Chin-Chang Cheng

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Nanotube growth and device formation
- Patent number 7,964,174
- Issue date Jun 21, 2011
- Intel Corporation
- Valery M. Dubin
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method of making a bottomless via
- Patent number 7,694,413
- Issue date Apr 13, 2010
- Intel Corporation
- Steven W. Johnston
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of forming channels on an integrated circuit die and die co...
- Patent number 7,663,230
- Issue date Feb 16, 2010
- Intel Corporation
- Shriram Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal electroless deposition of barrier layer materials
- Patent number 7,629,252
- Issue date Dec 8, 2009
- Intel Corporation
- Kevin P. O'Brien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless plating systems and methods
- Patent number 7,597,763
- Issue date Oct 6, 2009
- Intel Corporation
- Valery M. Dubin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Treating a liner layer to reduce surface oxides
- Patent number 7,470,617
- Issue date Dec 30, 2008
- Intel Corporation
- Ramanan Chebiam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming channels on an integrated circuit die and die co...
- Patent number 7,358,201
- Issue date Apr 15, 2008
- Intel Corporation
- Shriram Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple stage electroless deposition of a metal layer
- Patent number 7,285,494
- Issue date Oct 23, 2007
- Intel Corporation
- Chin-Chang Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multiple stage electroless deposition of a metal layer
- Patent number 7,262,504
- Issue date Aug 28, 2007
- Intel Corporation
- Chin-Chang Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for improving selectivity of electroless metal deposition
- Patent number 7,223,694
- Issue date May 29, 2007
- Intel Corporation
- Chin-Chang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preparation of electroless deposition solutions
- Patent number 7,087,104
- Issue date Aug 8, 2006
- Intel Corporation
- Hok-Kin Choi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multiple stage electroless deposition of a metal layer
- Patent number 7,049,234
- Issue date May 23, 2006
- Intel Corporation
- Chin-Chang Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Use of conductive electrolessly deposited etch stop layers, liner l...
- Patent number 7,008,872
- Issue date Mar 7, 2006
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures containing conductive electrolessly deposit...
- Patent number 6,958,547
- Issue date Oct 25, 2005
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming channels on an integrated circuit die and die co...
- Patent number 6,919,231
- Issue date Jul 19, 2005
- Intel Corporation
- Shriram Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for electroless spray deposition
- Patent number 6,843,852
- Issue date Jan 18, 2005
- Intel Corporation
- Valery M. Dubin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of treating an electroless plating waste
- Patent number 6,733,679
- Issue date May 11, 2004
- Intel Corporation
- Valery M. Dubin
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATING A BOTTOMLESS VIA TO PROMOTE ADSORPTION OF ANTISUPPRESSO...
- Publication number 20100164108
- Publication date Jul 1, 2010
- Steven W. Johnston
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
NANOTUBE GROWTH AND DEVICE FORMATION
- Publication number 20080311400
- Publication date Dec 18, 2008
- Valery M. Dubin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Treating a liner layer to reduce surface oxides
- Publication number 20080213994
- Publication date Sep 4, 2008
- Ramanan Chebiam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of forming channels on an integrated circuit die and die co...
- Publication number 20080185714
- Publication date Aug 7, 2008
- Intel Corporation
- Shriram Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrating a bottomless via to promote adsorption of antisuppresso...
- Publication number 20080000678
- Publication date Jan 3, 2008
- Steven W. Johnston
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Conformal electroless deposition of barrier layer materials
- Publication number 20070148952
- Publication date Jun 28, 2007
- Kevin P. O'Brien
- B82 - NANO-TECHNOLOGY
Information Patent Application
Catalytic activation technique for electroless metallization of int...
- Publication number 20070066081
- Publication date Mar 22, 2007
- Chin-Chang Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Etch stopless dual damascene structure and method of fabrication
- Publication number 20060216929
- Publication date Sep 28, 2006
- Hyun-Mog Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Uniformity in batch spray processing using independent cassette rot...
- Publication number 20060131276
- Publication date Jun 22, 2006
- Steven W. Johnston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to fabricate copper-cobalt interconnects
- Publication number 20060063382
- Publication date Mar 23, 2006
- Valery M. Dubin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Multiple stage electroless deposition of a metal layer
- Publication number 20050266265
- Publication date Dec 1, 2005
- Chin-Chang Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Multiple stage electroless deposition of a metal layer
- Publication number 20050260339
- Publication date Nov 24, 2005
- Chin-Chang Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods of forming channels on an integrated circuit die and die co...
- Publication number 20050215058
- Publication date Sep 29, 2005
- Shriram Ramanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroless plating systems and methods
- Publication number 20050163916
- Publication date Jul 28, 2005
- Valery M. Dubin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method to fabricate amorphous electroless metal layers
- Publication number 20050147762
- Publication date Jul 7, 2005
- Valery M. Dubin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Nanotube growth and device formation
- Publication number 20050147746
- Publication date Jul 7, 2005
- Valery M. Dubin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Multiple stage electroless deposition of a metal layer
- Publication number 20050136654
- Publication date Jun 23, 2005
- Chin-Chang Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Apparatus and method for electroless spray deposition
- Publication number 20050008786
- Publication date Jan 13, 2005
- Valery M. Dubin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Preparation of electroless deposition solutions
- Publication number 20040265501
- Publication date Dec 30, 2004
- Intel Corporation
- Hok-Kin Choi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for improving selectivity of electroless metal deposition
- Publication number 20040253814
- Publication date Dec 16, 2004
- Chin-Chang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Use of conductive electrolessly deposited etch stop layers, liner l...
- Publication number 20030207560
- Publication date Nov 6, 2003
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect structures containing conductive electrolessly deposit...
- Publication number 20030207561
- Publication date Nov 6, 2003
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for electroless spray deposition
- Publication number 20030134047
- Publication date Jul 17, 2003
- Valery M. Dubin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of treating an electroless plating waste
- Publication number 20030085177
- Publication date May 8, 2003
- Valery M. Dubin
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE

Chin-Chang Cheng

Person

Patents Grantslast 30 patents

Nanotube growth and device formation

Method of making a bottomless via

Methods of forming channels on an integrated circuit die and die co...

Conformal electroless deposition of barrier layer materials

Electroless plating systems and methods

Treating a liner layer to reduce surface oxides

Methods of forming channels on an integrated circuit die and die co...

Multiple stage electroless deposition of a metal layer

Multiple stage electroless deposition of a metal layer

Method for improving selectivity of electroless metal deposition

Preparation of electroless deposition solutions

Multiple stage electroless deposition of a metal layer

Use of conductive electrolessly deposited etch stop layers, liner l...

Interconnect structures containing conductive electrolessly deposit...

Methods of forming channels on an integrated circuit die and die co...

Apparatus and method for electroless spray deposition

Method of treating an electroless plating waste

Patents Applicationslast 30 patents

INTEGRATING A BOTTOMLESS VIA TO PROMOTE ADSORPTION OF ANTISUPPRESSO...

NANOTUBE GROWTH AND DEVICE FORMATION

Treating a liner layer to reduce surface oxides

Methods of forming channels on an integrated circuit die and die co...

Integrating a bottomless via to promote adsorption of antisuppresso...

Conformal electroless deposition of barrier layer materials

Catalytic activation technique for electroless metallization of int...

Etch stopless dual damascene structure and method of fabrication

Uniformity in batch spray processing using independent cassette rot...

Method to fabricate copper-cobalt interconnects

Multiple stage electroless deposition of a metal layer

Multiple stage electroless deposition of a metal layer

Methods of forming channels on an integrated circuit die and die co...

Electroless plating systems and methods

Method to fabricate amorphous electroless metal layers

Nanotube growth and device formation

Multiple stage electroless deposition of a metal layer

Apparatus and method for electroless spray deposition

Preparation of electroless deposition solutions

Method for improving selectivity of electroless metal deposition

Use of conductive electrolessly deposited etch stop layers, liner l...

Interconnect structures containing conductive electrolessly deposit...

Apparatus and method for electroless spray deposition

Method of treating an electroless plating waste