Christian Zenz

Person

Graz, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Dual-interface IC card module
- Patent number 11,222,861
- Issue date Jan 11, 2022
- NXP B.V.
- Christian Zenz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit saw bow break point
- Patent number 10,896,878
- Issue date Jan 19, 2021
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-interface IC card module
- Patent number 10,461,057
- Issue date Oct 29, 2019
- NXP B.V.
- Christian Zenz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dual-interface IC card
- Patent number 10,366,320
- Issue date Jul 30, 2019
- NXP B.V.
- Christian Zenz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of producing a transponder and a transponder
- Patent number 9,779,349
- Issue date Oct 3, 2017
- NXP B.V.
- Reinhard Rogy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dual-interface IC card components and method for manufacturing the...
- Patent number 9,536,188
- Issue date Jan 3, 2017
- NXP B.V.
- Patrick Schoengrundner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Antenna or a strap for accommodating an integrated circuit, an ante...
- Patent number 9,425,500
- Issue date Aug 23, 2016
- NXP B.V.
- Christian Zenz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dual interface IC card components and method for manufacturing the...
- Patent number 9,424,507
- Issue date Aug 23, 2016
- NXP B.V.
- Christian Zenz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Protection of a wafer-level chip scale package (WLCSP)
- Patent number 9,196,537
- Issue date Nov 24, 2015
- NXP B.V.
- Leonardus Antonius Elisabeth Van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated wafer-level chip scale (WLSCP) pedestal packaging
- Patent number 8,987,057
- Issue date Mar 24, 2015
- NXP B.V.
- Leonardus Antonius Elisabeth Van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a transponder and a transponder
- Patent number 8,968,510
- Issue date Mar 3, 2015
- NXP B.V.
- Reinhard Rogy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
IC package with stainless steel leadframe
- Patent number 8,884,415
- Issue date Nov 11, 2014
- NXP B.V.
- Peeradech Khunpukdee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit transponder, method of producing an integrated c...
- Patent number 8,844,826
- Issue date Sep 30, 2014
- NXP B.V.
- Reinard Rogy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for manufacturing an electronic device
- Patent number 8,695,207
- Issue date Apr 15, 2014
- NXP B.V.
- Christian Zenz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip card for insertion into a holder
- Patent number 8,695,881
- Issue date Apr 15, 2014
- NXP B.V.
- Joachim Heinz Schober
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of and device for determining and controlling the distance b...
- Patent number 8,669,123
- Issue date Mar 11, 2014
- NXP B.V.
- Christian Zenz
- G01 - MEASURING TESTING
Information Patent Grant
RFID circuit and method
- Patent number 8,628,018
- Issue date Jan 14, 2014
- NXP, B.V.
- Christian Zenz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Transponder and method of producing a transponder
- Patent number 8,448,870
- Issue date May 28, 2013
- NXP B.V.
- Reinard Rogy
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
Integrated Circuit Saw Bow Break Point
- Publication number 20200402918
- Publication date Dec 24, 2020
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-INTERFACE IC CARD MODULE
- Publication number 20190355693
- Publication date Nov 21, 2019
- NXP B.V.
- CHRISTIAN ZENZ
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DUAL-INTERFACE IC CARD
- Publication number 20170140257
- Publication date May 18, 2017
- NXP B.V.
- Christian Zenz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DUAL-INTERFACE IC CARD MODULE
- Publication number 20170092612
- Publication date Mar 30, 2017
- NXP B.V.
- Christian Zenz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DUAL-INTERFACE IC CARD COMPONENTS AND METHOD FOR MANUFACTURING THE...
- Publication number 20150278674
- Publication date Oct 1, 2015
- NXP B.V.
- Patrick Schoengrundner
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DUAL INTERFACE IC CARD COMPONENTS AND METHOD FOR MANUFACTURING THE...
- Publication number 20150278673
- Publication date Oct 1, 2015
- NXP B.V.
- Christian Zenz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ENCAPSULATED WAFER-LEVEL CHIP SCALE (WLSCP) PEDESTAL PACKAGING
- Publication number 20150162306
- Publication date Jun 11, 2015
- NXP B.V.
- Leonardus Antonius Elisabeth VAN GEMERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING A TRANSPONDER AND A TRANSPONDER
- Publication number 20150144704
- Publication date May 28, 2015
- NXP B.V.
- Reinhard Rogy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IC PACKAGE WITH STAINLESS STEEL LEADFRAME
- Publication number 20140239471
- Publication date Aug 28, 2014
- NXP B.V.
- Peeradech Khunpukdee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE PROTECTION FOR A WAFER-LEVEL CHIP SCALE PACKAGE (WLCSP)
- Publication number 20140110826
- Publication date Apr 24, 2014
- NXP B.V.
- Hartmut BUENNING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USING A DOUBLE-CUT FOR MECHANICAL PROTECTION OF A WAFER-LEVEL CHIP...
- Publication number 20140110842
- Publication date Apr 24, 2014
- NXP B.V.
- Christian ZENZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED WAFER-LEVEL CHIP SCALE (WLSCP) PEDESTAL PACKAGING
- Publication number 20140091458
- Publication date Apr 3, 2014
- NXP B.V.
- Leonardus Antonius Elisabeth VAN GEMERT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RFID CIRCUIT AND METHOD
- Publication number 20130270348
- Publication date Oct 17, 2013
- Christian Zenz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE
- Publication number 20110189824
- Publication date Aug 4, 2011
- NXP B.V.
- Christian Zenz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE
- Publication number 20110073357
- Publication date Mar 31, 2011
- NXP B.V.
- Christian Zenz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD OF AND DEVICE FOR DETERMINING AND CONTROLLING THE DISTANCE B...
- Publication number 20100323459
- Publication date Dec 23, 2010
- NXP B.V.
- Christian Zenz
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF AND DEVICE FOR DETERMINING THE DISTANCE BETWEEN AN INTEGR...
- Publication number 20100310124
- Publication date Dec 9, 2010
- NXP B.V.
- Christian Zenz
- G01 - MEASURING TESTING
Information Patent Application
ANTENNA OR A STRAP FOR ACCOMMODATING AN INTEGRATED CIRCUIT, AN ANTE...
- Publication number 20100253589
- Publication date Oct 7, 2010
- NXP B.V.
- Christian Zenz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Transponder and Method of Producing a Transponder
- Publication number 20090294542
- Publication date Dec 3, 2009
- NXP B.V.
- Reinard Rogy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Integrated Circuit Transponder, Method of Producing an Integrated C...
- Publication number 20090283602
- Publication date Nov 19, 2009
- NXP B.V.
- Reinard Rogy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Chip card for insertion into a holder
- Publication number 20090200381
- Publication date Aug 13, 2009
- Koninklijke Philips Electronics N.V.
- Joachim Heinz Schober
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method of Producing a Transponder and a Transponder
- Publication number 20080309462
- Publication date Dec 18, 2008
- NXP B.V.
- Reinhard Rogy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Device Comprising a Substrate Including an Electronic Contact, and...
- Publication number 20080308310
- Publication date Dec 18, 2008
- NXP B.V.
- Reinhard Rogy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Chip with Light Protection Layer
- Publication number 20080093712
- Publication date Apr 24, 2008
- Koninklijke Philips Electronics N.V.
- Christian Zenz
- H01 - BASIC ELECTRIC ELEMENTS

Christian Zenz

Person

Patents Grantslast 30 patents

Dual-interface IC card module

Integrated circuit saw bow break point

Dual-interface IC card module

Dual-interface IC card

Method of producing a transponder and a transponder

Dual-interface IC card components and method for manufacturing the...

Antenna or a strap for accommodating an integrated circuit, an ante...

Dual interface IC card components and method for manufacturing the...

Protection of a wafer-level chip scale package (WLCSP)

Encapsulated wafer-level chip scale (WLSCP) pedestal packaging

Method of producing a transponder and a transponder

IC package with stainless steel leadframe

Integrated circuit transponder, method of producing an integrated c...

Method for manufacturing an electronic device

Chip card for insertion into a holder

Method of and device for determining and controlling the distance b...

RFID circuit and method

Transponder and method of producing a transponder

Patents Applicationslast 30 patents

Integrated Circuit Saw Bow Break Point

DUAL-INTERFACE IC CARD MODULE

DUAL-INTERFACE IC CARD

DUAL-INTERFACE IC CARD MODULE

DUAL-INTERFACE IC CARD COMPONENTS AND METHOD FOR MANUFACTURING THE...

DUAL INTERFACE IC CARD COMPONENTS AND METHOD FOR MANUFACTURING THE...

ENCAPSULATED WAFER-LEVEL CHIP SCALE (WLSCP) PEDESTAL PACKAGING

METHOD OF PRODUCING A TRANSPONDER AND A TRANSPONDER

IC PACKAGE WITH STAINLESS STEEL LEADFRAME

BACKSIDE PROTECTION FOR A WAFER-LEVEL CHIP SCALE PACKAGE (WLCSP)

USING A DOUBLE-CUT FOR MECHANICAL PROTECTION OF A WAFER-LEVEL CHIP...

ENCAPSULATED WAFER-LEVEL CHIP SCALE (WLSCP) PEDESTAL PACKAGING

RFID CIRCUIT AND METHOD

METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE

METHOD OF AND DEVICE FOR DETERMINING AND CONTROLLING THE DISTANCE B...

METHOD OF AND DEVICE FOR DETERMINING THE DISTANCE BETWEEN AN INTEGR...

ANTENNA OR A STRAP FOR ACCOMMODATING AN INTEGRATED CIRCUIT, AN ANTE...

Transponder and Method of Producing a Transponder

Integrated Circuit Transponder, Method of Producing an Integrated C...

Chip card for insertion into a holder

Method of Producing a Transponder and a Transponder

Device Comprising a Substrate Including an Electronic Contact, and...

Chip with Light Protection Layer