Chingju Lin

Person

Taichung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic component transfer apparatus, electronic component trans...
- Patent number 12,261,071
- Issue date Mar 25, 2025
- ASTI GLOBAL INC., TAIWAN
- Ming-Feng Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring electronic device
- Patent number 12,224,263
- Issue date Feb 11, 2025
- MICRAFT SYSTEM PLUS CO., LTD.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for transferring electronic device
- Patent number 11,973,054
- Issue date Apr 30, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHOD FOR PARTIALLY FLATTENING A SUBSTRATE, BONDING...
- Publication number 20250022836
- Publication date Jan 16, 2025
- Stroke Precision Advanced Engineering Co., Ltd.
- Chingju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING ELECTRONIC DEVICE
- Publication number 20240213209
- Publication date Jun 27, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR BONDING ELECTRONIC COMPONENT, METHOD FOR BONDING ELEC...
- Publication number 20240203934
- Publication date Jun 20, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Chingju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS CONFIGURED TO TRANSFER ELECTRONIC COMPONENT, METHOD FOR B...
- Publication number 20240145427
- Publication date May 2, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Chingju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR TRANSFERRING ELECTRONIC COMPONENT AND METHOD FOR BOND...
- Publication number 20240105671
- Publication date Mar 28, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Chien-Shou Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE CONFIGURED TO BOND AN ELECTRONIC COMPONENT, METHOD FOR BONDI...
- Publication number 20240006564
- Publication date Jan 4, 2024
- Stroke Precision Advanced Engineering Co., Ltd.
- Chingju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSFERRING APPARATUS CONFIGURED TO TRANSFER ELECTRONIC COMPONENT,...
- Publication number 20230402562
- Publication date Dec 14, 2023
- Stroke Precision Advanced Engineering Co., Ltd.
- Chingju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR TRANSFERRING ELECTRONIC COMPONENT FROM FLEXIBLE CARRI...
- Publication number 20230142207
- Publication date May 11, 2023
- Stroke Precision Advanced Engineering Co., Ltd.
- Chingju Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT TRANSFERRING APPARATUS, ELECTRONIC COMPONENT T...
- Publication number 20220359253
- Publication date Nov 10, 2022
- ASTI GLOBAL INC., TAIWAN
- Ming-Feng Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR TRANSFERRING ELECTRONIC DEVICE
- Publication number 20220359455
- Publication date Nov 10, 2022
- Stroke Precision Advanced Engineering Co., Ltd.
- Yu-Min Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT TRANSFER APPARATUS, ELECTRONIC COMPONENT TRANS...
- Publication number 20220359254
- Publication date Nov 10, 2022
- ASTI GLOBAL INC., TAIWAN
- Ming-Feng Tu
- H01 - BASIC ELECTRIC ELEMENTS

Chingju Lin

Person

Patents Grantslast 30 patents

Electronic component transfer apparatus, electronic component trans...

Method for transferring electronic device

Method for transferring electronic device

Patents Applicationslast 30 patents

APPARATUS AND METHOD FOR PARTIALLY FLATTENING A SUBSTRATE, BONDING...

METHOD FOR TRANSFERRING ELECTRONIC DEVICE

APPARATUS FOR BONDING ELECTRONIC COMPONENT, METHOD FOR BONDING ELEC...

APPARATUS CONFIGURED TO TRANSFER ELECTRONIC COMPONENT, METHOD FOR B...

APPARATUS FOR TRANSFERRING ELECTRONIC COMPONENT AND METHOD FOR BOND...

DEVICE CONFIGURED TO BOND AN ELECTRONIC COMPONENT, METHOD FOR BONDI...

TRANSFERRING APPARATUS CONFIGURED TO TRANSFER ELECTRONIC COMPONENT,...

APPARATUS FOR TRANSFERRING ELECTRONIC COMPONENT FROM FLEXIBLE CARRI...

ELECTRONIC COMPONENT TRANSFERRING APPARATUS, ELECTRONIC COMPONENT T...

METHOD FOR TRANSFERRING ELECTRONIC DEVICE

ELECTRONIC COMPONENT TRANSFER APPARATUS, ELECTRONIC COMPONENT TRANS...