Christopher L. RUMER

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Barrier structures for underfill containment
- Patent number 12,002,727
- Issue date Jun 4, 2024
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally coupled package-on-package semiconductor packages
- Patent number 11,222,877
- Issue date Jan 11, 2022
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package thermal transfer systems and methods
- Patent number 11,056,466
- Issue date Jul 6, 2021
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package thermal transfer systems and methods
- Patent number 10,438,930
- Issue date Oct 8, 2019
- Intel Corporation
- Omkar Karhade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer coat layers and methods therefor
- Patent number 8,193,072
- Issue date Jun 5, 2012
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipating device with preselected designed interface for the...
- Patent number 7,996,989
- Issue date Aug 16, 2011
- Intel Corporation
- Ashay A. Dani
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor wafer coat layers and methods therefor
- Patent number 7,897,486
- Issue date Mar 1, 2011
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated heat spreader, heat sink or heat pipe with pre-attached...
- Patent number 7,846,778
- Issue date Dec 7, 2010
- Intel Corporation
- Christopher L. Rumer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
No-flow underfill composition and method
- Patent number 7,619,318
- Issue date Nov 17, 2009
- Intel Corporation
- Christopher L. Rumer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual pulsed beam laser micromachining method
- Patent number 7,611,966
- Issue date Nov 3, 2009
- Intel Corporation
- Eric J. Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipating device with preselected designed interface for the...
- Patent number 7,527,090
- Issue date May 5, 2009
- Intel Corporation
- Ashay A. Dani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated heat spreader, heat sink or heat pipe with pre-attached...
- Patent number 7,473,995
- Issue date Jan 6, 2009
- Intel Corporation
- Christopher L. Rumer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus to compensate for stress between heat spreader and therma...
- Patent number 7,358,606
- Issue date Apr 15, 2008
- Intel Corporation
- Christopher L. Rumer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic solder thermal interface material layer and application of...
- Patent number 7,347,354
- Issue date Mar 25, 2008
- Intel Corporation
- Edward Hurley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal interface material and electronic assembly having such a th...
- Patent number 7,311,967
- Issue date Dec 25, 2007
- Intel Corporation
- Ashay A. Dani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and method for attaching an integrated heat spreader
- Patent number 7,304,381
- Issue date Dec 4, 2007
- Intel Corporation
- Christopher L. Rumer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser micromachining method
- Patent number 7,303,977
- Issue date Dec 4, 2007
- Intel Corporation
- Sergei L. Voronov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor wafer coat layers and methods therefor
- Patent number 7,279,362
- Issue date Oct 9, 2007
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for a dual substrate package
- Patent number 7,247,517
- Issue date Jul 24, 2007
- Intel Corporation
- Christopher L. Rumer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package pressure release apparatus and method
- Patent number 7,242,088
- Issue date Jul 10, 2007
- Intel Corporation
- Sudipto Neogi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Windowed package for electronic circuitry
- Patent number 7,220,624
- Issue date May 22, 2007
- Intel Corporation
- Sudipto Neogi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser micromachining method
- Patent number 7,169,687
- Issue date Jan 30, 2007
- Intel Corporation
- Eric J. Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for handling integrated circuit die
- Patent number 7,059,045
- Issue date Jun 13, 2006
- Intel Corporation
- Daoqiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal ball attachment of heat dissipation devices
- Patent number 6,992,891
- Issue date Jan 31, 2006
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
No-flow underfill composition and method
- Patent number 6,982,492
- Issue date Jan 3, 2006
- Intel Corporation
- Christopher L. Rumer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gel thermal interface materials comprising fillers having low melti...
- Patent number 6,974,723
- Issue date Dec 13, 2005
- Intel Corporation
- James C. Matayabas, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon wafer with soluble protective coating
- Patent number 6,974,726
- Issue date Dec 13, 2005
- Intel Corporation
- Ashay A. Dani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via, folded flex microelectronic package
- Patent number 6,924,551
- Issue date Aug 2, 2005
- Intel Corporation
- Christopher L. Rumer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packaging and methods for thermally protecting pack...
- Patent number 6,911,726
- Issue date Jun 28, 2005
- Intel Corporation
- Christopher L. Rumer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for bonding a wire to a bond pad on a device
- Patent number 6,892,927
- Issue date May 17, 2005
- Intel Corporation
- Christopher L. Rumer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BARRIER STRUCTURES FOR UNDERFILL CONTAINMENT
- Publication number 20210249322
- Publication date Aug 12, 2021
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON PACKAGE THERMAL TRANSFER SYSTEMS AND METHODS
- Publication number 20190385983
- Publication date Dec 19, 2019
- Intel Corporation
- OMKAR KARHADE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY COUPLED PACKAGE-ON-PACKAGE SEMICONDUCTOR
- Publication number 20190103385
- Publication date Apr 4, 2019
- Intel Corporation
- OMKAR KARHADE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE ON PACKAGE THERMAL TRANSFER SYSTEMS AND METHODS
- Publication number 20190006319
- Publication date Jan 3, 2019
- Intel Corporation
- OMKAR KARHADE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADAPTIVE TCB BY DATA FEED FORWARD
- Publication number 20170154828
- Publication date Jun 1, 2017
- Intel Corporation
- Timothy A. GOSSELIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR WAFER COAT LAYERS AND METHODS THEREFOR
- Publication number 20110059596
- Publication date Mar 10, 2011
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATING DEVICE WITH PRESELECTED DESIGNED INTERFACE FOR THE...
- Publication number 20080185713
- Publication date Aug 7, 2008
- Intel Corporation
- Ashay A. Dani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer coat layers and methods therefor
- Publication number 20070218652
- Publication date Sep 20, 2007
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND METHOD FOR ATTACHING AN INTEGRATED HEAT SPREADER
- Publication number 20060267182
- Publication date Nov 30, 2006
- Intel Corporation
- Christopher L. Rumer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual pulsed beam laser micromachining method
- Publication number 20060249816
- Publication date Nov 9, 2006
- Intel Corporation
- Eric J. Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor wafer coat layers and methods therefor
- Publication number 20060223284
- Publication date Oct 5, 2006
- Intel Corporation
- Eric J. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser micromachining method
- Publication number 20060099810
- Publication date May 11, 2006
- Intel Corporation
- Sergei L. Voronov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser micromachining method
- Publication number 20060091125
- Publication date May 4, 2006
- Intel Corporation
- Eric J. Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser ablation method
- Publication number 20060088984
- Publication date Apr 27, 2006
- Intel Corporation
- Eric J. Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
No-flow underfill composition and method
- Publication number 20060025500
- Publication date Feb 2, 2006
- Christopher L. Rumer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Windowed package for electronic circuitry
- Publication number 20050253254
- Publication date Nov 17, 2005
- Sudipto Neogi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic packaging and methods for thermally protecting pack...
- Publication number 20050214977
- Publication date Sep 29, 2005
- Christopher L. Rumer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metallic solder thermal interface material layer and application of...
- Publication number 20050211752
- Publication date Sep 29, 2005
- Intel Corporation
- Edward Hurley
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Silicon wafer with soluable protective coating
- Publication number 20050139962
- Publication date Jun 30, 2005
- Ashay A. Dani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and device for handling integrated circuit die
- Publication number 20050120551
- Publication date Jun 9, 2005
- Daoqiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
No-flow underfill composition and method
- Publication number 20050087891
- Publication date Apr 28, 2005
- Christopher L. Rumer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for a dual substrate package
- Publication number 20050067714
- Publication date Mar 31, 2005
- Christopher L. Rumer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gel thermal interface materials comprising fillers having low melti...
- Publication number 20050040507
- Publication date Feb 24, 2005
- James C. Matayabas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat dissipating device with preselected designed interface for the...
- Publication number 20040261980
- Publication date Dec 30, 2004
- Ashay A. Dani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through silicon via, folded flex microelectronic package
- Publication number 20040238936
- Publication date Dec 2, 2004
- Christopher L. Rumer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package and method for attaching an integrated heat spreader
- Publication number 20040238947
- Publication date Dec 2, 2004
- Intel Corporation
- Christopher L. Rumer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus to compensate for stress between heat spreader and therma...
- Publication number 20040217467
- Publication date Nov 4, 2004
- Intel Corporation
- Christopher L. Rumer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for bonding a wire to a bond pad on a device
- Publication number 20040211761
- Publication date Oct 28, 2004
- Christopher L. Rumer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal ball attachment of heat dissipation devices
- Publication number 20040196634
- Publication date Oct 7, 2004
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gel thermal interface materials comprising fillers having low melti...
- Publication number 20040124526
- Publication date Jul 1, 2004
- James C. Matayabas
- H01 - BASIC ELECTRIC ELEMENTS

Christopher L. RUMER

Person

Patents Grantslast 30 patents

Barrier structures for underfill containment

Thermally coupled package-on-package semiconductor packages

Package on package thermal transfer systems and methods

Package on package thermal transfer systems and methods

Semiconductor wafer coat layers and methods therefor

Heat dissipating device with preselected designed interface for the...

Semiconductor wafer coat layers and methods therefor

Integrated heat spreader, heat sink or heat pipe with pre-attached...

No-flow underfill composition and method

Dual pulsed beam laser micromachining method

Heat dissipating device with preselected designed interface for the...

Integrated heat spreader, heat sink or heat pipe with pre-attached...

Apparatus to compensate for stress between heat spreader and therma...

Metallic solder thermal interface material layer and application of...

Thermal interface material and electronic assembly having such a th...

Package and method for attaching an integrated heat spreader

Laser micromachining method

Semiconductor wafer coat layers and methods therefor

Method and apparatus for a dual substrate package

IC package pressure release apparatus and method

Windowed package for electronic circuitry

Laser micromachining method

Method for handling integrated circuit die

Metal ball attachment of heat dissipation devices

No-flow underfill composition and method

Gel thermal interface materials comprising fillers having low melti...

Silicon wafer with soluble protective coating

Through silicon via, folded flex microelectronic package

Microelectronic packaging and methods for thermally protecting pack...

Method and apparatus for bonding a wire to a bond pad on a device

Patents Applicationslast 30 patents

BARRIER STRUCTURES FOR UNDERFILL CONTAINMENT

PACKAGE ON PACKAGE THERMAL TRANSFER SYSTEMS AND METHODS

THERMALLY COUPLED PACKAGE-ON-PACKAGE SEMICONDUCTOR

PACKAGE ON PACKAGE THERMAL TRANSFER SYSTEMS AND METHODS

ADAPTIVE TCB BY DATA FEED FORWARD

SEMICONDUCTOR WAFER COAT LAYERS AND METHODS THEREFOR

HEAT DISSIPATING DEVICE WITH PRESELECTED DESIGNED INTERFACE FOR THE...

Semiconductor wafer coat layers and methods therefor

PACKAGE AND METHOD FOR ATTACHING AN INTEGRATED HEAT SPREADER

Dual pulsed beam laser micromachining method

Semiconductor wafer coat layers and methods therefor

Laser micromachining method

Laser micromachining method

Laser ablation method

No-flow underfill composition and method

Windowed package for electronic circuitry

Microelectronic packaging and methods for thermally protecting pack...

Metallic solder thermal interface material layer and application of...

Silicon wafer with soluable protective coating

Method and device for handling integrated circuit die

No-flow underfill composition and method

Method and apparatus for a dual substrate package

Gel thermal interface materials comprising fillers having low melti...

Heat dissipating device with preselected designed interface for the...

Through silicon via, folded flex microelectronic package

Package and method for attaching an integrated heat spreader

Apparatus to compensate for stress between heat spreader and therma...

Method and apparatus for bonding a wire to a bond pad on a device

Metal ball attachment of heat dissipation devices

Gel thermal interface materials comprising fillers having low melti...