Ching L. Lin

Person

Richardson, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Reduction of punch-thru defects in damascene processing
- Patent number 7,727,885
- Issue date Jun 1, 2010
- Texas Instruments Incorporated
- Phillip Daniel Matz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for processing load distribution for a packetized...
- Patent number 6,772,224
- Issue date Aug 3, 2004
- Spatial Communications Technologies, Inc.
- Lingli Kung
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Reliable interconnects with low via/contact resistance
- Patent number 6,624,066
- Issue date Sep 23, 2003
- Texas Instruments Incorporated
- Jiong-Ping Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System to control the output current with temperature through a con...
- Patent number 6,307,726
- Issue date Oct 23, 2001
- Texas Instruments Incorporated
- Andrew Marshall
- G05 - CONTROLLING REGULATING
Information Patent Grant
System and method for communicating transaction capabilities applic...
- Patent number 6,047,059
- Issue date Apr 4, 2000
- Alcatel USA Sourcing, L.P.
- Ching-Der Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
System and method for implementing programmable transaction capabil...
- Patent number 5,974,252
- Issue date Oct 26, 1999
- Alcatel USA Sourcing, L.P.
- Ching-Der Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
Reduction of punch-thru defects in damascene processing
- Publication number 20080057711
- Publication date Mar 6, 2008
- Texas Instrumentd incorporated
- Phillip Daniel Matz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Harmonic boost signals in up/down direct/super heterodyne conversio...
- Publication number 20040002315
- Publication date Jan 1, 2004
- Ching-Lang Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Harmonic boost technique for direct conversion receiver
- Publication number 20040002319
- Publication date Jan 1, 2004
- Ching-Lang Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Square wave local oscillator technique for direct conversion receiver
- Publication number 20040002320
- Publication date Jan 1, 2004
- Ching-Lang Lin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Nickel SALICIDE process technology for CMOS devices
- Publication number 20030235973
- Publication date Dec 25, 2003
- Jiong-Ping Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and system for processing load distribution for a packetized...
- Publication number 20030053473
- Publication date Mar 20, 2003
- Lingli Kung
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Reliable interconnects with low via/contact resistance
- Publication number 20020110999
- Publication date Aug 15, 2002
- Jiong-Ping Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Elimination of overhang in liner/barrier/seed layers using post-dep...
- Publication number 20020058409
- Publication date May 16, 2002
- Ching-Te Lin
- H01 - BASIC ELECTRIC ELEMENTS

Ching L. Lin

Person

Patents Grantslast 30 patents

Reduction of punch-thru defects in damascene processing

Method and system for processing load distribution for a packetized...

Reliable interconnects with low via/contact resistance

System to control the output current with temperature through a con...

System and method for communicating transaction capabilities applic...

System and method for implementing programmable transaction capabil...

Patents Applicationslast 30 patents

Reduction of punch-thru defects in damascene processing

Harmonic boost signals in up/down direct/super heterodyne conversio...

Harmonic boost technique for direct conversion receiver

Square wave local oscillator technique for direct conversion receiver

Nickel SALICIDE process technology for CMOS devices

Method and system for processing load distribution for a packetized...

Reliable interconnects with low via/contact resistance

Elimination of overhang in liner/barrier/seed layers using post-dep...