Chiou Jun Yean

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Taichung City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Device arrangement structure assembly having adhesive tape layer
- Patent number 11,024,552
- Issue date Jun 1, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device arrangement structure assembly and test method
- Patent number 10,535,572
- Issue date Jan 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEVICE ARRANGEMENT STRUCTURE ASSEMBLY
- Publication number 20200152526
- Publication date May 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun Hao LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE ARRANGEMENT STRUCTURE ASSEMBLY AND TEST METHOD
- Publication number 20170301659
- Publication date Oct 19, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun Hao LIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and monitor structure for detecting and locating IC defects
- Publication number 20070020778
- Publication date Jan 25, 2007
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng Wen Yi
- H01 - BASIC ELECTRIC ELEMENTS