Christian Stuempfl

Person

Schwandorf, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method for attaching a semiconductor die to a carrier
- Patent number 9,881,909
- Issue date Jan 30, 2018
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor package and semiconductor pa...
- Patent number 9,576,935
- Issue date Feb 21, 2017
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component of VQFN design and method for producing the same
- Patent number 8,330,260
- Issue date Dec 11, 2012
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having through contacts through a plastic hous...
- Patent number 7,944,061
- Issue date May 17, 2011
- Infineon Technologies AG
- Michael Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plastic housing and semiconductor component with said plastic housing
- Patent number 7,919,857
- Issue date Apr 5, 2011
- Infineon Technologies AG
- Michael Bauer
- G01 - MEASURING TESTING
Information Patent Grant
Method for manufacturing an electronic component and corresponding...
- Patent number 7,834,460
- Issue date Nov 16, 2010
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a thinned semiconductor chip and method f...
- Patent number 7,749,864
- Issue date Jul 6, 2010
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic circuit in a package-in-package configuration and produc...
- Patent number 7,714,416
- Issue date May 11, 2010
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic structure with components connected by way of solderable...
- Patent number 7,666,777
- Issue date Feb 23, 2010
- Infineon Technologies AG
- Michael Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic circuit in a package-on-package configuration and method...
- Patent number 7,662,664
- Issue date Feb 16, 2010
- Infineon Technologies AG
- Michael Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for applying a structure of joining material to the back sur...
- Patent number 7,592,236
- Issue date Sep 22, 2009
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Biosensor with smart card configuration
- Patent number 7,566,968
- Issue date Jul 28, 2009
- Siemens Aktiengesellschaft
- Michael Bauer
- G01 - MEASURING TESTING
Information Patent Grant
Method for coating a structure comprising semiconductor chips
- Patent number 7,547,645
- Issue date Jun 16, 2009
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a universal semiconductor housing with precross...
- Patent number 7,517,722
- Issue date Apr 14, 2009
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with a semiconductor stack, and methods for it...
- Patent number 7,456,495
- Issue date Nov 25, 2008
- Infineon Technologies AG
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a thinned semiconductor chip and method f...
- Patent number 7,294,916
- Issue date Nov 13, 2007
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with a plastic package and method for production
- Patent number 7,276,783
- Issue date Oct 2, 2007
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device configured as a multichip module, leadframe, pane...
- Patent number 6,902,951
- Issue date Jun 7, 2005
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal package for an electronic component with a semiconductor...
- Patent number 6,867,471
- Issue date Mar 15, 2005
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for Attaching a Semiconductor Die to a Carrier
- Publication number 20160126227
- Publication date May 5, 2016
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Semiconductor Package and Semiconductor Pa...
- Publication number 20150303135
- Publication date Oct 22, 2015
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having Through Contacts Through a Plastic Hous...
- Publication number 20080315399
- Publication date Dec 25, 2008
- Infineon Technologies AG
- Michael Bauer
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR DEVICE WITH A THINNED SEMICONDUCTOR CHIP AND METHOD F...
- Publication number 20080242057
- Publication date Oct 2, 2008
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYER FOR CHIP CONTACT ELEMENT
- Publication number 20080079175
- Publication date Apr 3, 2008
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module with a shielding and/or heat dissipating element
- Publication number 20080073756
- Publication date Mar 27, 2008
- Infineon Technologies AG
- Ludwig Heitzer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP ASSEMBLY
- Publication number 20080054451
- Publication date Mar 6, 2008
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plastic Housing and Semiconductor Component with Said Plastic Housi...
- Publication number 20080045063
- Publication date Feb 21, 2008
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- G01 - MEASURING TESTING
Information Patent Application
Electronic Device and Method For Producing the Same
- Publication number 20080029865
- Publication date Feb 7, 2008
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Circuit in a Package-On-Package Configuration and Method...
- Publication number 20080017967
- Publication date Jan 24, 2008
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Component of VQFN Design and Method for Producing the Same
- Publication number 20080017986
- Publication date Jan 24, 2008
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT IN A PACKAGE-IN-PACKAGE CONFIGURATION AND PRODUC...
- Publication number 20080017972
- Publication date Jan 24, 2008
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing an electronic component and corresponding...
- Publication number 20070290346
- Publication date Dec 20, 2007
- INFINEON TECHNOLOGIES AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic structure with components connected by way of solderable...
- Publication number 20070117424
- Publication date May 24, 2007
- Michael Bauer
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method for coating a structure comprising semiconductor chips
- Publication number 20070105394
- Publication date May 10, 2007
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for applying a structure of joining material to the back sur...
- Publication number 20070087532
- Publication date Apr 19, 2007
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A THINNED SEMICONDUCTOR CHIP AND METHOD F...
- Publication number 20070042568
- Publication date Feb 22, 2007
- Infineon Technologies AG
- Michael Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of producing a universal semiconductor housing with precross...
- Publication number 20060258046
- Publication date Nov 16, 2006
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Biosensor with smart card configuration
- Publication number 20060027905
- Publication date Feb 9, 2006
- Michael Bauer
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
Electronic device configured as a multichip module, leadframe and p...
- Publication number 20050184375
- Publication date Aug 25, 2005
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module with a semiconductor stack, and methods for it...
- Publication number 20050133932
- Publication date Jun 23, 2005
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component with a plastic housing and method for producti...
- Publication number 20040232543
- Publication date Nov 25, 2004
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device configured as a multichip module, leadframe, pane...
- Publication number 20040140559
- Publication date Jul 22, 2004
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Universal package for an electronic component with a semiconductor...
- Publication number 20040041251
- Publication date Mar 4, 2004
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Universal semiconductor housing with precrosslinked plastic embeddi...
- Publication number 20040043515
- Publication date Mar 4, 2004
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS

Christian Stuempfl

Person

Patents Grantslast 30 patents

Method for attaching a semiconductor die to a carrier

Method for fabricating a semiconductor package and semiconductor pa...

Electronic component of VQFN design and method for producing the same

Semiconductor device having through contacts through a plastic hous...

Plastic housing and semiconductor component with said plastic housing

Method for manufacturing an electronic component and corresponding...

Semiconductor device with a thinned semiconductor chip and method f...

Electronic circuit in a package-in-package configuration and produc...

Electronic structure with components connected by way of solderable...

Electronic circuit in a package-on-package configuration and method...

Method for applying a structure of joining material to the back sur...

Biosensor with smart card configuration

Method for coating a structure comprising semiconductor chips

Method of producing a universal semiconductor housing with precross...

Semiconductor module with a semiconductor stack, and methods for it...

Semiconductor device with a thinned semiconductor chip and method f...

Electronic component with a plastic package and method for production

Electronic device configured as a multichip module, leadframe, pane...

Universal package for an electronic component with a semiconductor...

Patents Applicationslast 30 patents

Method for Attaching a Semiconductor Die to a Carrier

Method for Fabricating a Semiconductor Package and Semiconductor Pa...

Semiconductor Device Having Through Contacts Through a Plastic Hous...

SEMICONDUCTOR DEVICE WITH A THINNED SEMICONDUCTOR CHIP AND METHOD F...

LAYER FOR CHIP CONTACT ELEMENT

Module with a shielding and/or heat dissipating element

MULTI-CHIP ASSEMBLY

Plastic Housing and Semiconductor Component with Said Plastic Housi...

Electronic Device and Method For Producing the Same

Electronic Circuit in a Package-On-Package Configuration and Method...

Electronic Component of VQFN Design and Method for Producing the Same

ELECTRONIC CIRCUIT IN A PACKAGE-IN-PACKAGE CONFIGURATION AND PRODUC...

Method for manufacturing an electronic component and corresponding...

Electronic structure with components connected by way of solderable...

Method for coating a structure comprising semiconductor chips

Method for applying a structure of joining material to the back sur...

SEMICONDUCTOR DEVICE WITH A THINNED SEMICONDUCTOR CHIP AND METHOD F...

Method of producing a universal semiconductor housing with precross...

Biosensor with smart card configuration

Electronic device configured as a multichip module, leadframe and p...

Semiconductor module with a semiconductor stack, and methods for it...

Electronic component with a plastic housing and method for producti...

Electronic device configured as a multichip module, leadframe, pane...

Universal package for an electronic component with a semiconductor...

Universal semiconductor housing with precrosslinked plastic embeddi...