Ching-Wen Hsiao

Person

Banqiao, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with inductor windings around a core above an...
- Patent number 12,057,468
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hsien Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump integration with redistribution layer
- Patent number 12,057,423
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation layer and planarization layer and method of forming the...
- Patent number 12,051,622
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer including a copper edge seal ring structure and methods...
- Patent number 12,040,289
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hong-Seng Shue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures in semiconductor packaged device and method of f...
- Patent number 11,990,428
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and methods for forming the same
- Patent number 11,961,791
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure with conductive via structure and method for forming...
- Patent number 11,908,790
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor package, and methods of manufac...
- Patent number 11,901,256
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having conductive pillars with inclined surf...
- Patent number 11,901,323
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chiang-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for detecting interference patterns for under-screen camera,...
- Patent number 11,856,300
- Issue date Dec 26, 2023
- Realtek Semiconductor Corp.
- Yi-Jen Wu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device with discrete blocks
- Patent number 11,855,045
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic interposer including a dual-layer inductor structure and me...
- Patent number 11,769,741
- Issue date Sep 26, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Han Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment mark design for packages
- Patent number 11,742,298
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure and method for forming the same
- Patent number 11,688,708
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging mechanisms for dies with different sizes of connectors
- Patent number 11,488,878
- Issue date Nov 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for determining Moire pattern, method for suppressing Moire...
- Patent number 11,488,286
- Issue date Nov 1, 2022
- Realtek Semiconductor Corp.
- Ching-Ju Hsiao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor packages having conductive pillars with inclined surf...
- Patent number 11,398,444
- Issue date Jul 26, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chiang-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures in semiconductor packaged device and method of f...
- Patent number 11,393,771
- Issue date Jul 19, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image-sensing device and method for auto white balance therefor
- Patent number 11,381,796
- Issue date Jul 5, 2022
- Realtek Semiconductor Corp.
- Ching-Ju Hsiao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Organic interposer including a dual-layer inductor structure and me...
- Patent number 11,348,884
- Issue date May 31, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Han Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures and methods for forming the same
- Patent number 11,342,253
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,244,919
- Issue date Feb 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with discrete blocks
- Patent number 11,217,562
- Issue date Jan 4, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive structures and redistribution circuit structures
- Patent number 11,152,273
- Issue date Oct 19, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shang-Yun Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out interconnect structure and method for forming same
- Patent number 11,133,274
- Issue date Sep 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level embedded heat spreader
- Patent number 11,101,192
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei Sen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package (PoP) device with integrated passive device in a...
- Patent number 10,978,433
- Issue date Apr 13, 2021
- Taiwan Semiconductor Manufacturing Company
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image processing method and electronic device thereof
- Patent number 10,970,822
- Issue date Apr 6, 2021
- Realtek Semiconductor Corp.
- Ching-Ju Hsiao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Packaging mechanisms for dies with different sizes of connectors
- Patent number 10,964,610
- Issue date Mar 30, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging mechanisms for dies with different sizes of connectors
- Patent number 10,879,228
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ORGANIC INTERPOSER INCLUDING A DUAL-LAYER INDUCTOR STRUCTURE AND ME...
- Publication number 20240379589
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Han CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH PULL-IN PLANARIZATION LAYER AND METHOD...
- Publication number 20240379428
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP INTEGRATION WITH REDISTRIBUTION LAYER
- Publication number 20240363569
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE WITH INDUCTOR
- Publication number 20240347578
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsien Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER INCLUDING A COPPER EDGE SEAL RING STRUCTURE AND METHODS...
- Publication number 20240332220
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hong-Seng Shue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES IN SEMICONDUCTOR PACKAGED DEVICE AND METHOD OF F...
- Publication number 20240266304
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hao Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LTF And STF Transmission For Wide Bandwidth 240MHz With More DC Ton...
- Publication number 20240171438
- Publication date May 23, 2024
- MEDIATEK INC.
- Shengquan Hu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHODS OF MANUFAC...
- Publication number 20240145327
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING CONDUCTIVE PILLARS WITH INCLINED SURF...
- Publication number 20240136316
- Publication date Apr 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chiang-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Center RU996 Tone Plan Designs For Wide Bandwidth 240MHz In Wireles...
- Publication number 20240129081
- Publication date Apr 18, 2024
- MEDIATEK INC.
- Shengquan Hu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Semiconductor Device with Discrete Blocks
- Publication number 20240113080
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE WITH CONDUCTIVE PILLAR AND METHOD FOR FORMING THE SAME
- Publication number 20230253356
- Publication date Aug 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low-Power Listen In Wireless Communications
- Publication number 20230117078
- Publication date Apr 20, 2023
- MEDIATEK INC.
- Cheng-Yi Chang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Coverage Enhancement For 6GHz Long Range Wireless Communications
- Publication number 20230117111
- Publication date Apr 20, 2023
- MEDIATEK INC.
- Cheng-Yi Chang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHODS OF MANUFAC...
- Publication number 20230068485
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Jung Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT, SEMICONDUCTOR PACKAGE, AND MANUFACTURING METHOD...
- Publication number 20230065429
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chiang-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER INCLUDING A COPPER EDGE SEAL RING STRUCTURE AND METHODS...
- Publication number 20230065794
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company Limited
- Hong-Seng SHUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230068503
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shan-Yu HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DETECTING INTERFERENCE PATTERNS FOR UNDER-SCREEN CAMERA,...
- Publication number 20230008899
- Publication date Jan 12, 2023
- Realtek Semiconductor Corp.
- YI-JEN WU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Structure with Pull-in Planarization Layer and Method...
- Publication number 20220384259
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Da Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE WITH CONDUCTIVE VIA STRUCTURE
- Publication number 20220367347
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Li YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES IN SEMICONDUCTOR PACKAGED DEVICE AND METHOD OF F...
- Publication number 20220352094
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hao Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING CONDUCTIVE PILLARS WITH INCLINED SURF...
- Publication number 20220310543
- Publication date Sep 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chiang-Jui Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC INTERPOSER INCLUDING A DUAL-LAYER INDUCTOR STRUCTURE AND ME...
- Publication number 20220285295
- Publication date Sep 8, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Han CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structures and Methods for Forming the Same
- Publication number 20220278031
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bump Integration with Redistribution Layer
- Publication number 20220246565
- Publication date Aug 4, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ting-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE WITH CONDUCTIVE VIA STRUCTURE AND METHOD FOR FORMING...
- Publication number 20220216143
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ting-Li YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR, SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND MANUFACTURIN...
- Publication number 20220216295
- Publication date Jul 7, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsien Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC INTERPOSER INCLUDING A DUAL-LAYER INDUCTOR STRUCTURE AND ME...
- Publication number 20220157744
- Publication date May 19, 2022
- Taiwan Semiconductor Manufacturing Company Limited
- Wei-Han CHIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Discrete Blocks
- Publication number 20220122944
- Publication date Apr 21, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS

Ching-Wen Hsiao

Person

Patents Grantslast 30 patents

Semiconductor device with inductor windings around a core above an...

Bump integration with redistribution layer

Passivation layer and planarization layer and method of forming the...

Interposer including a copper edge seal ring structure and methods...

Bonding structures in semiconductor packaged device and method of f...

Package structures and methods for forming the same

Chip structure with conductive via structure and method for forming...

Semiconductor device, semiconductor package, and methods of manufac...

Semiconductor packages having conductive pillars with inclined surf...

Method for detecting interference patterns for under-screen camera,...

Semiconductor device with discrete blocks

Organic interposer including a dual-layer inductor structure and me...

Alignment mark design for packages

Chip structure and method for forming the same

Packaging mechanisms for dies with different sizes of connectors

Method for determining Moire pattern, method for suppressing Moire...

Semiconductor packages having conductive pillars with inclined surf...

Bonding structures in semiconductor packaged device and method of f...

Image-sensing device and method for auto white balance therefor

Organic interposer including a dual-layer inductor structure and me...

Package structures and methods for forming the same

Package structure and method of fabricating the same

Semiconductor device with discrete blocks

Conductive structures and redistribution circuit structures

Fan-out interconnect structure and method for forming same

Wafer level embedded heat spreader

Package-on-package (PoP) device with integrated passive device in a...

Image processing method and electronic device thereof

Packaging mechanisms for dies with different sizes of connectors

Packaging mechanisms for dies with different sizes of connectors

Patents Applicationslast 30 patents

ORGANIC INTERPOSER INCLUDING A DUAL-LAYER INDUCTOR STRUCTURE AND ME...

SEMICONDUCTOR STRUCTURE WITH PULL-IN PLANARIZATION LAYER AND METHOD...

BUMP INTEGRATION WITH REDISTRIBUTION LAYER

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE WITH INDUCTOR

INTERPOSER INCLUDING A COPPER EDGE SEAL RING STRUCTURE AND METHODS...

BONDING STRUCTURES IN SEMICONDUCTOR PACKAGED DEVICE AND METHOD OF F...

LTF And STF Transmission For Wide Bandwidth 240MHz With More DC Ton...

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHODS OF MANUFAC...

SEMICONDUCTOR PACKAGES HAVING CONDUCTIVE PILLARS WITH INCLINED SURF...

Center RU996 Tone Plan Designs For Wide Bandwidth 240MHz In Wireles...

Semiconductor Device with Discrete Blocks

CHIP STRUCTURE WITH CONDUCTIVE PILLAR AND METHOD FOR FORMING THE SAME

Low-Power Listen In Wireless Communications

Coverage Enhancement For 6GHz Long Range Wireless Communications

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHODS OF MANUFAC...

INTEGRATED CIRCUIT, SEMICONDUCTOR PACKAGE, AND MANUFACTURING METHOD...

INTERPOSER INCLUDING A COPPER EDGE SEAL RING STRUCTURE AND METHODS...

CHIP STRUCTURE AND METHOD FOR FORMING THE SAME

METHOD FOR DETECTING INTERFERENCE PATTERNS FOR UNDER-SCREEN CAMERA,...

Semiconductor Structure with Pull-in Planarization Layer and Method...

CHIP STRUCTURE WITH CONDUCTIVE VIA STRUCTURE

BONDING STRUCTURES IN SEMICONDUCTOR PACKAGED DEVICE AND METHOD OF F...

SEMICONDUCTOR PACKAGES HAVING CONDUCTIVE PILLARS WITH INCLINED SURF...

ORGANIC INTERPOSER INCLUDING A DUAL-LAYER INDUCTOR STRUCTURE AND ME...

Package Structures and Methods for Forming the Same

Bump Integration with Redistribution Layer

CHIP STRUCTURE WITH CONDUCTIVE VIA STRUCTURE AND METHOD FOR FORMING...

INDUCTOR, SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND MANUFACTURIN...

ORGANIC INTERPOSER INCLUDING A DUAL-LAYER INDUCTOR STRUCTURE AND ME...

Semiconductor Device with Discrete Blocks