Christophe F. Pomarede

Person

Phoeniz, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method to form ultra high quality silicon-containing compound layers
- Patent number 7,964,513
- Issue date Jun 21, 2011
- ASM America, Inc.
- Michael A. Todd
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integration of high k gate dielectric
- Patent number 7,790,556
- Issue date Sep 7, 2010
- ASM America, Inc.
- Christophe F. Pomarede
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method to form ultra high quality silicon-containing compound layers
- Patent number 7,651,953
- Issue date Jan 26, 2010
- ASM America, Inc.
- Michael A. Todd
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Remote plasma activated nitridation
- Patent number 7,629,270
- Issue date Dec 8, 2009
- ASM America, Inc.
- Johan Swerts
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Incorporation of nitrogen into high k dielectric film
- Patent number 7,569,284
- Issue date Aug 4, 2009
- ASM America, Inc.
- Eric J. Shero
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface preparation prior to deposition
- Patent number 7,476,627
- Issue date Jan 13, 2009
- ASM America, Inc.
- Christophe F. Pomarede
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Incorporation of nitrogen into high k dielectric film
- Patent number 7,405,453
- Issue date Jul 29, 2008
- ASM America, Inc.
- Eric J. Shero
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method to form ultra high quality silicon-containing compound layers
- Patent number 7,297,641
- Issue date Nov 20, 2007
- ASM America, Inc.
- Michael A. Todd
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low temperature silicon compound deposition
- Patent number 7,294,582
- Issue date Nov 13, 2007
- ASM International, NV.
- Ruben Haverkort
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface preparation prior to deposition
- Patent number 7,056,835
- Issue date Jun 6, 2006
- ASM America, Inc.
- Christophe F. Pomarede
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integration of high k gate dielectric
- Patent number 7,026,219
- Issue date Apr 11, 2006
- ASM America, Inc.
- Christophe F. Pomarede
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Reduced cross-contamination between chambers in a semiconductor pro...
- Patent number 7,022,613
- Issue date Apr 4, 2006
- ASM America, Inc.
- Christophe Pomarede
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Incorporation of nitrogen into high k dielectric film
- Patent number 6,960,537
- Issue date Nov 1, 2005
- ASM America, Inc.
- Eric J. Shero
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface preparation prior to deposition
- Patent number 6,958,277
- Issue date Oct 25, 2005
- ASM America, Inc.
- Christophe F. Pomarede
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma etch resistant coating and process
- Patent number 6,825,051
- Issue date Nov 30, 2004
- ASM America, Inc.
- Fred AmRhein
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low temperature method of forming a gate stack with a high k layer...
- Patent number 6,806,145
- Issue date Oct 19, 2004
- ASM International, N.V.
- Suvi Haukka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduced cross-contamination between chambers in a semiconductor pro...
- Patent number 6,797,617
- Issue date Sep 28, 2004
- ASM America, Inc.
- Christophe Pomarede
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface preparation prior to deposition
- Patent number 6,613,695
- Issue date Sep 2, 2003
- ASM America, Inc.
- Christophe F. Pomarede
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
MULTIPLE VAPOR SOURCES FOR VAPOR DEPOSITION
- Publication number 20130203267
- Publication date Aug 8, 2013
- ASM IP HOLDING B.V.
- Christophe Pomarede
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD TO FORM ULTRA HIGH QUALITY SILICON-CONTAINING COMPOUND LAYERS
- Publication number 20090311857
- Publication date Dec 17, 2009
- ASM AMERICA, INC
- Michael A. Todd
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INCORPORATION OF NITROGEN INTO HIGH K DIELECTRIC FILM
- Publication number 20080286589
- Publication date Nov 20, 2008
- ASM AMERICA, INC
- Eric J. Shero
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD TO FORM ULTRA HIGH QUALITY SILICON-CONTAINING COMPOUND LAYERS
- Publication number 20080038936
- Publication date Feb 14, 2008
- ASM AMERICA, INC
- Michael A. Todd
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Silicon oxide cap over high dielectric constant films
- Publication number 20060211259
- Publication date Sep 21, 2006
- Jan Willem Maes
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Surface preparation prior to deposition
- Publication number 20060205230
- Publication date Sep 14, 2006
- Christophe F. Pomarede
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Remote plasma activated nitridation
- Publication number 20060110943
- Publication date May 25, 2006
- Johan Swerts
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Low temperature silicon compound deposition
- Publication number 20060088985
- Publication date Apr 27, 2006
- Ruben Haverkort
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Integration of high k gate dielectric
- Publication number 20050233529
- Publication date Oct 20, 2005
- Christophe F. Pomarede
- C30 - CRYSTAL GROWTH
Information Patent Application
Incorporation of nitrogen into high k dielectric film
- Publication number 20050212119
- Publication date Sep 29, 2005
- Eric J. Shero
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method to form ultra high quality silicon-containing compound layers
- Publication number 20050118837
- Publication date Jun 2, 2005
- Michael A. Todd
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plasma etch resistant coating and process
- Publication number 20040255868
- Publication date Dec 23, 2004
- Fred AmRhein
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Reduced cross-contamination between chambers in a semiconductor pro...
- Publication number 20040166683
- Publication date Aug 26, 2004
- Christophe Pomarede
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface preparation prior to deposition
- Publication number 20040147101
- Publication date Jul 29, 2004
- Christophe F. Pomarede
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Surface preparation prior to deposition
- Publication number 20040121620
- Publication date Jun 24, 2004
- Christophe F. Pomarede
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Reduced cross-contamination between chambers in a semiconductor pro...
- Publication number 20030219977
- Publication date Nov 27, 2003
- Christophe Pomarede
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma etch resistant coating and process
- Publication number 20030215963
- Publication date Nov 20, 2003
- Fred AmRhein
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Incorporation of nitrogen into high k dielectric film
- Publication number 20030072975
- Publication date Apr 17, 2003
- Eric J. Shero
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Low temperature gate stack
- Publication number 20030049942
- Publication date Mar 13, 2003
- Suvi Haukka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface preparation prior to deposition
- Publication number 20020098627
- Publication date Jul 25, 2002
- Christophe F. Pomarede
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Christophe F. Pomarede

Person

Patents Grantslast 30 patents

Method to form ultra high quality silicon-containing compound layers

Integration of high k gate dielectric

Method to form ultra high quality silicon-containing compound layers

Remote plasma activated nitridation

Incorporation of nitrogen into high k dielectric film

Surface preparation prior to deposition

Incorporation of nitrogen into high k dielectric film

Method to form ultra high quality silicon-containing compound layers

Low temperature silicon compound deposition

Surface preparation prior to deposition

Integration of high k gate dielectric

Reduced cross-contamination between chambers in a semiconductor pro...

Incorporation of nitrogen into high k dielectric film

Surface preparation prior to deposition

Plasma etch resistant coating and process

Low temperature method of forming a gate stack with a high k layer...

Reduced cross-contamination between chambers in a semiconductor pro...

Surface preparation prior to deposition

Patents Applicationslast 30 patents

MULTIPLE VAPOR SOURCES FOR VAPOR DEPOSITION

METHOD TO FORM ULTRA HIGH QUALITY SILICON-CONTAINING COMPOUND LAYERS

INCORPORATION OF NITROGEN INTO HIGH K DIELECTRIC FILM

METHOD TO FORM ULTRA HIGH QUALITY SILICON-CONTAINING COMPOUND LAYERS

Silicon oxide cap over high dielectric constant films

Surface preparation prior to deposition

Remote plasma activated nitridation

Low temperature silicon compound deposition

Integration of high k gate dielectric

Incorporation of nitrogen into high k dielectric film

Method to form ultra high quality silicon-containing compound layers

Plasma etch resistant coating and process

Reduced cross-contamination between chambers in a semiconductor pro...

Surface preparation prior to deposition

Surface preparation prior to deposition

Reduced cross-contamination between chambers in a semiconductor pro...

Plasma etch resistant coating and process

Incorporation of nitrogen into high k dielectric film

Low temperature gate stack

Surface preparation prior to deposition