Chiu-Shun Lin

Person

Tainan County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Metal bump structure for use in driver IC and method for forming th...
- Patent number 10,128,348
- Issue date Nov 13, 2018
- Himax Technologies Limited
- Chiu-Shun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal bump structure for use in driver IC and method for forming th...
- Patent number 9,450,061
- Issue date Sep 20, 2016
- Himax Technologies Limited
- Chiu-Shun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure and chip package structure
- Patent number 8,618,678
- Issue date Dec 31, 2013
- Himax Technologies Limited
- Chiu-Shun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
COF packaging structure, method of manufacturing the COF packaging...
- Patent number 7,906,374
- Issue date Mar 15, 2011
- Himax Technologies Limited
- Chiu-Shun Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate with slot
- Patent number 7,449,770
- Issue date Nov 11, 2008
- Himax Technologies, Inc.
- Chiu-Shun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad and chip structure
- Patent number 7,064,449
- Issue date Jun 20, 2006
- Himax Technologies, Inc.
- Chiu-Shun Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METAL BUMP STRUCTURE FOR USE IN DRIVER IC AND METHOD FOR FORMING TH...
- Publication number 20140327133
- Publication date Nov 6, 2014
- HIMAX TECHNOLOGIES LIMITED
- Chiu-Shun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL BUMP STRUCTURE FOR USE IN DRIVER IC AND METHOD FOR FORMING TH...
- Publication number 20140327134
- Publication date Nov 6, 2014
- HIMAX TECHNOLOGIES LIMITED
- Chiu-Shun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING AT LEAST ONE BUMP WITHOUT OVERLAPPING S...
- Publication number 20100264522
- Publication date Oct 21, 2010
- Chien-Pin Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND CHIP PACKAGE STRUCTURE
- Publication number 20100109157
- Publication date May 6, 2010
- HIMAX TECHNOLOGIES LIMITED
- Chiu-Shun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COF PACKAGING STRUCTURE, METHOD OF MANUFACTURING THE COF PACKAGING...
- Publication number 20090206472
- Publication date Aug 20, 2009
- Chiu-Shun Lin
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF BUMP FORMATION
- Publication number 20090091028
- Publication date Apr 9, 2009
- HIMAX TECHNOLOGIES LIMITED
- Chiu-Shun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate with slot
- Publication number 20060175088
- Publication date Aug 10, 2006
- Himax Technologies, Inc.
- Chiu-Shun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING PAD AND CHIP STRUCTURE
- Publication number 20060006531
- Publication date Jan 12, 2006
- Chiu-Shun Lin
- H01 - BASIC ELECTRIC ELEMENTS

Chiu-Shun Lin

Person

Patents Grantslast 30 patents

Metal bump structure for use in driver IC and method for forming th...

Metal bump structure for use in driver IC and method for forming th...

Chip structure and chip package structure

COF packaging structure, method of manufacturing the COF packaging...

Substrate with slot

Bonding pad and chip structure

Patents Applicationslast 30 patents

METAL BUMP STRUCTURE FOR USE IN DRIVER IC AND METHOD FOR FORMING TH...

METAL BUMP STRUCTURE FOR USE IN DRIVER IC AND METHOD FOR FORMING TH...

SEMICONDUCTOR DEVICE HAVING AT LEAST ONE BUMP WITHOUT OVERLAPPING S...

CHIP STRUCTURE AND CHIP PACKAGE STRUCTURE

COF PACKAGING STRUCTURE, METHOD OF MANUFACTURING THE COF PACKAGING...

SEMICONDUCTOR DEVICE AND METHOD OF BUMP FORMATION

Substrate with slot

BONDING PAD AND CHIP STRUCTURE