Christian Mueller

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Bottrop, DE

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Patents Grantslast 30 patents

Information Patent Grant
Chip arrangement and method for manufacturing a chip arrangement
- Patent number 9,856,136
- Issue date Jan 2, 2018
- INTEL DEUTSCHLAND GMBH
- Thorsten Meyer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stress buffer layer for integrated microelectromechanical systems (...
- Patent number 9,550,670
- Issue date Jan 24, 2017
- Intel IP Corporation
- Christian Geissler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Die edge side connection
- Patent number 9,209,143
- Issue date Dec 8, 2015
- Intel IP Corporation
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress buffer layer for integrated microelectromechanical systems (...
- Patent number 9,056,763
- Issue date Jun 16, 2015
- Intel Corporation
- Christian Geissler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip arrangements
- Patent number 8,907,480
- Issue date Dec 9, 2014
- Intel Mobile Communications GmbH
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH CONDUCTIVITY HIGH FREQUENCY VIA FOR ELECTRONIC SYSTEMS
- Publication number 20160225694
- Publication date Aug 4, 2016
- Hans-Joachim BARTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS BUFFER LAYER FOR INTEGRATED MICROELECTROMECHANICAL SYSTEMS (...
- Publication number 20150266728
- Publication date Sep 24, 2015
- Christian Geissler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRESS BUFFER LAYER FOR INTEGRATED MICROELECTROMECHANICAL SYSTEMS (...
- Publication number 20150091167
- Publication date Apr 2, 2015
- Christian Geissler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIE EDGE SIDE CONNECTION
- Publication number 20150084202
- Publication date Mar 26, 2015
- Georg Seidemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT AND METHOD FOR MANUFACTURING A CHIP ARRANGEMENT
- Publication number 20140361387
- Publication date Dec 11, 2014
- Thorsten Meyer
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP ARRANGEMENTS
- Publication number 20140264832
- Publication date Sep 18, 2014
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20140252632
- Publication date Sep 11, 2014
- Hans-Joachim Barth
- H01 - BASIC ELECTRIC ELEMENTS