Christopher J. Berry

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thin bonded interposer package
- Patent number 11,621,243
- Issue date Apr 4, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Christopher J. Berry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin bonded interposer package
- Patent number 10,818,637
- Issue date Oct 27, 2020
- Amkor Technology, Inc.
- Christopher J. Berry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 10,446,455
- Issue date Oct 15, 2019
- Amkor Technology, Inc.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 10,297,515
- Issue date May 21, 2019
- Amkor Technology, Inc.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thin bonded interposer package
- Patent number 10,242,966
- Issue date Mar 26, 2019
- Amkor Technology, Inc.
- Christopher J. Berry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper pillar sidewall protection
- Patent number 9,875,980
- Issue date Jan 23, 2018
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package in package
- Patent number 9,768,124
- Issue date Sep 19, 2017
- Amkor Technology, Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin bonded interposer package
- Patent number 9,711,485
- Issue date Jul 18, 2017
- Amkor Technology, Inc.
- Christopher J. Berry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package in package
- Patent number 9,466,545
- Issue date Oct 11, 2016
- Amkor Technology, Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafers including patterned back side layers thereon
- Patent number 8,643,177
- Issue date Feb 4, 2014
- Amkor Technology, Inc.
- Glenn A. Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct-write wafer level chip scale package
- Patent number 8,501,543
- Issue date Aug 6, 2013
- Amkor Technology, Inc.
- Christopher John Berry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bend test method and apparatus for flip chip devices
- Patent number 8,365,611
- Issue date Feb 5, 2013
- Amkor Technology, Inc.
- Robert F. Darveaux
- G01 - MEASURING TESTING
Information Patent Grant
Thin stacked interposer package
- Patent number 8,319,338
- Issue date Nov 27, 2012
- Amkor Technology, Inc.
- Christopher J. Berry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having RF shielding and method therefor
- Patent number 8,299,610
- Issue date Oct 30, 2012
- Amkor Technology, Inc.
- Christopher J. Berry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual laminate package structure with embedded elements
- Patent number 8,283,767
- Issue date Oct 9, 2012
- Amkor Technology, Inc.
- Christopher J. Berry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct-write wafer level chip scale package
- Patent number 8,188,584
- Issue date May 29, 2012
- Amkor Technology, Inc.
- Christopher John Berry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having EMI shielding and method therefor
- Patent number 7,898,066
- Issue date Mar 1, 2011
- Amkor Technology, Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual laminate package structure with embedded elements
- Patent number 7,872,343
- Issue date Jan 18, 2011
- Amkor Technology, Inc.
- Christopher J. Berry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Exposed metal bezel for use in sensor devices and method therefor
- Patent number 7,859,116
- Issue date Dec 28, 2010
- Amkor Technology, Inc.
- Michael G. Kelly
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stackable semiconductor package including laminate interposer
- Patent number 7,829,990
- Issue date Nov 9, 2010
- Amkor Technology, Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Membrane die attach circuit element package and method therefor
- Patent number 7,781,852
- Issue date Aug 24, 2010
- Amkor Technology, Inc.
- Faheem F. Faheem
- G01 - MEASURING TESTING
Information Patent Grant
Thin stacked interposer package
- Patent number 7,777,351
- Issue date Aug 17, 2010
- Amkor Technology, Inc.
- Christopher J. Berry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having RF shielding and method therefor
- Patent number 7,745,910
- Issue date Jun 29, 2010
- Amkor Technology, Inc.
- Timothy L. Olson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch singulated semiconductor package
- Patent number 7,732,899
- Issue date Jun 8, 2010
- Amkor Technology, Inc.
- Christopher J. Berry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct-write wafer level chip scale package
- Patent number 7,723,210
- Issue date May 25, 2010
- Amkor Technology, Inc.
- Christopher John Berry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual laminate package structure with embedded elements
- Patent number 7,687,899
- Issue date Mar 30, 2010
- Amkor Technology, Inc.
- Christopher J. Berry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch singulated semiconductor package
- Patent number 7,507,603
- Issue date Mar 24, 2009
- Amkor Technology, Inc.
- Christopher J. Berry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having RF shielding and method therefor
- Patent number 7,342,303
- Issue date Mar 11, 2008
- Amkor Technology, Inc.
- Christopher J. Berry
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THIN BONDED INTERPOSER PACKAGE
- Publication number 20210111151
- Publication date Apr 15, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Christopher J. Berry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20200219780
- Publication date Jul 9, 2020
- Amkor Technology, Inc.
- Sung Sun Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THIN BONDED INTERPOSER PACKAGE
- Publication number 20190348395
- Publication date Nov 14, 2019
- Amkor Technology, Inc.
- Christopher J. Berry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20170243798
- Publication date Aug 24, 2017
- Amkor Technology, Inc.
- Sung Sun Park
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE IN PACKAGE
- Publication number 20160379933
- Publication date Dec 29, 2016
- Amkor Technology, Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20160335470
- Publication date Nov 17, 2016
- Amkor Technology, Inc.
- Sung Sun Park
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
COPPER PILLAR SIDEWALL PROTECTION
- Publication number 20150340332
- Publication date Nov 26, 2015
- Amkor Technology, Inc.
- Glenn Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN SANDWICH EMBEDDED PACKAGE
- Publication number 20150221570
- Publication date Aug 6, 2015
- Amkor Technology, Inc.
- Christopher J. Berry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Two-sided wafer escape package
- Publication number 20070241446
- Publication date Oct 18, 2007
- Amkor Technology, Inc.
- Christopher John Berry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Back Side Layers for Thinned Wafers and Related...
- Publication number 20070161234
- Publication date Jul 12, 2007
- Glenn A. Rinne
- H01 - BASIC ELECTRIC ELEMENTS

Christopher J. Berry

Person

Patents Grantslast 30 patents

Thin bonded interposer package

Thin bonded interposer package

Fingerprint sensor and manufacturing method thereof

Fingerprint sensor and manufacturing method thereof

Thin bonded interposer package

Copper pillar sidewall protection

Semiconductor package in package

Thin bonded interposer package

Semiconductor package in package

Wafers including patterned back side layers thereon

Direct-write wafer level chip scale package

Bend test method and apparatus for flip chip devices

Thin stacked interposer package

Semiconductor device having RF shielding and method therefor

Dual laminate package structure with embedded elements

Direct-write wafer level chip scale package

Semiconductor device having EMI shielding and method therefor

Dual laminate package structure with embedded elements

Exposed metal bezel for use in sensor devices and method therefor

Stackable semiconductor package including laminate interposer

Membrane die attach circuit element package and method therefor

Thin stacked interposer package

Semiconductor device having RF shielding and method therefor

Etch singulated semiconductor package

Direct-write wafer level chip scale package

Dual laminate package structure with embedded elements

Etch singulated semiconductor package

Semiconductor device having RF shielding and method therefor

Patents Applicationslast 30 patents

THIN BONDED INTERPOSER PACKAGE

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

THIN BONDED INTERPOSER PACKAGE

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE IN PACKAGE

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

COPPER PILLAR SIDEWALL PROTECTION

THIN SANDWICH EMBEDDED PACKAGE

Two-sided wafer escape package

Methods of Forming Back Side Layers for Thinned Wafers and Related...