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Chong Ser Choong
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Singapore, SG
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Patents Grants
last 30 patents
Information
Patent Grant
Double-side mountable MEMS package
Patent number
8,178,936
Issue date
May 15, 2012
Shandong Gettop Acoustic Co. Ltd.
Wang Zhe
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Silicon microphone with enhanced impact proof structure using bondi...
Patent number
8,045,733
Issue date
Oct 25, 2011
Shandong Gettop Acoustic Co., Ltd.
Wang Zhe
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Folded lead-frame packages for MEMS devices
Patent number
8,013,404
Issue date
Sep 6, 2011
Shandong Gettop Acoustic Co. Ltd.
Wang Zhe
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Double-side mountable MEMS package
Patent number
7,843,021
Issue date
Nov 30, 2010
Shandong Gettop Acoustic Co. Ltd.
Wang Zhe
B81 - MICRO-STRUCTURAL TECHNOLOGY
Patents Applications
last 30 patents
Information
Patent Application
Double-side mountable MEMS package
Publication number
20110062573
Publication date
Mar 17, 2011
Wang Zhe
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Folded lead-frame packages for MEMS devices
Publication number
20100090295
Publication date
Apr 15, 2010
Silicon Matrix Pte Ltd
Wang Zhe
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Double-side mountable MEMS package
Publication number
20090218668
Publication date
Sep 3, 2009
Silicon Matrix Pte Ltd
Wang Zhe
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Silicon microphone with enhanced impact proof structure using bondi...
Publication number
20090092273
Publication date
Apr 9, 2009
Silicon Matrix Pte Ltd
Wang Zhe
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
Wafer level through-hole plugging using mechanical forming technique
Publication number
20060009029
Publication date
Jan 12, 2006
Agency For Science, Technology and Research
Wong EE Hua
H01 - BASIC ELECTRIC ELEMENTS