Christopher Wyland

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 12,027,465
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for circuit interconnects
- Patent number 11,937,368
- Issue date Mar 19, 2024
- OpenLight Photonics, Inc.
- Christopher Paul Wyland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal management with variable conductance heat pipe
- Patent number 11,653,477
- Issue date May 16, 2023
- Juniper Networks, Inc.
- Roberto Marcoccia
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 11,456,255
- Issue date Sep 27, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management with variable conductance heat pipe
- Patent number 11,051,431
- Issue date Jun 29, 2021
- Juniper Networks, Inc.
- Roberto Marcoccia
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Structure for circuit interconnects
- Patent number 10,999,923
- Issue date May 4, 2021
- Juniper Networks, Inc.
- Christopher Paul Wyland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 10,483,209
- Issue date Nov 19, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal heatsink
- Patent number 10,292,307
- Issue date May 14, 2019
- Juniper Networks, Inc.
- Christopher Paul Wyland
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Dynamic configuration of equivalent series resistance
- Patent number 9,377,802
- Issue date Jun 28, 2016
- Xilinx, Inc.
- Christopher P. Wyland
- G05 - CONTROLLING REGULATING
Information Patent Grant
Capacitors within an interposer coupled to supply and ground planes...
- Patent number 9,337,138
- Issue date May 10, 2016
- Xilinx, Inc.
- Khaldoon S. Abugharbieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
- Patent number 9,006,098
- Issue date Apr 14, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nanotube-based fluid interface material and approach
- Patent number 8,848,372
- Issue date Sep 30, 2014
- NXP B.V.
- Chris Wyland
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Integrated circuit nanotube-based subsrate
- Patent number 8,681,500
- Issue date Mar 25, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chris Wyland
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Carbon nanotube-based conductive connections for integrated circuit...
- Patent number 8,680,677
- Issue date Mar 25, 2014
- NXP B.V.
- Christopher Wyland
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method for transmission lines using meta-materials
- Patent number 8,451,072
- Issue date May 28, 2013
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power distribution network
- Patent number 8,410,579
- Issue date Apr 2, 2013
- Xilinx, Inc.
- Atul V. Ghia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanotube-based directionally-conductive adhesive
- Patent number 8,399,982
- Issue date Mar 19, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chris Wyland
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Enhanced substrate using metamaterials
- Patent number 8,237,516
- Issue date Aug 7, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chris Wyland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically enhanced wirebond package
- Patent number 8,203,219
- Issue date Jun 19, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chris Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High impedance electrical connection via
- Patent number 8,143,976
- Issue date Mar 27, 2012
- Xilinx, Inc.
- Christopher P. Wyland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and system for composite bond wires
- Patent number 8,134,073
- Issue date Mar 13, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chris Wyland
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Carbon nanotube bond pad structure and method therefor
- Patent number 7,872,352
- Issue date Jan 18, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chris Wyland
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Ground arch for wirebond ball grid arrays
- Patent number 7,217,997
- Issue date May 15, 2007
- NXP B.V.
- Chris Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal-conductive substrate package
- Patent number 6,778,398
- Issue date Aug 17, 2004
- Koninklijke Philips Electronics N.V.
- Chris Wyland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
TRACE WIDTH MODULATION
- Publication number 20250168971
- Publication date May 22, 2025
- Ampere Computing LLC
- Sammy HINDI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Impedance Controlled Electrical Interconnection Employing Meta-Mate...
- Publication number 20230020310
- Publication date Jan 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR CIRCUIT INTERCONNECTS
- Publication number 20210227685
- Publication date Jul 22, 2021
- Juniper Networks, Inc.
- Christopher Paul Wyland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL MANAGEMENT WITH VARIABLE CONDUCTANCE HEAT PIPE
- Publication number 20210227723
- Publication date Jul 22, 2021
- Juniper Networks, Inc.
- Roberto Marcoccia
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Impedance Controlled Electrical Interconnection Employing Meta-Mate...
- Publication number 20200083171
- Publication date Mar 12, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT WITH VARIABLE CONDUCTANCE HEAT PIPE
- Publication number 20200008321
- Publication date Jan 2, 2020
- Juniper Networks, Inc.
- Roberto Marcoccia
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
STRUCTURE FOR CIRCUIT INTERCONNECTS
- Publication number 20190335579
- Publication date Oct 31, 2019
- Juniper Networks, Inc.
- Christopher Paul Wyland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Impedance Controlled Electrical Interconnection Employing Meta-Mate...
- Publication number 20150221595
- Publication date Aug 6, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DISTRIBUTION NETWORK
- Publication number 20120139083
- Publication date Jun 7, 2012
- Xilinx, Inc.
- Atul V. Ghia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPEDANCE CONTROLLED ELECTRICAL INTERCONNECTION EMPLOYING META-MATE...
- Publication number 20120038054
- Publication date Feb 16, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Christopher Wyland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARBON NANOTUBE-BASED FILLER FOR INTEGRATED CIRCUITS
- Publication number 20110156255
- Publication date Jun 30, 2011
- Koninklijke Philips Electronics N.V.
- Chris Wyland
- B82 - NANO-TECHNOLOGY
Information Patent Application
HIGH IMPEDANCE ELECTRICAL CONNECTION VIA
- Publication number 20110095851
- Publication date Apr 28, 2011
- Xilinx, Inc.
- Christopher P. Wyland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Design Method for Transmission Lines Using Meta-Materials
- Publication number 20100131906
- Publication date May 27, 2010
- Christopher Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR COMPOSITE BOND WIRES
- Publication number 20090301757
- Publication date Dec 10, 2009
- Chris Wyland
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CARBON NANOTUBE-BASED CONDUCTIVE CONNECTIONS FOR INTEGRATED CIRCUIT...
- Publication number 20090212430
- Publication date Aug 27, 2009
- Koninklijke Philips Electronics N.V.
- Christopher Wyland
- B82 - NANO-TECHNOLOGY
Information Patent Application
INTEGRATED CIRCUIT NANOTUBE-BASED STRUCTURE
- Publication number 20090213551
- Publication date Aug 27, 2009
- Chris Wyland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
NANOTUBE-BASED DIRECTIONALLY-CONDUCTIVE ADHESIVE
- Publication number 20090127712
- Publication date May 21, 2009
- Koninklijke Philips Electronics N.V.
- Chris Wyland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICALLY ENHANCED WIREBOND PACKAGE
- Publication number 20090102067
- Publication date Apr 23, 2009
- NXP B.V.
- Chris Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nanotube-Based Fluid Interface Material and Approach
- Publication number 20090009973
- Publication date Jan 8, 2009
- NXP Semiconductors
- Chris Wyland
- B82 - NANO-TECHNOLOGY
Information Patent Application
Enhanced Substrate Using Metamaterials
- Publication number 20080266028
- Publication date Oct 30, 2008
- NXP B.V.
- Chris Wyland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Carbon Nanotube Bond Pad Structure and Method Therefor
- Publication number 20080211112
- Publication date Sep 4, 2008
- ZIMMER GMBH
- Chris Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ground arch for wirebond ball grid arrays
- Publication number 20060180916
- Publication date Aug 17, 2006
- Koninklijke Philips Electronics N.V.
- Chris Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High density package interconnect wire bond strip line and method t...
- Publication number 20060125079
- Publication date Jun 15, 2006
- Chris Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High density interconnect power and ground strap and method therefor
- Publication number 20060049505
- Publication date Mar 9, 2006
- Koninklijke Philips Electronics N.V.
- Chris Wyland
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal-conductive substrate package
- Publication number 20040080915
- Publication date Apr 29, 2004
- Koninklijke Philips Electronics N.V.
- Chris Wyland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Christopher Wyland

Person

Patents Grantslast 30 patents

Impedance controlled electrical interconnection employing meta-mate...

Structure for circuit interconnects

Thermal management with variable conductance heat pipe

Impedance controlled electrical interconnection employing meta-mate...

Thermal management with variable conductance heat pipe

Structure for circuit interconnects

Impedance controlled electrical interconnection employing meta-mate...

Thermal heatsink

Dynamic configuration of equivalent series resistance

Capacitors within an interposer coupled to supply and ground planes...

Impedance controlled electrical interconnection employing meta-mate...

Nanotube-based fluid interface material and approach

Integrated circuit nanotube-based subsrate

Carbon nanotube-based conductive connections for integrated circuit...

Method for transmission lines using meta-materials

Power distribution network

Nanotube-based directionally-conductive adhesive

Enhanced substrate using metamaterials

Electrically enhanced wirebond package

High impedance electrical connection via

Method and system for composite bond wires

Carbon nanotube bond pad structure and method therefor

Ground arch for wirebond ball grid arrays

Thermal-conductive substrate package

Patents Applicationslast 30 patents

TRACE WIDTH MODULATION

Impedance Controlled Electrical Interconnection Employing Meta-Mate...

STRUCTURE FOR CIRCUIT INTERCONNECTS

THERMAL MANAGEMENT WITH VARIABLE CONDUCTANCE HEAT PIPE

Impedance Controlled Electrical Interconnection Employing Meta-Mate...

THERMAL MANAGEMENT WITH VARIABLE CONDUCTANCE HEAT PIPE

STRUCTURE FOR CIRCUIT INTERCONNECTS

Impedance Controlled Electrical Interconnection Employing Meta-Mate...

POWER DISTRIBUTION NETWORK

IMPEDANCE CONTROLLED ELECTRICAL INTERCONNECTION EMPLOYING META-MATE...

CARBON NANOTUBE-BASED FILLER FOR INTEGRATED CIRCUITS

HIGH IMPEDANCE ELECTRICAL CONNECTION VIA

Design Method for Transmission Lines Using Meta-Materials

METHOD AND SYSTEM FOR COMPOSITE BOND WIRES

CARBON NANOTUBE-BASED CONDUCTIVE CONNECTIONS FOR INTEGRATED CIRCUIT...

INTEGRATED CIRCUIT NANOTUBE-BASED STRUCTURE

NANOTUBE-BASED DIRECTIONALLY-CONDUCTIVE ADHESIVE

ELECTRICALLY ENHANCED WIREBOND PACKAGE

Nanotube-Based Fluid Interface Material and Approach

Enhanced Substrate Using Metamaterials

Carbon Nanotube Bond Pad Structure and Method Therefor

Ground arch for wirebond ball grid arrays

High density package interconnect wire bond strip line and method t...

High density interconnect power and ground strap and method therefor

Thermal-conductive substrate package