Christopher M. Scanlan

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Hellerup, DK

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Patents Grantslast 30 patents

Information Patent Grant
System and method for RF shielding of a semiconductor package
- Patent number 8,093,691
- Issue date Jan 10, 2012
- Amkor Technology, Inc.
- Ruben Fuentes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal via heat spreader package and method
- Patent number 7,960,827
- Issue date Jun 14, 2011
- Amkor Technology, Inc.
- August J. Miller, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for shielding of package on package (PoP) assemblies
- Patent number 7,851,894
- Issue date Dec 14, 2010
- Amkor Technology, Inc.
- Christopher M. Scanlan
- H01 - BASIC ELECTRIC ELEMENTS