Chih-Nan Wei

Follow

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Light compensation scheme, optical machine device, display system a...
- Patent number 8,783,875
- Issue date Jul 22, 2014
- Genesys Logic, Inc.
- Nei-Chiung Perng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wire-bonding method for wire-bonding apparatus
- Patent number 7,581,666
- Issue date Sep 1, 2009
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Two-stage die-bonding method for simultaneous die-bonding of multip...
- Patent number 7,547,575
- Issue date Jun 16, 2009
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIGHT COMPENSATION SCHEME, OPTICAL MACHINE DEVICE, DISPLAY SYSTEM A...
- Publication number 20110080534
- Publication date Apr 7, 2011
- Genesys Logic, Inc.
- Nei-Chiung Perng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Wire-bonding method for wire-bonding apparatus
- Publication number 20080102539
- Publication date May 1, 2008
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE BONDER AND DIE BONDING METHOD THEREOF
- Publication number 20080085571
- Publication date Apr 10, 2008
- Advanced Semiconductor Engeneering, Inc.
- Ho-Ming Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire-bonding apparatus and wire-bonding method thereof
- Publication number 20080035706
- Publication date Feb 14, 2008
- Advanced Semiconductor Engineering, Inc.
- Ho-Ming Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR