Chockalingam Ramasamy

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming a sensor device having moisture sensitive dielect...
- Patent number 12,159,848
- Issue date Dec 3, 2024
- GLOBALFOUNDRIES Singapore Ptd. Ltd.
- Ee Jan Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory devices having an electrode with an extension
- Patent number 12,102,020
- Issue date Sep 24, 2024
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Jianxun Sun
Information Patent Grant
Metal-insulator-metal capacitor (MIMCAP) and methods of forming the...
- Patent number 12,094,763
- Issue date Sep 17, 2024
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Kwang Sing Yew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three electrode capacitor structure using spaced conductive pillars
- Patent number 12,034,039
- Issue date Jul 9, 2024
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- EeJan Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SRAM bit cells with three-dimensional integration
- Patent number 12,009,326
- Issue date Jun 11, 2024
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Hari Balan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a sensor device
- Patent number 11,855,019
- Issue date Dec 26, 2023
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ee Jan Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pad structures and methods for fabricating contact pad stru...
- Patent number 11,646,279
- Issue date May 9, 2023
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Xiaodong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structures of semiconductor devices
- Patent number 11,444,045
- Issue date Sep 13, 2022
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ramasamy Chockalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pads of semiconductor devices
- Patent number 11,244,915
- Issue date Feb 8, 2022
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ramasamy Chockalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test pad with crack stop protection
- Patent number 11,217,496
- Issue date Jan 4, 2022
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ramasamy Chockalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad reliability of semiconductor devices
- Patent number 10,892,239
- Issue date Jan 12, 2021
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ramasamy Chockalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad reliability of semiconductor devices
- Patent number 10,658,316
- Issue date May 19, 2020
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Xiaodong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via disguise to protect the security product from delayering and gr...
- Patent number 10,170,437
- Issue date Jan 1, 2019
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Ramasamy Chockalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chamfering for stress reduction on passivation layer
- Patent number 10,170,439
- Issue date Jan 1, 2019
- GLOBALFOUNDRIES Inc.
- Ee Jan Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fiducial scheme adapted for stacked integrated circuits
- Patent number 8,222,121
- Issue date Jul 17, 2012
- Tezzaron Semiconductor, Inc.
- Robert Patti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding wafers to produce stacked integrated circuits
- Patent number 8,183,127
- Issue date May 22, 2012
- Tezzaron Semiconductor, Inc.
- Robert Patti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fiducial scheme adapted for stacked integrated circuits
- Patent number 7,898,095
- Issue date Mar 1, 2011
- Tezzaron Semiconductor, Inc.
- Robert Patti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding wafers to produce stacked integrated circuits
- Patent number 7,750,488
- Issue date Jul 6, 2010
- Tezzaron Semiconductor, Inc.
- Robert Patti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to reduce microloading in metal etching
- Patent number 6,548,413
- Issue date Apr 15, 2003
- Chartered Semiconductor Manufacturing Ltd.
- Paul Kwok Keung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMP process utilizing dummy plugs in damascene process
- Patent number 6,380,087
- Issue date Apr 30, 2002
- Chartered Semiconductor Manufacturing Inc.
- Subhash Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to avoid copper contamination during copper etching and CMP
- Patent number 6,274,499
- Issue date Aug 14, 2001
- Chartered Semiconductor Manufacturing Ltd.
- Subhash Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to deposit a copper seed layer for dual damascene interconnects
- Patent number 6,225,221
- Issue date May 1, 2001
- Chartered Semiconductor Manufacturing Ltd.
- Paul Kwok Keung Ho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING A SENSOR DEVICE
- Publication number 20240063154
- Publication date Feb 22, 2024
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- EE JAN KHOR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR CAPACITOR HAVING DEFECT-PREVENTING REGIONS IN METAL E...
- Publication number 20240038653
- Publication date Feb 1, 2024
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- EeJan Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SRAM BIT CELLS WITH THREE-DIMENSIONAL INTEGRATION
- Publication number 20230238342
- Publication date Jul 27, 2023
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Hari Balan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICES HAVING AN ELECTRODE WITH AN EXTENSION
- Publication number 20230217843
- Publication date Jul 6, 2023
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- JIANXUN SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE ELECTRODE CAPACITOR STRUCTURE USING SPACED CONDUCTIVE PILLARS
- Publication number 20230123402
- Publication date Apr 20, 2023
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- EeJan Khor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR (MIMCAP) AND METHODS OF FORMING THE...
- Publication number 20230069830
- Publication date Mar 9, 2023
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Kwang Sing YEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT PAD STRUCTURES AND METHODS FOR FABRICATING CONTACT PAD STRU...
- Publication number 20220270991
- Publication date Aug 25, 2022
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- XIAODONG LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SENSOR DEVICE
- Publication number 20220252534
- Publication date Aug 11, 2022
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- EE JAN KHOR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES OF SEMICONDUCTOR DEVICES
- Publication number 20220052000
- Publication date Feb 17, 2022
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- RAMASAMY CHOCKALINGAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PADS OF SEMICONDUCTOR DEVICES
- Publication number 20210134742
- Publication date May 6, 2021
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- RAMASAMY CHOCKALINGAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD RELIABILITY OF SEMICONDUCTOR DEVICES
- Publication number 20210013166
- Publication date Jan 14, 2021
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- RAMASAMY CHOCKALINGAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST PAD WITH CRACK STOP PROTECTION
- Publication number 20200357707
- Publication date Nov 12, 2020
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Ramasamy CHOCKALINGAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD RELIABILITY OF SEMICONDUCTOR DEVICES
- Publication number 20200105690
- Publication date Apr 2, 2020
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- XIAODONG LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fiducial Scheme Adapted for Stacked Integrated Circuits
- Publication number 20110117701
- Publication date May 19, 2011
- Robert Patti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Bonding Wafers to Produce Stacked Integrated Circuits
- Publication number 20100233850
- Publication date Sep 16, 2010
- Robert Patti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for bonding wafers to produce stacked integrated circuits
- Publication number 20080006938
- Publication date Jan 10, 2008
- Robert Patti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fiducial scheme adapted for stacked integrated circuits
- Publication number 20070216041
- Publication date Sep 20, 2007
- Robert Patti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chemical agent additives in copper CMP slurry
- Publication number 20050205522
- Publication date Sep 22, 2005
- Chartered Semiconductor Manufacturing Ltd.
- Paul Kwok Keung Ho
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Planarization by selective electro-dissolution
- Publication number 20020115283
- Publication date Aug 22, 2002
- Chartered Semiconductor Manufacturing Ltd.
- Paul Kwok Keung Ho
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Chockalingam Ramasamy

Person

Patents Grantslast 30 patents

Method of forming a sensor device having moisture sensitive dielect...

Semiconductor memory devices having an electrode with an extension

Metal-insulator-metal capacitor (MIMCAP) and methods of forming the...

Three electrode capacitor structure using spaced conductive pillars

SRAM bit cells with three-dimensional integration

Method of forming a sensor device

Contact pad structures and methods for fabricating contact pad stru...

Bonding structures of semiconductor devices

Bond pads of semiconductor devices

Test pad with crack stop protection

Bond pad reliability of semiconductor devices

Bond pad reliability of semiconductor devices

Via disguise to protect the security product from delayering and gr...

Chamfering for stress reduction on passivation layer

Fiducial scheme adapted for stacked integrated circuits

Method for bonding wafers to produce stacked integrated circuits

Fiducial scheme adapted for stacked integrated circuits

Method for bonding wafers to produce stacked integrated circuits

Method to reduce microloading in metal etching

CMP process utilizing dummy plugs in damascene process

Method to avoid copper contamination during copper etching and CMP

Method to deposit a copper seed layer for dual damascene interconnects

Patents Applicationslast 30 patents

METHOD OF FORMING A SENSOR DEVICE

STRUCTURE FOR CAPACITOR HAVING DEFECT-PREVENTING REGIONS IN METAL E...

SRAM BIT CELLS WITH THREE-DIMENSIONAL INTEGRATION

SEMICONDUCTOR MEMORY DEVICES HAVING AN ELECTRODE WITH AN EXTENSION

THREE ELECTRODE CAPACITOR STRUCTURE USING SPACED CONDUCTIVE PILLARS

METAL-INSULATOR-METAL CAPACITOR (MIMCAP) AND METHODS OF FORMING THE...

CONTACT PAD STRUCTURES AND METHODS FOR FABRICATING CONTACT PAD STRU...

METHOD OF FORMING A SENSOR DEVICE

BONDING STRUCTURES OF SEMICONDUCTOR DEVICES

BOND PADS OF SEMICONDUCTOR DEVICES

BOND PAD RELIABILITY OF SEMICONDUCTOR DEVICES

TEST PAD WITH CRACK STOP PROTECTION

BOND PAD RELIABILITY OF SEMICONDUCTOR DEVICES

Fiducial Scheme Adapted for Stacked Integrated Circuits

Method for Bonding Wafers to Produce Stacked Integrated Circuits

Method for bonding wafers to produce stacked integrated circuits

Fiducial scheme adapted for stacked integrated circuits

Chemical agent additives in copper CMP slurry

Planarization by selective electro-dissolution