TREA

Christopher Netzband

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  • Albany, NY, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Methods for wet atomic layer etching of copper
    • Patent number 11,866,831
    • Issue date Jan 9, 2024
    • Tokyo Electron Limited
    • Christopher Netzband
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

  • Information Patent Application

    WAFER BONDING PROCESS WITH REDUCED OVERLAY DISTORTION
    • Publication number 20240063022
    • Publication date Feb 22, 2024
    • TOKYO ELECTRON LIMITED
    • Christopher Michael Netzband
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Methods For Wet Atomic Layer Etching Of Copper
    • Publication number 20230140900
    • Publication date May 11, 2023
    • TOKYO ELECTRON LIMITED
    • Christopher Netzband
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    Method for Etching of Metal
    • Publication number 20230108117
    • Publication date Apr 6, 2023
    • TOKYO ELECTRON LIMITED
    • Sergey Voronin
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...