiconductor Manufacturing company Ltd.
    • CHIH-HSUAN TAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ANTENNA STRUCTURE
    • Publication number 20240145918
    • Publication date May 2, 2024
    • WISTRON NEWEB CORP.
    • De-Shao YAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND FORMING METHOD THEREOF
    • Publication number 20240088307
    • Publication date Mar 14, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chih-Hsuan Tai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE
    • Publication number 20240071981
    • Publication date Feb 29, 2024
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Mao-Yen Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ANTENNA STRUCTURE
    • Publication number 20240072445
    • Publication date Feb 29, 2024
    • WISTRON NEWEB CORP.
    • Chih-Feng TAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
    • Publication number 20230395490
    • Publication date Dec 7, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chih-Hsuan Tai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SENSOR PACKAGES
    • Publication number 20230352357
    • Publication date Nov 2, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Tsung-Hsien Chiang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
    • Publication number 20230298970
    • Publication date Sep 21, 2023
    • Taiwan Semiconductor Manufacturing company Ltd.
    • KUO WEN CHEN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE AND METHOD OF FORMING SAME
    • Publication number 20230266528
    • Publication date Aug 24, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Chih-Hsuan Tai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    UNDER-BUMP-METALLIZATION STRUCTURE AND REDISTRIBUTION LAYER DESIGN...
    • Publication number 20230253384
    • Publication date Aug 10, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Yu-Chih Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Devices and Methods of Manufacture
    • Publication number 20230236372
    • Publication date Jul 27, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Chung-Ming Weng
    • G02 - OPTICS
  • Information Patent Application

    DELAMINATION SENSOR
    • Publication number 20230238340
    • Publication date Jul 27, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chih-Hsuan Tai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MANUFACTURING METHOD OF FINGERPRINT SENSOR
    • Publication number 20230126259
    • Publication date Apr 27, 2023
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chih-Hsuan Tai
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    SEMICONDUCTOR DEVICE WITH MULTIPLE POLARITY GROUPS
    • Publication number 20230110420
    • Publication date Apr 13, 2023
    • Taiwan Semiconductor Manufacturing Co., Ltd.
    • Ying-Cheng Tseng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE
    • Publication number 20230106688
    • Publication date Apr 6, 2023
    • WISTRON NEWEB CORPORATION
    • CHIH-FENG TAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DELAMINATION SENSOR
    • Publication number 20220375877
    • Publication date Nov 24, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chih-Hsuan Tai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGE STRUCTURE
    • Publication number 20220359343
    • Publication date Nov 10, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Yu-Chia Lai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR STRUCTURE AND METHOD OF FABRICATING THE SAME
    • Publication number 20220336404
    • Publication date Oct 20, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Mao-Yen Chang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ANTENNA STRUCTURE
    • Publication number 20220336956
    • Publication date Oct 20, 2022
    • WISTRON NEWEB CORPORATION
    • Chih-Feng TAI
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND FORMING METHOD THEREOF
    • Publication number 20220285566
    • Publication date Sep 8, 2022
    • Taiwan Semiconductor Manufacturing Company, Ltd.
    • Chih-Hsuan Tai
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ANTENNA STRUCTURE AND MOBILE DEVICE INCLUDING THE SAME
    • Publication number 20220255232
    • Publication date Aug 11, 2022
    • WISTRON NEWEB CORPORATION
    • CHIH-FENG TAI
    • H01 - BASIC ELECTRIC ELEMENTS