Chin-Li Kao

Person

Penghu County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,113,044
- Issue date Oct 8, 2024
- Advanced Semiconductor Engineering, Inc.
- Shan-Bo Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and method of manufacturing the same
- Patent number 11,855,034
- Issue date Dec 26, 2023
- Advanced Semiconductor Engineering, Inc.
- Chung-Hung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure and semiconductor package structure
- Patent number 11,621,217
- Issue date Apr 4, 2023
- Advanced Semiconductor Engineering, Inc.
- Chun-Wei Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 11,430,761
- Issue date Aug 30, 2022
- Advanced Semiconductor Engineering, Inc.
- Yun-Ching Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for manufacturing the same
- Patent number 11,309,253
- Issue date Apr 19, 2022
- Advanced Semiconductor Engineering, Inc.
- Chin-Li Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,257,776
- Issue date Feb 22, 2022
- Advanced Semiconductor Engineering, Inc.
- Yung-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method for manufacturing the same
- Patent number 11,244,909
- Issue date Feb 8, 2022
- Advanced Semiconductor Engineering, Inc.
- Fan-Yu Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package including thermal dissipation element...
- Patent number 11,127,650
- Issue date Sep 21, 2021
- Advanced Semiconductor Engineering, Inc.
- Chien Lin Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 11,011,444
- Issue date May 18, 2021
- Advanced Semiconductor Engineering, Inc.
- Ya-Yu Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 10,840,219
- Issue date Nov 17, 2020
- Advanced Semiconductor Engineering, Inc.
- Bo-Syun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,541,198
- Issue date Jan 21, 2020
- Advanced Semiconductor Engineering, Inc.
- Chien Lin Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 10,332,862
- Issue date Jun 25, 2019
- Advanced Semiconductor Engineering, Inc.
- Bo-Syun Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Measurement equipment
- Patent number 10,222,209
- Issue date Mar 5, 2019
- Advanced Semiconductor Engineering, Inc.
- Seungbae Park
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 10,134,677
- Issue date Nov 20, 2018
- Advanced Semiconductor Engineering, Inc.
- Chien Lin Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a trench penetrating a main body
- Patent number 10,056,325
- Issue date Aug 21, 2018
- Advanced Semiconductor Engineering, Inc.
- Chin-Li Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacturing the same
- Patent number 10,037,974
- Issue date Jul 31, 2018
- Advanced Semiconductor Engineering, Inc.
- Chien Lin Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device and method of manufacturing the same
- Patent number 9,917,043
- Issue date Mar 13, 2018
- Advanced Semiconductor Engineering, Inc.
- Chien Lin Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Measurement equipment
- Patent number 9,891,048
- Issue date Feb 13, 2018
- Advanced Semiconductor Engineering, Inc.
- Seungbae Park
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor devices and methods of manufacturing the same
- Patent number 9,773,753
- Issue date Sep 26, 2017
- Advanced Semiconductor Engineering, Inc.
- Yuan-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 9,589,840
- Issue date Mar 7, 2017
- Advanced Semiconductor Engineering, Inc.
- Chin-Li Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 9,589,871
- Issue date Mar 7, 2017
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer substrate, semiconductor structure and fabricating proce...
- Patent number 9,478,500
- Issue date Oct 25, 2016
- Advanced Semiconductor Engineering, Inc.
- Chia-Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip packaging process
- Patent number 7,482,204
- Issue date Jan 27, 2009
- Advanced Semiconductor Engineering, Inc.
- Chin-Li Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure and chip packaging process
- Patent number 7,335,982
- Issue date Feb 26, 2008
- Advanced Semiconductor Engineering, Inc.
- Chin-Li Kao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240334586
- Publication date Oct 3, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Hsuan HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE STRUCTURE
- Publication number 20240304450
- Publication date Sep 12, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Hsuan HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20240063159
- Publication date Feb 22, 2024
- Advanced Semiconductor Engineering, Inc.
- An-Hsuan HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230268314
- Publication date Aug 24, 2023
- Advanced Semiconductor Engineering, Inc.
- Shan-Bo WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220384381
- Publication date Dec 1, 2022
- Advanced Semiconductor Engineering, Inc.
- Chung-Hung LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE AND SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20220230946
- Publication date Jul 21, 2022
- Advanced Semiconductor Engineering, Inc.
- Chun-Wei SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210335715
- Publication date Oct 28, 2021
- Advanced Semiconductor Engineering, Inc.
- Chin-Li KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210287999
- Publication date Sep 16, 2021
- Advanced Semiconductor Engineering, Inc.
- Fan-Yu MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20210272866
- Publication date Sep 2, 2021
- Advanced Semiconductor Engineering, Inc.
- Ya-Yu HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE INCLUDING THERMAL DISSIPATION ELEMENT...
- Publication number 20210265231
- Publication date Aug 26, 2021
- Advanced Semiconductor Engineering, Inc.
- Chien Lin CHANG CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210257331
- Publication date Aug 19, 2021
- Advanced Semiconductor Engineering, Inc.
- Yun-Ching HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210082853
- Publication date Mar 18, 2021
- Advanced Semiconductor Engineering, Inc.
- Yung-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20210050273
- Publication date Feb 18, 2021
- Advanced Semiconductor Engineering, Inc.
- Ya-Yu HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190287947
- Publication date Sep 19, 2019
- Advanced Semiconductor Engineering, Inc.
- Bo-Syun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20190074264
- Publication date Mar 7, 2019
- Advanced Semiconductor Engineering, Inc.
- Bo-Syun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180337130
- Publication date Nov 22, 2018
- Advanced Semiconductor Engineering, Inc.
- Chien Lin CHANG CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20180158766
- Publication date Jun 7, 2018
- Advanced Semiconductor Engineering, Inc.
- Chien Lin CHANG CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEASUREMENT EQUIPMENT
- Publication number 20180128612
- Publication date May 10, 2018
- Advanced Semiconductor Engineering, Inc.
- Seungbae PARK
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170263589
- Publication date Sep 14, 2017
- Advanced Semiconductor Engineering, Inc.
- Chien Lin CHANG CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170207153
- Publication date Jul 20, 2017
- Advanced Semiconductor Engineering, Inc.
- Chien Lin CHANG CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170133311
- Publication date May 11, 2017
- Advanced Semiconductor Engineering, Inc.
- Chin-Li KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160300782
- Publication date Oct 13, 2016
- Advanced Semiconductor Engineering, Inc.
- Tang-Yuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER SUBSTRATE, SEMICONDUCTOR STRUCTURE AND FABRICATING PROCE...
- Publication number 20160240481
- Publication date Aug 18, 2016
- Advanced Semiconductor Engineering, Inc.
- Chia-Ching CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEASUREMENT EQUIPMENT
- Publication number 20150211852
- Publication date Jul 30, 2015
- Advanced Semiconductor Engineering, Inc.
- Seungbae PARK
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20140332957
- Publication date Nov 13, 2014
- Advanced Semiconductor Engineering, Inc.
- Chin-Li KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING PROCESS
- Publication number 20080096325
- Publication date Apr 24, 2008
- Advanced Semiconductor Engineering, Inc.
- Chin-Li Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND CHIP MANUFACTURING PROCESS
- Publication number 20070145604
- Publication date Jun 28, 2007
- Advanced Semiconductor Engineering, Inc.
- Chin-Li Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND CHIP PACKAGING PROCESS
- Publication number 20050224956
- Publication date Oct 13, 2005
- Chin-Li Kao
- H01 - BASIC ELECTRIC ELEMENTS

Chin-Li Kao

Person

Patents Grantslast 30 patents

Semiconductor package and manufacturing method thereof

Electronic device package and method of manufacturing the same

Substrate structure and semiconductor package structure

Semiconductor package and method for manufacturing the same

Package structure and method for manufacturing the same

Semiconductor package structure and method for manufacturing the same

Package structure and method for manufacturing the same

Semiconductor device package including thermal dissipation element...

Semiconductor package structure

Semiconductor package structure and method for manufacturing the same

Semiconductor package device and method of manufacturing the same

Semiconductor package structure and method for manufacturing the same

Measurement equipment

Semiconductor package device and method of manufacturing the same

Semiconductor package having a trench penetrating a main body

Semiconductor device package and method of manufacturing the same

Semiconductor package device and method of manufacturing the same

Measurement equipment

Semiconductor devices and methods of manufacturing the same

Semiconductor package and manufacturing method thereof

Semiconductor package structure and method for manufacturing the same

Interposer substrate, semiconductor structure and fabricating proce...

Chip packaging process

Chip package structure and chip packaging process

Patents Applicationslast 30 patents

PACKAGE STRUCTURE

ELECTRONIC PACKAGE STRUCTURE

PACKAGE STRUCTURES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SUBSTRATE STRUCTURE AND SEMICONDUCTOR PACKAGE STRUCTURE

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE PACKAGE INCLUDING THERMAL DISSIPATION ELEMENT...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

MEASUREMENT EQUIPMENT

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

INTERPOSER SUBSTRATE, SEMICONDUCTOR STRUCTURE AND FABRICATING PROCE...

MEASUREMENT EQUIPMENT

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGING PROCESS

CHIP STRUCTURE AND CHIP MANUFACTURING PROCESS

CHIP PACKAGE STRUCTURE AND CHIP PACKAGING PROCESS