Chih-Wei CHANG

Person

Hefei, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Chip and memory
- Patent number 12,125,802
- Issue date Oct 22, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip bonding method and semiconductor chip structure
- Patent number 12,119,315
- Issue date Oct 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,990,390
- Issue date May 21, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure, forming method thereof, and semiconductor...
- Patent number 11,854,885
- Issue date Dec 26, 2023
- Changxin Memory Technologies, Inc.
- Chih-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods for manufacturing thereof
- Patent number 11,776,848
- Issue date Oct 3, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and forming method thereof
- Patent number 11,581,219
- Issue date Feb 14, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory device with a through hole structure, semiconductor device a...
- Patent number 11,462,514
- Issue date Oct 4, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer, semiconductor device and method for manufacturing the same
- Patent number 11,342,236
- Issue date May 24, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered memory device with through-silicon via(TSV), semicondu...
- Patent number 11,276,671
- Issue date Mar 15, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER BONDING DEVICE AND WAFER BONDING METHOD
- Publication number 20230223377
- Publication date Jul 13, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- CHIH-WEI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR WAFER BONDING ALIGNMENT
- Publication number 20230223290
- Publication date Jul 13, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- CHIH-WEI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON CONDUCTIVE FILM, METHOD FOR FORMING NON CONDUCTIVE FILM, CHIP P...
- Publication number 20230215832
- Publication date Jul 6, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- CHIH-WEI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20230187316
- Publication date Jun 15, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Chih-Wei CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE, FORMING METHOD THEREOF, AND SEMICONDUCTOR...
- Publication number 20230055577
- Publication date Feb 23, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Wei CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR STRUCTURE, AND SEMICONDUCTOR S...
- Publication number 20230013953
- Publication date Jan 19, 2023
- Changxin Memory Technologies, Inc.
- Chih-Wei CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING METHOD AND SEMICONDUCTOR CHIP STRUCTURE
- Publication number 20230011840
- Publication date Jan 12, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- CHIH-WEI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF SEMICONDUCTOR S...
- Publication number 20220293542
- Publication date Sep 15, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- CHIH-WEI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR...
- Publication number 20220293456
- Publication date Sep 15, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Chih-Wei CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP AND MEMORY
- Publication number 20220077079
- Publication date Mar 10, 2022
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Chih-Wei CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20220028796
- Publication date Jan 27, 2022
- Changxin Memory Technologies, Inc.
- PING-HENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20220005747
- Publication date Jan 6, 2022
- Changxin Memory Technologies, Inc.
- PING-HENG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20210366798
- Publication date Nov 25, 2021
- Changxin Memory Technologies, Inc.
- Chih-Wei CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, PAD STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20210233822
- Publication date Jul 29, 2021
- Changxin Memory Technologies, Inc.
- Chih-Wei CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210217674
- Publication date Jul 15, 2021
- Changxin Memory Technologies, Inc.
- Chih-Wei CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS FOR MANUFACTURING THEREOF
- Publication number 20210202315
- Publication date Jul 1, 2021
- Changxin Memory Technologies, Inc.
- Chih-Wei CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING TH...
- Publication number 20210183820
- Publication date Jun 17, 2021
- Changxin Memory Technologies, Inc.
- Chih-Wei CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING TH...
- Publication number 20210074685
- Publication date Mar 11, 2021
- Changxin Memory Technologies, Inc.
- Chih-Wei CHANG
- H01 - BASIC ELECTRIC ELEMENTS

Chih-Wei CHANG

Person

Patents Grantslast 30 patents

Chip and memory

Chip bonding method and semiconductor chip structure

Semiconductor structure

Semiconductor structure, forming method thereof, and semiconductor...

Semiconductor device and methods for manufacturing thereof

Semiconductor structure and forming method thereof

Memory device with a through hole structure, semiconductor device a...

Wafer, semiconductor device and method for manufacturing the same

Multilayered memory device with through-silicon via(TSV), semicondu...

Patents Applicationslast 30 patents

WAFER BONDING DEVICE AND WAFER BONDING METHOD

DEVICE AND METHOD FOR WAFER BONDING ALIGNMENT

NON CONDUCTIVE FILM, METHOD FOR FORMING NON CONDUCTIVE FILM, CHIP P...

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR...

SEMICONDUCTOR STRUCTURE, FORMING METHOD THEREOF, AND SEMICONDUCTOR...

METHOD FOR FABRICATING SEMICONDUCTOR STRUCTURE, AND SEMICONDUCTOR S...

CHIP BONDING METHOD AND SEMICONDUCTOR CHIP STRUCTURE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF SEMICONDUCTOR S...

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR...

CHIP AND MEMORY

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF

SEMICONDUCTOR STRUCTURE

PACKAGED STRUCTURE AND FORMING METHOD THEREOF

SEMICONDUCTOR DEVICE, PAD STRUCTURE AND FABRICATION METHOD THEREOF

WAFER, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHODS FOR MANUFACTURING THEREOF

MEMORY DEVICE, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING TH...

MEMORY DEVICE, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING TH...