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New Taipei, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor packaging structure and method of fabricating same
Patent number
11,569,195
Issue date
Jan 31, 2023
Kore Semiconductor Co., Ltd.
Ching-Yu Ni
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fan-out packaging structure and method of making same
Patent number
11,462,481
Issue date
Oct 4, 2022
Kore Semiconductor Co., Ltd.
Ying-Chieh Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip packaging structure
Patent number
11,056,411
Issue date
Jul 6, 2021
Socle Technology Corp.
Ching-Yu Ni
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
FAN-OUT PACKAGING STRUCTURE
Publication number
20220344277
Publication date
Oct 27, 2022
Kore Semiconductor Co., Ltd.
YING-CHIEH PAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20220122917
Publication date
Apr 21, 2022
SOCLE TECHNOLOGY CORP.
CHI-TING HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING PACKAGING STRUCTURE
Publication number
20220122951
Publication date
Apr 21, 2022
SOCLE TECHNOLOGY CORP.
CHING-YU NI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BIOCHIP STRUCTURE AND METHOD FOR MAKING SAME
Publication number
20220032292
Publication date
Feb 3, 2022
SOCLE TECHNOLOGY CORP.
HSIANG-HUA LU
B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information
Patent Application
FINGERPRINT IDENTIFICATION CHIP PACKAGE AND METHOD FOR MAKING SAME
Publication number
20210313244
Publication date
Oct 7, 2021
SOCLE TECHNOLOGY CORP.
HSIANG-HUA LU
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
BIOCHIP PACKAGING STRUCTURE
Publication number
20210154666
Publication date
May 27, 2021
HON HAI PRECISION INDUSTRY CO., LTD.
HSIANG-HUA LU
B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information
Patent Application
PACKAGE STRUCTURE WITH INTEGRATED ANTENNA, PACKAGE STRUCTURE ARRAY,...
Publication number
20210151395
Publication date
May 20, 2021
SOCLE TECHNOLOGY CORP.
CHING-YU NI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN-OUT PACKAGING STRUCTURE AND METHOD OF MAKING SAME
Publication number
20210134732
Publication date
May 6, 2021
SOCLE TECHNOLOGY CORP.
YING-CHIEH PAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING STRUCTURE FOR IMAGE SENSOR, LENS MODULE, AND ELECTRONIC D...
Publication number
20200343285
Publication date
Oct 29, 2020
HON HAI PRECISION INDUSTRY CO., LTD.
CHING-YU NI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD OF FABRICATING SAME
Publication number
20200294959
Publication date
Sep 17, 2020
HON HAI PRECISION INDUSTRY CO., LTD.
CHING-YU NI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20200279786
Publication date
Sep 3, 2020
HON HAI PRECISION INDUSTRY CO., LTD.
CHING-YU NI
H01 - BASIC ELECTRIC ELEMENTS