Chonghua Zhong

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Structure and method for fabricating a computing system with an int...
- Patent number 11,967,528
- Issue date Apr 23, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for fabricating a computing system with an int...
- Patent number 11,670,548
- Issue date Jun 6, 2023
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnection using fanout interposer chiplet
- Patent number 11,594,494
- Issue date Feb 28, 2023
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High bandwidth die to die interconnect with package area reduction
- Patent number 11,587,909
- Issue date Feb 21, 2023
- Apple Inc.
- Chonghua Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable extreme large size substrate integration
- Patent number 11,404,337
- Issue date Aug 2, 2022
- Apple Inc.
- Kunzhong Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double side mounted large MCM package with memory channel length re...
- Patent number 11,158,621
- Issue date Oct 26, 2021
- Apple Inc.
- Chonghua Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trimmable banked capacitor
- Patent number 11,069,665
- Issue date Jul 20, 2021
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnection using fanout interposer chiplet
- Patent number 10,943,869
- Issue date Mar 9, 2021
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for fabricating a computing system with an int...
- Patent number 10,818,632
- Issue date Oct 27, 2020
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High bandwidth die to die interconnect with package area reduction
- Patent number 10,770,433
- Issue date Sep 8, 2020
- Apple Inc.
- Chonghua Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double side mounted large MCM package with memory channel length re...
- Patent number 10,685,948
- Issue date Jun 16, 2020
- Apple Inc.
- Chonghua Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D thin profile pre-stacking architecture using reconstitution method
- Patent number 10,181,455
- Issue date Jan 15, 2019
- Apple Inc.
- Jun Zhai
- G11 - INFORMATION STORAGE
Information Patent Grant
Dual-sided silicon integrated passive devices
- Patent number 10,103,138
- Issue date Oct 16, 2018
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for fabricating a computing system with an int...
- Patent number 9,935,076
- Issue date Apr 3, 2018
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-sided silicon integrated passive devices
- Patent number 9,748,227
- Issue date Aug 29, 2017
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double side mounting memory integration in thin low warpage fanout...
- Patent number 9,659,907
- Issue date May 23, 2017
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System in package fan out stacking architecture and process flow
- Patent number 9,633,974
- Issue date Apr 25, 2017
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit die decoupling system with reduced inductance
- Patent number 9,548,288
- Issue date Jan 17, 2017
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal enhanced high density flip chip package
- Patent number 9,153,530
- Issue date Oct 6, 2015
- Broadcom Corporation
- Chonghua Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wideband power efficient high transmission power radio frequency (R...
- Patent number 9,118,367
- Issue date Aug 25, 2015
- Broadcom Corporation
- Ray (Ramon) Gomez
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Wafer level package resistance monitor scheme
- Patent number 8,957,694
- Issue date Feb 17, 2015
- Broadcom Corporation
- Kunzhong Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating a wafer level semiconductor package having a pre-formed...
- Patent number 8,945,991
- Issue date Feb 3, 2015
- Broadcom Corporation
- Kevin (Kunzhong) Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level semiconductor package
- Patent number 8,922,014
- Issue date Dec 30, 2014
- Broadcom Corporation
- Kevin (Kunzhong) Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a wafer level semiconductor package having a...
- Patent number 8,592,259
- Issue date Nov 26, 2013
- Broadcom Corporation
- Kevin (Kunzhong) Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wideband power efficient high transmission power radio frequency (R...
- Patent number 8,417,200
- Issue date Apr 9, 2013
- Broadcom Corporation
- Ray (Ramon) Gomez
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Integrated circuit package substrate having configurable bond pads
- Patent number 8,138,608
- Issue date Mar 20, 2012
- Broadcom Corporation
- Chonghua Zhong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
IC package sacrificial structures for crack propagation confinement
- Patent number 8,102,027
- Issue date Jan 24, 2012
- Broadcom Corporation
- Sam Ziqun Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low voltage drop and high thermal performance ball grid array package
- Patent number 7,781,882
- Issue date Aug 24, 2010
- Broadcom Corporation
- Chonghua Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package substrate having configurable bond pads
- Patent number 7,683,495
- Issue date Mar 23, 2010
- Broadcom Corporation
- Chonghua Zhong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Structure and Method for Fabricating a Computing System with an Int...
- Publication number 20240243012
- Publication date Jul 18, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-...
- Publication number 20240105702
- Publication date Mar 28, 2024
- Apple Inc.
- Chonghua Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-...
- Publication number 20240105704
- Publication date Mar 28, 2024
- Apple Inc.
- Chonghua Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Fabricating a Computing System with an Int...
- Publication number 20230335440
- Publication date Oct 19, 2023
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET
- Publication number 20230223348
- Publication date Jul 13, 2023
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH BANDWIDTH DIE TO DIE INTERCONNECT WITH PACKAGE AREA REDUCTION
- Publication number 20230154897
- Publication date May 18, 2023
- Apple Inc.
- Chonghua Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Scalable Extreme Large Size Substrate Integration
- Publication number 20230017445
- Publication date Jan 19, 2023
- Apple Inc.
- Kunzhong Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Scalable Extreme Large Size Substrate Integration
- Publication number 20210202332
- Publication date Jul 1, 2021
- Apple Inc.
- Kunzhong Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET
- Publication number 20210159180
- Publication date May 27, 2021
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Fabricating a Computing System with an Int...
- Publication number 20210043511
- Publication date Feb 11, 2021
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH BANDWIDTH DIE TO DIE INTERCONNECT WITH PACKAGE AREA REDUCTION
- Publication number 20210020610
- Publication date Jan 21, 2021
- Apple Inc.
- Chonghua Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE SIDE MOUNTED LARGE MCM PACKAGE WITH MEMORY CHANNEL LENGTH RE...
- Publication number 20200279842
- Publication date Sep 3, 2020
- Apple Inc.
- Chonghua Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH BANDWIDTH DIE TO DIE INTERCONNECT WITH PACKAGE AREA REDUCTION
- Publication number 20200273843
- Publication date Aug 27, 2020
- Apple Inc.
- Chonghua Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE SIDE MOUNTED LARGE MCM PACKAGE WITH MEMORY CHANNEL LENGTH RE...
- Publication number 20200176431
- Publication date Jun 4, 2020
- Apple Inc.
- Chonghua Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRIMMABLE BANKED CAPACITOR
- Publication number 20200176427
- Publication date Jun 4, 2020
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET
- Publication number 20180358298
- Publication date Dec 13, 2018
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D THIN PROFILE PRE-STACKING ARCHITECTURE USING RECONSTITUTION METHOD
- Publication number 20180204820
- Publication date Jul 19, 2018
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDED SILICON INTEGRATED PASSIVE DEVICES
- Publication number 20170323883
- Publication date Nov 9, 2017
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDED SILICON INTEGRATED PASSIVE DEVICES
- Publication number 20170018546
- Publication date Jan 19, 2017
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE OPTIONS WITH MULTIPLE LAYER 3-D STACKING
- Publication number 20160300823
- Publication date Oct 13, 2016
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE SIDE MOUNTING MEMORY INTEGRATION IN THIN LOW WARPAGE FANOUT...
- Publication number 20160300813
- Publication date Oct 13, 2016
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM IN PACKAGE FAN OUT STACKING ARCHITECTURE AND PROCESS FLOW
- Publication number 20160260684
- Publication date Sep 8, 2016
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE OPTIONS WITH MULTIPLE LAYER 3-D STACKING
- Publication number 20160013156
- Publication date Jan 14, 2016
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONFIGURED WIDE I/O MEMORY MODULES AND PACKAGE ARCHITECTURES USIN...
- Publication number 20150364454
- Publication date Dec 17, 2015
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Semiconductor Package
- Publication number 20140084462
- Publication date Mar 27, 2014
- BROADCOM CORPORATION
- Kevin (Kunzhong) Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabricating a Wafer Level Semiconductor Package Having a Pre-formed...
- Publication number 20140087553
- Publication date Mar 27, 2014
- BROADCOM CORPORATION
- Kevin (Kunzhong) Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE RESISTANCE MONITOR SCHEME
- Publication number 20130314120
- Publication date Nov 28, 2013
- BROADCOM CORPORATION
- Kunzhong Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wideband Power Efficient High Transmission Power Radio Frequency (R...
- Publication number 20130235953
- Publication date Sep 12, 2013
- BROADCOM CORPORATION
- Ray (Ramon) GOMEZ
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Wafer Level Semiconductor Package
- Publication number 20130134596
- Publication date May 30, 2013
- BROADCOM CORPORATION
- Kevin (Kunzhong) Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wideband Power Efficient High Transmission Power Radio Frequency (R...
- Publication number 20130084816
- Publication date Apr 4, 2013
- BROADCOM CORPORATION
- Ray (Ramon) Gomez
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Chonghua Zhong

Person

Patents Grantslast 30 patents

Structure and method for fabricating a computing system with an int...

Structure and method for fabricating a computing system with an int...

High density interconnection using fanout interposer chiplet

High bandwidth die to die interconnect with package area reduction

Scalable extreme large size substrate integration

Double side mounted large MCM package with memory channel length re...

Trimmable banked capacitor

High density interconnection using fanout interposer chiplet

Structure and method for fabricating a computing system with an int...

High bandwidth die to die interconnect with package area reduction

Double side mounted large MCM package with memory channel length re...

3D thin profile pre-stacking architecture using reconstitution method

Dual-sided silicon integrated passive devices

Structure and method for fabricating a computing system with an int...

Dual-sided silicon integrated passive devices

Double side mounting memory integration in thin low warpage fanout...

System in package fan out stacking architecture and process flow

Integrated circuit die decoupling system with reduced inductance

Thermal enhanced high density flip chip package

Wideband power efficient high transmission power radio frequency (R...

Wafer level package resistance monitor scheme

Fabricating a wafer level semiconductor package having a pre-formed...

Wafer level semiconductor package

Method of fabricating a wafer level semiconductor package having a...

Wideband power efficient high transmission power radio frequency (R...

Integrated circuit package substrate having configurable bond pads

IC package sacrificial structures for crack propagation confinement

Low voltage drop and high thermal performance ball grid array package

Integrated circuit package substrate having configurable bond pads

Patents Applicationslast 30 patents

Structure and Method for Fabricating a Computing System with an Int...

3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-...

3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-...

Structure and Method for Fabricating a Computing System with an Int...

HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET

HIGH BANDWIDTH DIE TO DIE INTERCONNECT WITH PACKAGE AREA REDUCTION

Scalable Extreme Large Size Substrate Integration

Scalable Extreme Large Size Substrate Integration

HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET

Structure and Method for Fabricating a Computing System with an Int...

HIGH BANDWIDTH DIE TO DIE INTERCONNECT WITH PACKAGE AREA REDUCTION

DOUBLE SIDE MOUNTED LARGE MCM PACKAGE WITH MEMORY CHANNEL LENGTH RE...

HIGH BANDWIDTH DIE TO DIE INTERCONNECT WITH PACKAGE AREA REDUCTION

DOUBLE SIDE MOUNTED LARGE MCM PACKAGE WITH MEMORY CHANNEL LENGTH RE...

TRIMMABLE BANKED CAPACITOR

HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET

3D THIN PROFILE PRE-STACKING ARCHITECTURE USING RECONSTITUTION METHOD

DUAL-SIDED SILICON INTEGRATED PASSIVE DEVICES

DUAL-SIDED SILICON INTEGRATED PASSIVE DEVICES

PACKAGE-ON-PACKAGE OPTIONS WITH MULTIPLE LAYER 3-D STACKING

DOUBLE SIDE MOUNTING MEMORY INTEGRATION IN THIN LOW WARPAGE FANOUT...

SYSTEM IN PACKAGE FAN OUT STACKING ARCHITECTURE AND PROCESS FLOW

PACKAGE-ON-PACKAGE OPTIONS WITH MULTIPLE LAYER 3-D STACKING

RECONFIGURED WIDE I/O MEMORY MODULES AND PACKAGE ARCHITECTURES USIN...

Wafer Level Semiconductor Package

Fabricating a Wafer Level Semiconductor Package Having a Pre-formed...

WAFER LEVEL PACKAGE RESISTANCE MONITOR SCHEME

Wideband Power Efficient High Transmission Power Radio Frequency (R...

Wafer Level Semiconductor Package

Wideband Power Efficient High Transmission Power Radio Frequency (R...