Ching-Hohn Len

Follow

Person

Taoyuan City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Electrical device package structure and manufacturing method thereof
- Patent number 11,404,209
- Issue date Aug 2, 2022
- SFI ELECTRONICS TECHNOLOGY INC.
- Ching-Hohn Len
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL DEVICE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20210280373
- Publication date Sep 9, 2021
- SFI Electronics Technology Inc.
- Ching-Hohn Len
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE METHOD FOR ATTACHED SINGLE SMALL SIZE AND ARRAY TYPE OF CHI...
- Publication number 20200411470
- Publication date Dec 31, 2020
- SFI Electronics Technology Inc.
- Ching-Hohn Len
- H01 - BASIC ELECTRIC ELEMENTS