Chin Kee Leow

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Melaka, MY

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Patents Grantslast 30 patents

Information Patent Grant
Chip package and method of forming a chip package
- Patent number 12,278,171
- Issue date Apr 15, 2025
- Infineon Technologies AG
- Chan Lam Cha
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
- Publication number 20250210478
- Publication date Jun 26, 2025
- INFINEON TECHNOLOGIES AG
- Chan Lam Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED POWER DIE PACKAGE WITH VERTICAL INTERCONNECT
- Publication number 20250140734
- Publication date May 1, 2025
- Infineon Technologies Austria AG
- Lee Siang Tey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INTERCONNECT AND POWER CONNECTION BY METALLIZ...
- Publication number 20230197585
- Publication date Jun 22, 2023
- Chan Lam Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF FORMING A CHIP PACKAGE
- Publication number 20230197586
- Publication date Jun 22, 2023
- INFINEON TECHNOLOGIES AG
- Chan Lam Cha
- H01 - BASIC ELECTRIC ELEMENTS