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Chin-Kun Lo
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Hsinchu Hsien, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Metal bump with an insulating sidewall and method of fabricating th...
Patent number
7,041,589
Issue date
May 9, 2006
AU Optronics Corp.
Ming-Yi Lay
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Metal bump with an insulating sidewall and method of fabricating th...
Patent number
6,958,539
Issue date
Oct 25, 2005
Au Optronics Corporation
Ming-Yi Lay
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of local oxidation using etchant and oxidizer
Patent number
6,169,035
Issue date
Jan 2, 2001
United Microelectronic Corp.
Chuan H. Liu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Metal bump with an insulating sidewall and method of fabricating th...
Publication number
20040048202
Publication date
Mar 11, 2004
AU Optronics Corporation
Ming-Yi Lay
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Metal bump with an insulating sidewall and method of fabricating th...
Publication number
20020048924
Publication date
Apr 25, 2002
Ming-Yi Lay
H01 - BASIC ELECTRIC ELEMENTS