Ching-Yu Ni

Person

Shinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Light emitting diode device
- Patent number 11,894,503
- Issue date Feb 6, 2024
- Lextar Electronics Corporation
- Shu-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting device and method of fabricating the same
- Patent number 11,791,436
- Issue date Oct 17, 2023
- Epistar Corporation
- Hsin-Chih Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode device
- Patent number 11,538,970
- Issue date Dec 27, 2022
- Lextar Electronics Corporation
- Shu-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting device and method of fabricating the same
- Patent number 11,251,328
- Issue date Feb 15, 2022
- Epistar Corporation
- Hsin-Chih Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting device and method of fabricating the same
- Patent number 10,651,335
- Issue date May 12, 2020
- Epistar Corporation
- Hsin-Chih Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting device and method of fabricating the same
- Patent number 10,283,669
- Issue date May 7, 2019
- Epistar Corporation
- Hsin-Chih Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device
- Patent number 9,887,322
- Issue date Feb 6, 2018
- Epistar Corporation
- Ching-Huai Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 9,799,588
- Issue date Oct 24, 2017
- Xintec Inc.
- Ching-Yu Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor light emitting device and method of fabricating the same
- Patent number 9,735,312
- Issue date Aug 15, 2017
- Epistar Corporation
- Hsin-Chih Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device
- Patent number 9,515,225
- Issue date Dec 6, 2016
- Epistar Corporation
- Ching-Huai Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device
- Patent number 9,202,983
- Issue date Dec 1, 2015
- Epistar Corporation
- Ching-Huai Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and fabrication method thereof
- Patent number 8,822,325
- Issue date Sep 2, 2014
- Ching-Yu Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device containing passive components and fabrication met...
- Patent number 8,766,400
- Issue date Jul 1, 2014
- Ching-Yu Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power MOSFET package
- Patent number 8,766,431
- Issue date Jul 1, 2014
- Baw-Ching Perng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and fabrication method thereof
- Patent number 8,716,109
- Issue date May 6, 2014
- Xintec Inc.
- Ching-Yu Ni
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device package and method for forming the same
- Patent number 8,643,198
- Issue date Feb 4, 2014
- Wen-Cheng Chien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip package and fabrication method thereof
- Patent number 8,564,123
- Issue date Oct 22, 2013
- Ching-Yu Ni
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device package and method for forming the same
- Patent number 8,552,547
- Issue date Oct 8, 2013
- Wen-Cheng Chien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic device package and method for fabricating the same
- Patent number 8,541,877
- Issue date Sep 24, 2013
- Chia-Lun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device package structure and fabricating method thereof
- Patent number 8,431,950
- Issue date Apr 30, 2013
- Chia-Lun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power MOSFET package
- Patent number 8,410,599
- Issue date Apr 2, 2013
- Baw-Ching Perng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,384,222
- Issue date Feb 26, 2013
- Chia-Lun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and method for forming the same
- Patent number 8,367,477
- Issue date Feb 5, 2013
- Wen-Cheng Chien
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,968,448
- Issue date Jun 28, 2011
- Chia-Lun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of manufacturing thereof
- Patent number 7,348,218
- Issue date Mar 25, 2008
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Constraint stiffener design
- Patent number 7,271,480
- Issue date Sep 18, 2007
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of manufacturing thereof
- Patent number 7,135,769
- Issue date Nov 14, 2006
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Yu Ni
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20240047604
- Publication date Feb 8, 2024
- EPISTAR CORPORATION
- Hsin-Chih Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DEVICE
- Publication number 20230090352
- Publication date Mar 23, 2023
- Lextar Electronics Corporation
- Shu-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20220131029
- Publication date Apr 28, 2022
- EPISTAR CORPORATION
- Hsin-Chih Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DEVICE
- Publication number 20210280757
- Publication date Sep 9, 2021
- Lextar Electronics Corporation
- Shu-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20200274022
- Publication date Aug 27, 2020
- EPISTAR CORPORATION
- Hsin-Chih Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20190259906
- Publication date Aug 22, 2019
- EPISTAR CORPORATION
- Hsin-Chih Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20170309774
- Publication date Oct 26, 2017
- EPISTAR CORPORATION
- Hsin-Chih Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE
- Publication number 20170054057
- Publication date Feb 23, 2017
- EPISTAR CORPORATION
- Ching-Huai Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20160204305
- Publication date Jul 14, 2016
- EPISTAR CORPORATION
- Hsin-Chih Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE
- Publication number 20160079475
- Publication date Mar 17, 2016
- EPISTAR CORPORATION
- Ching-Huai Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20140332985
- Publication date Nov 13, 2014
- Ching-Yu NI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140017854
- Publication date Jan 16, 2014
- Xintec Inc.
- Ching-Yu NI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20130316499
- Publication date Nov 28, 2013
- Xintec Inc.
- Ching-Yu NI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE
- Publication number 20130240924
- Publication date Sep 19, 2013
- EPISTAR CORPORATION
- Ching-Huai Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MOSFET PACKAGE
- Publication number 20130193520
- Publication date Aug 1, 2013
- Xintec Inc.
- Baw-Ching PERNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20130127022
- Publication date May 23, 2013
- Xintec Inc.
- Wen-Cheng CHIEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20130126086
- Publication date May 23, 2013
- Xintec Inc.
- Wen-Cheng CHIEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20110175221
- Publication date Jul 21, 2011
- Ching-Yu NI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20110140248
- Publication date Jun 16, 2011
- Chia-Lun TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20110140267
- Publication date Jun 16, 2011
- Chia-Lun TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20110127681
- Publication date Jun 2, 2011
- Ching-Yu NI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20110042783
- Publication date Feb 24, 2011
- Ching-Yu Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MOSFET PACKAGE
- Publication number 20100289092
- Publication date Nov 18, 2010
- Baw-Ching PERNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20100230803
- Publication date Sep 16, 2010
- Wen-Cheng CHIEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LIGHT EMITTING DEVICE PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF
- Publication number 20090289273
- Publication date Nov 26, 2009
- Xintec, Inc.
- Chia-Lun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20090283877
- Publication date Nov 19, 2009
- Xintec Inc.
- Chia-Lun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel constraint stiffener design
- Publication number 20070069366
- Publication date Mar 29, 2007
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuo-Chin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor packages and methods of manufacturing thereof
- Publication number 20060286719
- Publication date Dec 21, 2006
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sealing membrane for thermal interface material
- Publication number 20060261469
- Publication date Nov 23, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yu Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20060220225
- Publication date Oct 5, 2006
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Yu Ni
- H01 - BASIC ELECTRIC ELEMENTS

Ching-Yu Ni

Person

Patents Grantslast 30 patents

Light emitting diode device

Semiconductor light emitting device and method of fabricating the same

Light emitting diode device

Semiconductor light emitting device and method of fabricating the same

Semiconductor light emitting device and method of fabricating the same

Semiconductor light emitting device and method of fabricating the same

Light-emitting device

Chip package and manufacturing method thereof

Semiconductor light emitting device and method of fabricating the same

Light-emitting device

Light-emitting device

Chip package and fabrication method thereof

Electronic device containing passive components and fabrication met...

Power MOSFET package

Chip package and fabrication method thereof

Electronic device package and method for forming the same

Chip package and fabrication method thereof

Electronic device package and method for forming the same

Electronic device package and method for fabricating the same

Light emitting device package structure and fabricating method thereof

Power MOSFET package

Semiconductor device and manufacturing method thereof

Electronic device package and method for forming the same

Semiconductor device and manufacturing method thereof

Semiconductor packages and methods of manufacturing thereof

Constraint stiffener design

Semiconductor packages and methods of manufacturing thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME

LIGHT EMITTING DIODE DEVICE

SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME

LIGHT EMITTING DIODE DEVICE

SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME

LIGHT-EMITTING DEVICE

SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THE SAME

LIGHT-EMITTING DEVICE

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND FABRICATION METHOD THEREOF

CHIP PACKAGE AND FABRICATION METHOD THEREOF

LIGHT-EMITTING DEVICE

POWER MOSFET PACKAGE

ELECTRONIC DEVICE PACKAGE AND METHOD FOR FORMING THE SAME

ELECTRONIC DEVICE PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME

CHIP PACKAGE AND FABRICATION METHOD THEREOF

ELECTRONIC DEVICE AND FABRICATION METHOD THEREOF

POWER MOSFET PACKAGE

ELECTRONIC DEVICE PACKAGE AND METHOD FOR FORMING THE SAME

LIGHT EMITTING DEVICE PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Novel constraint stiffener design

Semiconductor packages and methods of manufacturing thereof

Sealing membrane for thermal interface material

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF