Chih Min Pao

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Kaohsiung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Package structure with a heat spreader and manufacturing method the...
- Patent number 6,967,403
- Issue date Nov 22, 2005
- Advanced Semiconductor Engineering, Inc.
- Chi-Ta Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer cassette
- Patent number 6,691,876
- Issue date Feb 17, 2004
- Advanced Semiconductor Engineering, Inc.
- Yu-Pin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating stacked chip package
- Patent number 6,503,776
- Issue date Jan 7, 2003
- Advanced Semiconductor Engineering, Inc.
- Tsung-Ming Pai
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Package structure and manufacturing method thereof
- Publication number 20090079045
- Publication date Mar 26, 2009
- Advanced Semiconductor Engineering, Inc.
- Chih-Min Pao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pakage structure with a heat spreader and manufacturing method thereof
- Publication number 20040256643
- Publication date Dec 23, 2004
- Chi-Ta Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer cassette
- Publication number 20030075518
- Publication date Apr 24, 2003
- Advanced Semiconductor Engineering, Inc.
- Yu-Pin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating stacked chip package
- Publication number 20020090753
- Publication date Jul 11, 2002
- ADVANCED SEMICONDUCTOR ENGINEERING INC.
- Tsung-Ming Pai
- H01 - BASIC ELECTRIC ELEMENTS