Christopher J. JEZEWSKI

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Dual contact process with stacked metal layers
- Patent number 12,170,319
- Issue date Dec 17, 2024
- Intel Corporation
- Kevin Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit interconnect structures with ultra-thin metal ch...
- Patent number 12,165,917
- Issue date Dec 10, 2024
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect techniques for electrically connecting source/drain re...
- Patent number 12,107,085
- Issue date Oct 1, 2024
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor channel passivation with 2D crystalline material
- Patent number 12,107,170
- Issue date Oct 1, 2024
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation wall stressor structures to improve channel stress and th...
- Patent number 12,033,896
- Issue date Jul 9, 2024
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractively patterned interconnect structures for integrated circ...
- Patent number 12,027,458
- Issue date Jul 2, 2024
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistors with metal chalcogenide channel materials
- Patent number 11,888,034
- Issue date Jan 30, 2024
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization structures for stacked device connectivity and their...
- Patent number 11,869,894
- Issue date Jan 9, 2024
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt based interconnects and methods of fabrication thereof
- Patent number 11,862,563
- Issue date Jan 2, 2024
- Tahoe Research, LTD.
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits with line breaks and line bridges within a sing...
- Patent number 11,830,768
- Issue date Nov 28, 2023
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and methods for forming integrated circuits
- Patent number 11,830,788
- Issue date Nov 28, 2023
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cladded metal interconnects
- Patent number 11,749,560
- Issue date Sep 5, 2023
- Intel Corporation
- Thomas Marieb
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Interconnect techniques for electrically connecting source/drain re...
- Patent number 11,742,346
- Issue date Aug 29, 2023
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectable vias for back end of line interconnects
- Patent number 11,670,588
- Issue date Jun 6, 2023
- Intel Corporation
- Christopher Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staggered lines for interconnect performance improvement and proces...
- Patent number 11,664,305
- Issue date May 30, 2023
- Intel Corporation
- Kevin Lai Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming substrate interconnect structures for enhanced t...
- Patent number 11,652,067
- Issue date May 16, 2023
- Intel Corporation
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact stacks to reduce hydrogen in semiconductor devices
- Patent number 11,637,185
- Issue date Apr 25, 2023
- Intel Corporation
- Justin Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic memory device with ruthenium diffusion barrier
- Patent number 11,626,451
- Issue date Apr 11, 2023
- Intel Corporation
- Emily Walker
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuits (IC's) with electro-migration (EM)—resistant se...
- Patent number 11,557,536
- Issue date Jan 17, 2023
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic sealants in transistor arrangements
- Patent number 11,522,059
- Issue date Dec 6, 2022
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion structure for thin film transistor
- Patent number 11,482,622
- Issue date Oct 25, 2022
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Retention improvement by high-k encapsulation of RRAM devices
- Patent number 11,462,684
- Issue date Oct 4, 2022
- Intel Corporation
- Albert Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractively patterned interconnect structures for integrated circ...
- Patent number 11,444,024
- Issue date Sep 13, 2022
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact stacks to reduce hydrogen in thin film transistor
- Patent number 11,444,205
- Issue date Sep 13, 2022
- Intel Corporatiion
- Arnab Sen Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization structures for stacked device connectivity and their...
- Patent number 11,430,814
- Issue date Aug 30, 2022
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation wall stressor structures to improve channel stress and th...
- Patent number 11,393,722
- Issue date Jul 19, 2022
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming high density, high shorting margin, and low capac...
- Patent number 11,380,617
- Issue date Jul 5, 2022
- Intel Corporation
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt based interconnects and methods of fabrication thereof
- Patent number 11,328,993
- Issue date May 10, 2022
- Intel Corporation
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and methods for forming thin film crystal layers
- Patent number 11,276,644
- Issue date Mar 15, 2022
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits with line breaks and line bridges within a sing...
- Patent number 11,205,586
- Issue date Dec 21, 2021
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIRC...
- Publication number 20240304543
- Publication date Sep 12, 2024
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOOLS AND METHODS FOR SUBTRACTIVE METAL PATTERNING
- Publication number 20240162058
- Publication date May 16, 2024
- Intel Corporation
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF
- Publication number 20240145391
- Publication date May 2, 2024
- Tahoe Research, Ltd.
- Christopher J. JEZEWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-RESISTANCE AND THERMALLY STABLE CONTACTS WITH PHOSPHIDE OR ARSE...
- Publication number 20240006506
- Publication date Jan 4, 2024
- Intel Corporation
- Gilbert Dewey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-RESISTANCE AND THERMALLY STABLE CONTACTS WITH BORIDE, INDIUM, O...
- Publication number 20240006533
- Publication date Jan 4, 2024
- Intel Corporation
- Gilbert Dewey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SOURCE AND DRAIN CONTACTS TUNED FOR VERTICALLY STACKED PMOS AND...
- Publication number 20230395718
- Publication date Dec 7, 2023
- Intel Corporation
- Willy Rachmady
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SOURCE AND DRAIN CONTACTS TUNED FOR PMOS AND NMOS
- Publication number 20230395717
- Publication date Dec 7, 2023
- Intel Corporation
- Willy Rachmady
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT TECHNIQUES FOR ELECTRICALLY CONNECTING SOURCE/DRAIN RE...
- Publication number 20230352481
- Publication date Nov 2, 2023
- Intel Corporation
- AARON D. LILAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILL OF VIAS IN SINGLE AND DUAL DAMASCENE STRUCTURES USING SELF-ASS...
- Publication number 20230197601
- Publication date Jun 22, 2023
- Intel Corporation
- Jiun-Ruey Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH MAX OR MX CONDUCTIVE MATERIALS
- Publication number 20230197836
- Publication date Jun 22, 2023
- Intel Corporation
- Carl Hugo Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED TRANSISTOR STRUCTURES WITH DIVERSE GATE MATERIALS
- Publication number 20230197728
- Publication date Jun 22, 2023
- Intel Corporation
- Nicole K. Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE METAL TO SEMICONDUCTOR CONTACTS FOR INTEGRATED NMOS...
- Publication number 20230197823
- Publication date Jun 22, 2023
- Intel Corporation
- Christopher J. Jezewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT LINE STRUCTURES WITH METAL CHALCOGENIDE CAP MATERIALS
- Publication number 20230197512
- Publication date Jun 22, 2023
- Intel Corporation
- Carl H. Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INTERCONNECT STRUCTURES WITH GRAPHENE CAP
- Publication number 20220415818
- Publication date Dec 29, 2022
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIC SEALANTS IN TRANSISTOR ARRANGEMENTS
- Publication number 20220406907
- Publication date Dec 22, 2022
- Intel Corporation
- Abhishek A. Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIR...
- Publication number 20220352068
- Publication date Nov 3, 2022
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ISOLATION WALL STRESSOR STRUCTURES TO IMPROVE CHANNEL STRESS AND TH...
- Publication number 20220352029
- Publication date Nov 3, 2022
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZATION STRUCTURES FOR STACKED DEVICE CONNECTIVITY AND THEIR...
- Publication number 20220344376
- Publication date Oct 27, 2022
- Intel Corporation
- Aaron D. Lilak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING HIGH DENSITY, HIGH SHORTING MARGIN, AND LOW CAPAC...
- Publication number 20220270964
- Publication date Aug 25, 2022
- Intel Corporation
- Christopher J. JEZEWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF
- Publication number 20220238451
- Publication date Jul 28, 2022
- Intel Corporation
- Christopher J. JEZEWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuits and Methods for Forming Thin Film Crystal Layers
- Publication number 20220148917
- Publication date May 12, 2022
- Intel Corporation
- Carl NAYLOR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INTERCONNECT STRUCTURES WITH ULTRA-THIN METAL C...
- Publication number 20220139775
- Publication date May 5, 2022
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIR...
- Publication number 20220139823
- Publication date May 5, 2022
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE AND REDUCED REACTIVITY APPROACHES FOR FABRICATING CO...
- Publication number 20220102522
- Publication date Mar 31, 2022
- Intel Corporation
- Gilbert DEWEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL CONTACT PROCESS WITH STACKED METAL LAYERS
- Publication number 20220102510
- Publication date Mar 31, 2022
- Intel Corporation
- Kevin COOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAMASCENE INTERCONNECT STRUCTURES WITH LOW RESISTANCE VIAS FOR INTE...
- Publication number 20220102268
- Publication date Mar 31, 2022
- Intel Corporation
- Urusa Alaan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA CONNECTIONS FOR STAGGERED INTERCONNECT LINES
- Publication number 20220093505
- Publication date Mar 24, 2022
- Intel Corporation
- Christopher J. JEZEWSKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZATION STACKS WITH SELF-ALIGNED STAGGERED METAL LINES
- Publication number 20220084942
- Publication date Mar 17, 2022
- Intel Corporation
- Elijah V. Karpov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH LINE BREAKS AND LINE BRIDGES WITHIN A SING...
- Publication number 20220076995
- Publication date Mar 10, 2022
- Intel Corporation
- Kevin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR CHANNEL PASSIVATION WITH 2D CRYSTALLINE MATERIAL
- Publication number 20220059702
- Publication date Feb 24, 2022
- Intel Corporation
- Carl Naylor
- H01 - BASIC ELECTRIC ELEMENTS

Christopher J. JEZEWSKI

Person

Patents Grantslast 30 patents

Dual contact process with stacked metal layers

Integrated circuit interconnect structures with ultra-thin metal ch...

Interconnect techniques for electrically connecting source/drain re...

Transistor channel passivation with 2D crystalline material

Isolation wall stressor structures to improve channel stress and th...

Subtractively patterned interconnect structures for integrated circ...

Transistors with metal chalcogenide channel materials

Metallization structures for stacked device connectivity and their...

Cobalt based interconnects and methods of fabrication thereof

Integrated circuits with line breaks and line bridges within a sing...

Integrated circuits and methods for forming integrated circuits

Cladded metal interconnects

Interconnect techniques for electrically connecting source/drain re...

Selectable vias for back end of line interconnects

Staggered lines for interconnect performance improvement and proces...

Methods of forming substrate interconnect structures for enhanced t...

Contact stacks to reduce hydrogen in semiconductor devices

Magnetic memory device with ruthenium diffusion barrier

Integrated circuits (IC's) with electro-migration (EM)—resistant se...

Metallic sealants in transistor arrangements

Adhesion structure for thin film transistor

Retention improvement by high-k encapsulation of RRAM devices

Subtractively patterned interconnect structures for integrated circ...

Contact stacks to reduce hydrogen in thin film transistor

Metallization structures for stacked device connectivity and their...

Isolation wall stressor structures to improve channel stress and th...

Method of forming high density, high shorting margin, and low capac...

Cobalt based interconnects and methods of fabrication thereof

Integrated circuits and methods for forming thin film crystal layers

Integrated circuits with line breaks and line bridges within a sing...

Patents Applicationslast 30 patents

SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIRC...

TOOLS AND METHODS FOR SUBTRACTIVE METAL PATTERNING

COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF

LOW-RESISTANCE AND THERMALLY STABLE CONTACTS WITH PHOSPHIDE OR ARSE...

LOW-RESISTANCE AND THERMALLY STABLE CONTACTS WITH BORIDE, INDIUM, O...

3D SOURCE AND DRAIN CONTACTS TUNED FOR VERTICALLY STACKED PMOS AND...

3D SOURCE AND DRAIN CONTACTS TUNED FOR PMOS AND NMOS

INTERCONNECT TECHNIQUES FOR ELECTRICALLY CONNECTING SOURCE/DRAIN RE...

FILL OF VIAS IN SINGLE AND DUAL DAMASCENE STRUCTURES USING SELF-ASS...

INTEGRATED CIRCUITS WITH MAX OR MX CONDUCTIVE MATERIALS

STACKED TRANSISTOR STRUCTURES WITH DIVERSE GATE MATERIALS

LOW RESISTANCE METAL TO SEMICONDUCTOR CONTACTS FOR INTEGRATED NMOS...

INTERCONNECT LINE STRUCTURES WITH METAL CHALCOGENIDE CAP MATERIALS

INTEGRATED CIRCUIT INTERCONNECT STRUCTURES WITH GRAPHENE CAP

METALLIC SEALANTS IN TRANSISTOR ARRANGEMENTS

SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIR...

ISOLATION WALL STRESSOR STRUCTURES TO IMPROVE CHANNEL STRESS AND TH...

METALLIZATION STRUCTURES FOR STACKED DEVICE CONNECTIVITY AND THEIR...

METHOD OF FORMING HIGH DENSITY, HIGH SHORTING MARGIN, AND LOW CAPAC...

COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF

Integrated Circuits and Methods for Forming Thin Film Crystal Layers

INTEGRATED CIRCUIT INTERCONNECT STRUCTURES WITH ULTRA-THIN METAL C...

SUBTRACTIVELY PATTERNED INTERCONNECT STRUCTURES FOR INTEGRATED CIR...

LOW RESISTANCE AND REDUCED REACTIVITY APPROACHES FOR FABRICATING CO...

DUAL CONTACT PROCESS WITH STACKED METAL LAYERS

DAMASCENE INTERCONNECT STRUCTURES WITH LOW RESISTANCE VIAS FOR INTE...

VIA CONNECTIONS FOR STAGGERED INTERCONNECT LINES

METALLIZATION STACKS WITH SELF-ALIGNED STAGGERED METAL LINES

INTEGRATED CIRCUITS WITH LINE BREAKS AND LINE BRIDGES WITHIN A SING...

TRANSISTOR CHANNEL PASSIVATION WITH 2D CRYSTALLINE MATERIAL