Christopher W. Ackerman

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
System and apparatus having a seal member for sealing of a device u...
- Patent number 12,000,487
- Issue date Jun 4, 2024
- Intel Corporation
- Paul Diglio
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Apparatus and method for controlling unit specific junction tempera...
- Patent number 11,808,813
- Issue date Nov 7, 2023
- Intel Corporation
- Mahesh Deshmane
- G01 - MEASURING TESTING
Information Patent Grant
Conformable heat sink interface with a high thermal conductivity
- Patent number 11,464,139
- Issue date Oct 4, 2022
- Intel Corporation
- Kelly Lofgreen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Modular thermal energy management designs for data center computing
- Patent number 11,032,941
- Issue date Jun 8, 2021
- Intel Corporation
- Minh Le
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for thermal management of device under test (DUT)
- Patent number 10,281,521
- Issue date May 7, 2019
- Intel Corporation
- David Won-jun Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Direct liquid-contact micro-channel heat transfer devices, methods...
- Patent number 9,448,278
- Issue date Sep 20, 2016
- Intel Corporation
- Christopher R. Schroeder
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Direct liquid-contact micro-channel heat transfer devices, methods...
- Patent number 9,347,987
- Issue date May 24, 2016
- Intel Corporation
- Christopher R. Schroeder
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Direct liquid-contact micro-channel heat transfer devices, methods...
- Patent number 9,207,274
- Issue date Dec 8, 2015
- Intel Corporation
- Christopher R. Schroeder
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Active thermal control using a burn-in socket heating element
- Patent number 7,701,238
- Issue date Apr 20, 2010
- Intel Corporation
- Anthony Yeh Chiing Wong
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
ENHANCED JET IMPINGEMENT LEAK PREVENTION FOR INTEGRATED CIRCUIT
- Publication number 20240175917
- Publication date May 30, 2024
- Intel Corporation
- Ruben NUNEZ BLANCO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND APPARATUS HAVING A SEAL MEMBER FOR SEALING OF A DEVICE U...
- Publication number 20240068572
- Publication date Feb 29, 2024
- Intel Corporation
- Paul DIGLIO
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
APPARATUS AND METHOD FOR CONTROLLING UNIT SPECIFIC JUNCTION TEMPERA...
- Publication number 20230288480
- Publication date Sep 14, 2023
- Intel Corporation
- Mahesh DESHMANE
- G01 - MEASURING TESTING
Information Patent Application
CONFORMABLE HEAT SINK INTERFACE WITH A HIGH THERMAL CONDUCTIVITY
- Publication number 20200146183
- Publication date May 7, 2020
- Intel Corporation
- Kelly Lofgreen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MODULAR THERMAL ENERGY MANAGEMENT DESIGNS FOR DATA CENTER COMPUTING
- Publication number 20190223324
- Publication date Jul 18, 2019
- Intel Corporation
- Minh Le
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM FOR THERMAL MANAGEMENT OF DEVICE UNDER TEST (DUT)
- Publication number 20180156863
- Publication date Jun 7, 2018
- Intel Corporation
- David Won-jun Song
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIRECT LIQUID-CONTACT MICRO-CHANNEL HEAT TRANSFER DEVICES, METHODS...
- Publication number 20150285857
- Publication date Oct 8, 2015
- Intel Corporation
- Christopher R. SCHROEDER
- G01 - MEASURING TESTING
Information Patent Application
Direct liquid-contact micro-channel heat transfer devices, methods...
- Publication number 20110109335
- Publication date May 12, 2011
- Christopher R. Schroeder
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Active thermal control using a burn-in socket heating element
- Publication number 20090002010
- Publication date Jan 1, 2009
- Anthony Yeh Chiing Wong
- G01 - MEASURING TESTING
Information Patent Application
Actively controlled embedded burn-in board thermal heaters
- Publication number 20080302783
- Publication date Dec 11, 2008
- Anthony Yeh Chiing Wong
- G01 - MEASURING TESTING

Christopher W. Ackerman

Person

Patents Grantslast 30 patents

System and apparatus having a seal member for sealing of a device u...

Apparatus and method for controlling unit specific junction tempera...

Conformable heat sink interface with a high thermal conductivity

Modular thermal energy management designs for data center computing

System for thermal management of device under test (DUT)

Direct liquid-contact micro-channel heat transfer devices, methods...

Direct liquid-contact micro-channel heat transfer devices, methods...

Direct liquid-contact micro-channel heat transfer devices, methods...

Active thermal control using a burn-in socket heating element

Patents Applicationslast 30 patents

ENHANCED JET IMPINGEMENT LEAK PREVENTION FOR INTEGRATED CIRCUIT

SYSTEM AND APPARATUS HAVING A SEAL MEMBER FOR SEALING OF A DEVICE U...

APPARATUS AND METHOD FOR CONTROLLING UNIT SPECIFIC JUNCTION TEMPERA...

CONFORMABLE HEAT SINK INTERFACE WITH A HIGH THERMAL CONDUCTIVITY

MODULAR THERMAL ENERGY MANAGEMENT DESIGNS FOR DATA CENTER COMPUTING

SYSTEM FOR THERMAL MANAGEMENT OF DEVICE UNDER TEST (DUT)

DIRECT LIQUID-CONTACT MICRO-CHANNEL HEAT TRANSFER DEVICES, METHODS...

Direct liquid-contact micro-channel heat transfer devices, methods...

Active thermal control using a burn-in socket heating element

Actively controlled embedded burn-in board thermal heaters