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Hsinchu, TW
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Patents Grants
last 30 patents
Information
Patent Grant
Interconnection structure and fabrication method thereof
Patent number
7,179,732
Issue date
Feb 20, 2007
United Microelectronics Corp.
Chiung-Sheng Hsiung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnection structure and fabrication method thereof
Patent number
6,890,851
Issue date
May 10, 2005
United Microelectronics Corp.
Chiung-Sheng Hsiung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for eliminating via resistance shift in organic ILD
Patent number
6,806,182
Issue date
Oct 19, 2004
International Business Machines Corporation
Darryl Restaino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for forming fusible links
Patent number
6,750,129
Issue date
Jun 15, 2004
Infineon Technologies AG
Gwo-Shii Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming metal fuse and bonding pad
Patent number
6,617,234
Issue date
Sep 9, 2003
United Microelectronics Corp.
Sung-Hsiung Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming interconnect structure with low dielectric constant
Patent number
6,583,489
Issue date
Jun 24, 2003
United Microelectronics Corp.
Sung-Hsiung Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming three dimensional semiconductor structure and th...
Patent number
6,559,004
Issue date
May 6, 2003
United Microelectronics Corp.
Gwo-Shii Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Copper damascene technology for ultra large scale integration circuits
Patent number
6,174,812
Issue date
Jan 16, 2001
United Microelectronics Corp.
Chiung-Sheng Hsiung
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Electroless Niwp Adhesion and Capping Layers for Tft Copper Gate Pr...
Publication number
20090004372
Publication date
Jan 1, 2009
Akinobu Nasu
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
Interconnection structure and fabrication method thereof
Publication number
20050001321
Publication date
Jan 6, 2005
Chiung-Sheng Hsiung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Interconnection structure and fabrication method thereof
Publication number
20040241978
Publication date
Dec 2, 2004
Chiung-Sheng Hsiung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Interconnect structure and method for manufacturing the same
Publication number
20040106273
Publication date
Jun 3, 2004
UNITED MICROELECTRONICS CORP
Ming-Shi Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Interconnect structure and method for manufacturing the same
Publication number
20040105968
Publication date
Jun 3, 2004
UNITED MICROELECTRONICS CORP
Ming-Shi Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESS FOR FORMING FUSIBLE LINKS
Publication number
20040092091
Publication date
May 13, 2004
Gwo-Shii Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for eliminating VIA resistance shift in organic ILD
Publication number
20030207559
Publication date
Nov 6, 2003
International Business Machines Corporation
Darryl Restaino
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Damascene process in intergrated circuit fabrication
Publication number
20020182857
Publication date
Dec 5, 2002
Chih-Chien Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of forming metal fuse
Publication number
20020155672
Publication date
Oct 24, 2002
Sung-Hsiung Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for forming interconnect structure with low dielectric constant
Publication number
20020155263
Publication date
Oct 24, 2002
United Microoelectronics Corp.
Sung-Hsiung Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for forming interconnect structure with low dielectric constant
Publication number
20020155261
Publication date
Oct 24, 2002
Sung-Hsiung Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ENHANCE PERFORMANCE OF COPPER DAMASCENE PROCESS BY EMBEDDING CONFOR...
Publication number
20020045345
Publication date
Apr 18, 2002
CHIUNG-SHENG HSIUNG
H01 - BASIC ELECTRIC ELEMENTS