Chong Un Tan

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Micro-power wireless access method and apparatus for internet of th...
- Patent number 11,736,969
- Issue date Aug 22, 2023
- State Grid Jiangsu Electric Power Co., Ltd. Research Institute
- Jianhua Qin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Non-cure and cure hybrid film-on-die for embedded controller die
- Patent number 11,699,685
- Issue date Jul 11, 2023
- Western Digital Technologies, Inc.
- Ling Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including corner recess
- Patent number 10,418,334
- Issue date Sep 17, 2019
- SanDisk Semiconductor (Shanghai) Co. Ltd.
- Hang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with die tilt control
- Patent number 10,276,546
- Issue date Apr 30, 2019
- SanDisk Semiconductor (Shanghai) Co. Ltd.
- Shuai Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including die bond pads at a die edge
- Patent number 10,128,218
- Issue date Nov 13, 2018
- SanDisk Semiconductor (Shanghai) Co. Ltd.
- Junrong Yan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BALL GRID ARRAY SEMICONDUCTOR DEVICE WITH THERMAL PADS AND PRINTED...
- Publication number 20240162106
- Publication date May 16, 2024
- Western Digital Technologies, Inc.
- Teng Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING EMBEDDED MEMORY DIES AND METHOD OF M...
- Publication number 20230411340
- Publication date Dec 21, 2023
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SSD SEMICONDUCTOR DEVICE
- Publication number 20230137512
- Publication date May 4, 2023
- Western Digital Technologies, Inc.
- Hui Xu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Non-Cure and Cure Hybrid Film-On-Die for Embedded Controller Die
- Publication number 20230020021
- Publication date Jan 19, 2023
- Western Digital Technologies, Inc.
- Ling Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-POWER WIRELESS ACCESS METHOD AND APPARATUS FOR INTERNET OF TH...
- Publication number 20220361032
- Publication date Nov 10, 2022
- State Grid Jiangsu Electric Power Co., Ltd. Research Institute
- Jianhua Qin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CORNER RECESS
- Publication number 20180174983
- Publication date Jun 21, 2018
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Hang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING DIE BOND PADS AT A DIE EDGE
- Publication number 20180175006
- Publication date Jun 21, 2018
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Junrong Yan
- H01 - BASIC ELECTRIC ELEMENTS

Chong Un Tan

Person

Patents Grantslast 30 patents

Micro-power wireless access method and apparatus for internet of th...

Non-cure and cure hybrid film-on-die for embedded controller die

Semiconductor device including corner recess

Semiconductor device with die tilt control

Semiconductor device including die bond pads at a die edge

Patents Applicationslast 30 patents

BALL GRID ARRAY SEMICONDUCTOR DEVICE WITH THERMAL PADS AND PRINTED...

SEMICONDUCTOR DEVICE INCLUDING EMBEDDED MEMORY DIES AND METHOD OF M...

STACKED SSD SEMICONDUCTOR DEVICE

Non-Cure and Cure Hybrid Film-On-Die for Embedded Controller Die

MICRO-POWER WIRELESS ACCESS METHOD AND APPARATUS FOR INTERNET OF TH...

SEMICONDUCTOR DEVICE INCLUDING CORNER RECESS

SEMICONDUCTOR DEVICE INCLUDING DIE BOND PADS AT A DIE EDGE