Moreover, the wire-bonding apparatus 100 further includes a database 150 used for storing an operating parameter data. The processing unit 110 controls the first capillary 130 and the second capillary 140 according to the operating parameter data. The operating parameter data includes the distance between chips on the substrate, the size of the chips and the coordinates of the chips. When the first capillary 130 and the second capillary 140 wire-bonds the chips at the same time, the coordinates are used for determining whether the distance between the first capillary 130 and the second capillary 140 is within a safe range. Also, the coordinates are used for positioning the first capillary 130 and the second capillary 140 before wire-bonding the chips.
Furthermore, anyone who has ordinary skill in the field of the invention knows that the invention is not limited thereto. For example, the wire-bonding apparatus 100 is a single wire-bonding apparatus with both the first capillary 130 and the second capillary 140. Or, the wire-bonding apparatus 100 includes two wire-bonding apparatuses with single capillary. The processing unit 110 controls the two wire-bonding apparatuses with single capillary at the same time. Besides, the driving unit 120 can be a driving motor in each wire-bonding apparatus with single capillary. Or, the driving unit 120 is an integrated driving motor used to control the first capillary 130 and the second capillary 140 at the same time.
Moreover, the wire-bonding apparatus 100 further includes a positioning device 160 used for confirming a first position of the first chip and a second position of the second chip. The processing unit 110 controls the first capillary 130 and the second capillary 140 according to the first position and the second position. In other words, the positioning device 160 helps to determine if the first capillary 130 and the second capillary 140 are positioned correctly. The positioning device 160 in the present embodiment includes at least a charge coupled device (CCD). For example, the first capillary 130 includes a CCD, and the second capillary 140 includes another CCD as well. After the CCD receives the image of the first capillary 130, the second capillary 140 and the substrate, the image shows on a screen to manually determine whether the first capillary 130 and the second capillary 140 are correctly positioned. Or, after the CCD receives the image of the first capillary 130, the second capillary 140 and the substrate, the processing unit 110 or another computer coupled with the wire-bonding apparatus 100 determines whether the first capillary 130 and the second capillary 140 are positioned correctly. In the present embodiment, the first chip and the second chip are arranged along the same line, such as the same row or the same column, on the substrate. The first capillary 130 and the second capillary 140 moves and wire-bonds the chips along the line.
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Next, in a step 320, it is determined whether the distance D between the first chip 212 and the second chip 214 is greater than the predetermined distance or not. Preferably, the predetermined distance is stored in the database 150. The step 320 prevents the first capillary 130 and the second capillary 140 from colliding with each other when the distance D is too small.
Therefore, when the distance D is less than the predetermined distance, the second capillary 140 moves away from the first capillary 130 to be over a third chip 216, as shown in a step 330. In the present embodiment, the first chip 212, the second chip 214 and the third chip 216 are arranged substantially along a line on the substrate 210, such as a row. For example, the first capillary 130 and the second capillary 140 move and wire-bond the chips along the same row. However, the invention is not limited thereto. For example, the first chip 212, the second chip 214 and the third chip 216 are arranged in the same column, and the first capillary 130 and the second capillary 140 move and wire-bond the chips along the same column.
Then, in a step 340, the processing unit 110 outputs signals to the first capillary 130 and the second capillary 140. As a result, the first capillary 130 and the second capillary 140 are positioned corresponding to the first chip 212 and the third chip 216 respectively.
Afterwards, in a step 350, the first capillary 130 and the second capillary 140 wire-bond the first chip 212 and the third chip 216 at the same time.
In the step 320, when the distance D between the first chip 212 and the second chip 214 is greater than the predetermined distance, the method goes to the step 350. The processing unit 110 outputs the signals to the first capillary 130 and the second capillary 140 respectively. As a result, the first capillary 130 and the second capillary 140 are positioned corresponding to the first chip 212 and the second chip 214 respectively. Then, the first capillary 130 and the second capillary 140 wire-bond the first chip 212 and the second chip 214 respectively at the same time.
After wire-bonding the first chip 212 and the second chip 214 or the third chip 216 respectively, the first capillary 130 and the second capillary 140 move and then wire-bond the next two chips along the same row or the same column. In the present embodiment, the first capillary 130 and the second capillary 140 move along the same row. Basically, the first capillary 130 and the second capillary 140 are positioned only in the beginning of wire-bonding. Also, the distance between the first capillary 130 and the second capillary 140 is determined only in the beginning of wire-bonding. The following chips are arranged with the same distance from the adjacent ones. Therefore, the first capillary 130 and the second capillary 140 only need to move the same distance to be positioned corresponding to the next two chips and then wire-bond the chips until all the chips on the substrate 210 are wire-bonded.
However, anyone who has ordinary skill in the field of the invention knows that the invention is not limited thereto. For example, the wire-bonding apparatus 100 includes more than two capillaries. As long as the capillaries wire-bond the chips along the same line at the same time, the invention encompasses such modification. Furthermore, the invention can be applied to a chip-bonding apparatus. The first capillary 130 and the second capillary 140 are replaced by chip-bonders. Then, the chips are wire-bonded by the same method.
In the wire-bonding apparatus and the wire-bonding method thereof according to the present embodiment of the invention, at least two capillaries bond the chips along the same line at the same time. Therefore, the speed of wire-bonding is increased greatly without expanding the producing line.
While the invention has been described by way of example and in terms of a preferred embodiment, it is to be understood that the invention is not limited thereto. On the contrary, it is intended to cover various modifications and similar arrangements and procedures, and the scope of the appended claims therefore should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements and procedures.
Number | Date | Country | Kind |
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95129814 | Aug 2006 | TW | national |