Chiukin (Steven) Lai

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Atomic layer etch of tungsten for enhanced tungsten deposition fill
- Patent number 11,069,535
- Issue date Jul 20, 2021
- Lam Research Corporation
- Chiukin Steven Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistivity films containing molybdenum
- Patent number 10,777,453
- Issue date Sep 15, 2020
- Lam Research Corporation
- Shruti Vivek Thombare
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Depositing ruthenium layers in interconnect metallization
- Patent number 10,731,250
- Issue date Aug 4, 2020
- Lam Research Corporation
- Do Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistivity films containing molybdenum
- Patent number 10,510,590
- Issue date Dec 17, 2019
- Lam Research Corporation
- Shruti Vivek Thombare
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manganese barrier and adhesion layers for cobalt
- Patent number 10,438,847
- Issue date Oct 8, 2019
- Lam Research Corporation
- Chiukin Steven Lai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective deposition of WCN barrier/adhesion layer for interconnect
- Patent number 10,283,404
- Issue date May 7, 2019
- Lam Research Corporation
- Jeong-Seok Na
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Systems and methods for forming low resistivity metal contacts and...
- Patent number 10,229,826
- Issue date Mar 12, 2019
- Lam Research Corporation
- Raihan Tarafdar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Atomic layer etching of tungsten for enhanced tungsten deposition fill
- Patent number 9,972,504
- Issue date May 15, 2018
- Lam Research Corporation
- Chiukin Steven Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for void-free cobalt gap fill
- Patent number 9,748,137
- Issue date Aug 29, 2017
- Lam Research Corporation
- Chiukin Steven Lai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatuses for atomic layer cleaning of contacts and vias
- Patent number 9,362,163
- Issue date Jun 7, 2016
- Lam Research Corporation
- Michal Danek
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Contact clean by remote plasma and repair of silicide surface
- Patent number 9,147,578
- Issue date Sep 29, 2015
- Applied Materials, Inc.
- Xinliang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing oxides
- Patent number 8,846,163
- Issue date Sep 30, 2014
- Applied Materials, Inc.
- Chien-Teh Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modulating etch selectivity and etch rate of silicon nitride thin f...
- Patent number 8,617,348
- Issue date Dec 31, 2013
- Novellus Systems, Inc.
- Xinye Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Modulating etch selectivity and etch rate of silicon nitride thin f...
- Patent number 8,187,486
- Issue date May 29, 2012
- Novellus Systems, Inc.
- Xinye Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for removing silicon nitride and other materials during fab...
- Patent number 7,977,249
- Issue date Jul 12, 2011
- Novellus Systems, Inc.
- Xinye Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact clean by remote plasma and repair of silicide surface
- Patent number 7,867,789
- Issue date Jan 11, 2011
- Applied Materials, Inc.
- Xinliang Lu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for front end of line fabrication
- Patent number 7,767,024
- Issue date Aug 3, 2010
- Appplied Materials, Inc.
- Chien-Teh Kao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Contact clean by remote plasma and repair of silicide surface
- Patent number 7,550,381
- Issue date Jun 23, 2009
- Applied Materials, Inc.
- Xinliang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid assembly for front end of line fabrication
- Patent number 7,520,957
- Issue date Apr 21, 2009
- Applied Materials, Inc.
- Chien-Teh Kao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for front end of line fabrication
- Patent number 7,396,480
- Issue date Jul 8, 2008
- Applied Materials, Inc.
- Chien-Teh Kao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of TiSiN deposition using a chemical vapor deposition (CVD)...
- Patent number 6,933,021
- Issue date Aug 23, 2005
- Applied Materials, Inc.
- Jing-Pei Chou
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
LOW TEMPERATURE MOLYBDENUM DEPOSITION ASSISTED BY SILICON-CONTAININ...
- Publication number 20250038003
- Publication date Jan 30, 2025
- LAM RESEARCH CORPORATION
- David Joseph Mandia
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW RESISTIVITY FILMS CONTAINING MOLYBDENUM
- Publication number 20240297075
- Publication date Sep 5, 2024
- LAM RESEARCH CORPORATION
- Shruti Vivek THOMBARE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MOLYBDENUM DEPOSITION IN FEATURES
- Publication number 20240047269
- Publication date Feb 8, 2024
- LAM RESEARCH CORPORATION
- Jeong-Seok NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTIVITY CONTACTS AND INTERCONNECTS
- Publication number 20230326790
- Publication date Oct 12, 2023
- LAM RESEARCH CORPORATION
- Raihan M. TARAFDAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLYBDENUM DEPOSITION
- Publication number 20220328317
- Publication date Oct 13, 2022
- LAM RESEARCH CORPORATION
- Jeong-Seok NA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTANTIALLY CARBON-FREE MOLYBDENUM-CONTAINING AND TUNGSTEN-CONTAI...
- Publication number 20220298624
- Publication date Sep 22, 2022
- Kyle Jordan Blakeney
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW RESISTIVITY FILMS CONTAINING MOLYBDENUM
- Publication number 20220223471
- Publication date Jul 14, 2022
- LAM RESEARCH CORPORATION
- Shruti Vivek THOMBARE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ATOMIC LAYER ETCHING OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL
- Publication number 20220115244
- Publication date Apr 14, 2022
- LAM RESEARCH CORPORATION
- Chiukin Steven LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCHING OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL
- Publication number 20210305059
- Publication date Sep 30, 2021
- LAM RESEARCH CORPORATION
- Chiukin Steven Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTIVITY FILMS CONTAINING MOLYBDENUM
- Publication number 20200365456
- Publication date Nov 19, 2020
- LAM RESEARCH CORPORATION
- Shruti Vivek Thombare
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCH OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL
- Publication number 20200286743
- Publication date Sep 10, 2020
- LAM RESEARCH CORPORATION
- Chiukin Steven Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTIVITY FILMS CONTAINING MOLYBDENUM
- Publication number 20200075403
- Publication date Mar 5, 2020
- LAM RESEARCH CORPORATION
- Shruti Vivek Thombare
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITING RUTHENIUM LAYERS IN INTERCONNECT METALLIZATION
- Publication number 20180347041
- Publication date Dec 6, 2018
- LAM RESEARCH CORPORATION
- Do Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTIVITY FILMS CONTAINING MOLYBDENUM
- Publication number 20180294187
- Publication date Oct 11, 2018
- LAM RESEARCH CORPORATION
- Shruti Vivek Thombare
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION OF WCN BARRIER/ADHESION LAYER FOR INTERCONNECT
- Publication number 20180286746
- Publication date Oct 4, 2018
- LAM RESEARCH CORPORATION
- Jeong-Seok Na
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ATOMIC LAYER ETCH OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL
- Publication number 20180240682
- Publication date Aug 23, 2018
- LAM RESEARCH CORPORATION
- Chiukin Steven Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FORMING LOW RESISTIVITY METAL CONTACTS AND...
- Publication number 20180114694
- Publication date Apr 26, 2018
- LAM RESEARCH CORPORATION
- Raihan Tarafdar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANGANESE BARRIER AND ADHESION LAYERS FOR COBALT
- Publication number 20170330797
- Publication date Nov 16, 2017
- LAM RESEARCH CORPORATION
- Chiukin Steven Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATOMIC LAYER ETCHING OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL
- Publication number 20170040214
- Publication date Feb 9, 2017
- LAM RESEARCH CORPORATION
- Chiukin Steven Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR VOID-FREE COBALT GAP FILL
- Publication number 20160056077
- Publication date Feb 25, 2016
- LAM RESEARCH CORPORATION
- Chiukin Steven Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUSES FOR ATOMIC LAYER CLEANING OF CONTACTS AND VIAS
- Publication number 20150037972
- Publication date Feb 5, 2015
- LAM RESEARCH CORPORATION
- Michal Danek
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTI CHAMBER PROCESSING SYSTEM
- Publication number 20140076234
- Publication date Mar 20, 2014
- Applied Materials, Inc.
- Chien-Teh KAO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR REMOVING OXIDES
- Publication number 20120244704
- Publication date Sep 27, 2012
- CHIEN-TEH KAO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR REMOVING OXIDES
- Publication number 20110223755
- Publication date Sep 15, 2011
- CHIEN-TEH KAO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONTACT CLEAN BY REMOTE PLASMA AND REPAIR OF SILICIDE SURFACE
- Publication number 20110104897
- Publication date May 5, 2011
- XINLIANG LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Clean by Remote Plasma and Repair of Silicide Surface
- Publication number 20090305500
- Publication date Dec 10, 2009
- Applied Materials, Inc.
- Xinliang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING OXIDES
- Publication number 20090111280
- Publication date Apr 30, 2009
- Applied Materials, Inc.
- Chien-Teh Kao
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FRONT END OF LINE FABRICATION
- Publication number 20080268645
- Publication date Oct 30, 2008
- CHIEN-TEH KAO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Contact clean by remote plasma and repair of silicide surface
- Publication number 20070015360
- Publication date Jan 18, 2007
- APPLIED MATERIALS, INC.
- Xinliang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Monitoring a flow distribution of an energized gas
- Publication number 20060093730
- Publication date May 4, 2006
- APPLIED MATERIALS, INC.
- See-Eng Phan
- B08 - CLEANING

Chiukin (Steven) Lai

Person

Patents Grantslast 30 patents

Atomic layer etch of tungsten for enhanced tungsten deposition fill

Low resistivity films containing molybdenum

Depositing ruthenium layers in interconnect metallization

Low resistivity films containing molybdenum

Manganese barrier and adhesion layers for cobalt

Selective deposition of WCN barrier/adhesion layer for interconnect

Systems and methods for forming low resistivity metal contacts and...

Atomic layer etching of tungsten for enhanced tungsten deposition fill

Method for void-free cobalt gap fill

Methods and apparatuses for atomic layer cleaning of contacts and vias

Contact clean by remote plasma and repair of silicide surface

Method for removing oxides

Modulating etch selectivity and etch rate of silicon nitride thin f...

Modulating etch selectivity and etch rate of silicon nitride thin f...

Methods for removing silicon nitride and other materials during fab...

Contact clean by remote plasma and repair of silicide surface

Method for front end of line fabrication

Contact clean by remote plasma and repair of silicide surface

Lid assembly for front end of line fabrication

Method for front end of line fabrication

Method of TiSiN deposition using a chemical vapor deposition (CVD)...

Patents Applicationslast 30 patents

LOW TEMPERATURE MOLYBDENUM DEPOSITION ASSISTED BY SILICON-CONTAININ...

LOW RESISTIVITY FILMS CONTAINING MOLYBDENUM

MOLYBDENUM DEPOSITION IN FEATURES

LOW RESISTIVITY CONTACTS AND INTERCONNECTS

MOLYBDENUM DEPOSITION

SUBSTANTIALLY CARBON-FREE MOLYBDENUM-CONTAINING AND TUNGSTEN-CONTAI...

LOW RESISTIVITY FILMS CONTAINING MOLYBDENUM

ATOMIC LAYER ETCHING OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL

ATOMIC LAYER ETCHING OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL

LOW RESISTIVITY FILMS CONTAINING MOLYBDENUM

ATOMIC LAYER ETCH OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL

LOW RESISTIVITY FILMS CONTAINING MOLYBDENUM

DEPOSITING RUTHENIUM LAYERS IN INTERCONNECT METALLIZATION

LOW RESISTIVITY FILMS CONTAINING MOLYBDENUM

SELECTIVE DEPOSITION OF WCN BARRIER/ADHESION LAYER FOR INTERCONNECT

ATOMIC LAYER ETCH OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL

SYSTEMS AND METHODS FOR FORMING LOW RESISTIVITY METAL CONTACTS AND...

MANGANESE BARRIER AND ADHESION LAYERS FOR COBALT

ATOMIC LAYER ETCHING OF TUNGSTEN FOR ENHANCED TUNGSTEN DEPOSITION FILL

METHOD FOR VOID-FREE COBALT GAP FILL

METHODS AND APPARATUSES FOR ATOMIC LAYER CLEANING OF CONTACTS AND VIAS

MULTI CHAMBER PROCESSING SYSTEM

METHOD FOR REMOVING OXIDES

METHOD FOR REMOVING OXIDES

CONTACT CLEAN BY REMOTE PLASMA AND REPAIR OF SILICIDE SURFACE

Contact Clean by Remote Plasma and Repair of Silicide Surface

METHOD FOR REMOVING OXIDES

METHOD FOR FRONT END OF LINE FABRICATION

Contact clean by remote plasma and repair of silicide surface

Monitoring a flow distribution of an energized gas